Patent application number | Description | Published |
20120305606 | COMPACT CONTAINER HAVING AN AIRLESS PUMP - The present invention relates to a compact container having an airless pump, and more particularly, to a compact container for discharging cosmetic in preset amount when the pump is driven by pressing a button. The compact container having an airless pump, includes: a casing including an upper case and a lower case and accommodating cosmetics; a cylinder fixed to the inside of the lower case and having an annular outer wall downwardly extending from the rim, a depression formed at the center concentric with the outer wall, an opening formed at the lower side of the depression such that the opening communicates with the inner space of the outer wall; a plate upwardly spaced apart from the cylinder and having a discharging hole, formed at the center, through which the cosmetics is discharged, and a through-hole formed at a side thereof; an annular container piston elevating up and down along the inner circumference of the outer wall of the cylinder; an airless pump installed at the depression of the cylinder to discharge the cosmetics accommodated in the cylinder to the outside; and a button formed at the through-hole to operate the airless pump. | 12-06-2012 |
20130112314 | SPUIT TYPE COSMETIC CONTAINER - A spuit type cosmetics container includes a main container and a spuit having a spuit tube thread-coupled with the main container. The spuit includes a cap, an up/down button, an elastic member, and a cam encasing the up/down button. One of the up/down button and the cam includes a cam protrusion and the other includes an inclined guide guiding the cam protrusion in an inclined direction such that rotation of the cap is transformed into ascending/descending of the up/down button. The up/down button automatically descends to suction the cosmetics accommodated in the main container into the spuit tube beyond a preset rotation angle when the spuit is thread-coupled with the main container, and automatically ascends to keep the cosmetics suctioned in the spuit tube when the spuit is separated from the main container, resulting in convenient use. | 05-09-2013 |
20140251369 | ROTARY POWDER CONTAINER WITH BRUSH - The present invention relates to a rotary powder container with a brush, wherein powder is discharged through a brush of a powder discharge case by rotating an internal case containing powder in an external case. The internal case is able to be rotated in the external case, wherein powder is discharged into a brush when a plurality of discharge holes of a powder discharge case are in line with a plurality of discharge member holes of a powder discharge member if the internal case is rotated in the external case, and powder is not discharged into a brush when the plurality of discharge holes of the powder discharge case are not in line with the plurality of discharge member holes of the powder discharge member if the internal case is rotated in the external case. The present invention is convenient to use and has an elegant look. | 09-11-2014 |
20140361047 | AUTOMATIC FILLING UP SPUIT - An automatic filling up spuit ( | 12-11-2014 |
20150157110 | COMPASS-TYPE EYELINER - Disclosed is a compass-type eyeliner including the left and right members ( | 06-11-2015 |
20150223584 | COSMETICS CONTAINER - A cosmetics container according to the present invention is capable of preventing alien substances from being introduced into the discharge port by arranging the discharge port through which the cosmetics are discharged and the applying member for applying the cosmetics on a skin, which are located independent of each other. In addition, the cosmetics container according to the present invention is capable of preventing a space from being formed inside the discharge port and preventing air or alien substances from being introduced into a vessel containing the cosmetics since the piston is only moved upward by manipulation of a user while preventing the piston from being moved downward. | 08-13-2015 |
20150232240 | SPUIT-TYPE CONTAINER CAP FOR AUTOMATIC FILLING AND FIXED-AMOUNT DISPENSING - This invention relates to a spuit-type container cap for automatic filling and fixed-amount dispensing, which has an improved structure of sucking and dispensing cosmetics accommodated in a spuit-type cosmetics container into the inside of a spuit pipe when the cosmetics ere extracted in a spuit manner, so that a user can manipulate the spuit-type cosmetics container simply and conveniently. Thus, the present invention enables: the content accommodated in the container to be suck into the inside of the spuit pipe when the container cap including the spuit is released from the screw-coupled state with the container, and a fixed amount of the cosmetic content to be dispensed one drop by one drop when the upwardly protruded rubber button is pressed. | 08-20-2015 |
20150296968 | COSMETIC BRUSH - A cosmetic brush is provided, including a large brush having a large diameter; a small brush having a small diameter inserted into a center in the large brush; a large brush body connected to a lower end of the large brush; and a vertical operating member that operates the small brush so as to protrude to the center of the large brush by lowering the large brush body. | 10-22-2015 |
Patent application number | Description | Published |
20100226072 | SOLID CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire. | 09-09-2010 |
20110127689 | APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - An apparatus for manufacturing an electronic component includes: upper and lower metal molds, at least one of which being formed as a porous member on which an electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded. | 06-02-2011 |
20120120554 | CONDENSER ELEMENT, SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - There is provided a solid electrolytic capacitor, including: a condenser element including a chip body molded by sintering, a positive electrode terminal contact layer formed on one area of the chip body to be exposed to the outside, an insulating layer formed in the entire area or some area other than one area in which the positive electrode terminal contact layer is formed, and a negative electrode layer stacked on the insulating layer; a negative electrode extracting layer stacked to be electrically connected with the negative electrode layer; a negative electrode terminal stacked on the negative electrode extracting layer; a positive electrode terminal stacked on the positive electrode terminal contact layer. | 05-17-2012 |
20140043730 | TANTALUM CAPACITOR AND METHOD OF PREPARING THE SAME - There is provided a tantalum capacitor including: a capacitor body containing a tantalum powder and having a tantalum wire; a molded portion surrounding the tantalum wire and the capacitor body; an anode lead frame electrically connected to the tantalum wire; an cathode lead frame including a mounting portion having the capacitor body mounted thereon and a step formed on a lower surface thereof, and an cathode terminal portion bent at the mounting portion to be closely adhered to one end surface of the molded portion; and an adhesive layer formed between the one end surface of the molded portion and the cathode terminal portion. | 02-13-2014 |
20140152411 | INDUCTOR AND MANUFACTURING METHOD THEREOF - Disclosed herein are an inductor and a manufacturing method thereof. The manufacturing method of an inductor includes: positioning a printed circuit board (PCB) including a predetermined pattern formed thereon and an insertion part formed at one side thereof; fixing a protrusion part formed at a lower portion of a core so as to be inserted into the insertion part; electrically connecting both ends of a coil wound around the core to a lower PCB terminal disposed at a lower portion of the PCB, respectively; and forming an appearance so that the core, the coil, and an upper exposed surface of the PCB are received therein. | 06-05-2014 |
Patent application number | Description | Published |
20090187989 | System and method for controlling abnormal traffic based on fuzzy logic - A system for controlling abnormal traffic based on a fuzzy logic includes: an intrusion detection module for analyzing packets incoming from a network interface by means of a membership function defined based on a specific period of time, and outputting a fuzzy value representing a degree of a port scan attack; a fuzzy control module for recognizing the degree of the port scan attack based on the fuzzy value and outputting a control signal for traffic control according to the recognized degree of the port scan attack; and an intrusion blocking module for receiving the control signal and controlling the traffic with the network interface. | 07-23-2009 |
20090287755 | SEQUENCE SIMILARITY MEASURING APPARATUS AND CONTROL METHOD THEREOF - Disclosed is a sequence similarity measuring apparatus and a method of controlling the same. The sequence similarity measuring apparatus using dynamic programming includes: a matrix generating unit for generating a matrix based on the dynamic programming by using two sequences; a normalization unit for calculating a similarity reference value by inputting an element value of a last row/column of the matrix generated by the matrix generating unit into a normalization formula for a given sequence length; and a similarity measuring unit for measuring predefined sequence similarity between the two sequences, based on the similarity reference value calculated by the normalization unit. This makes it possible to easily and correctly achieve similarity comparison between multiple sequences, and thus this technology is expected to be widely utilized in biology/programming application fields. | 11-19-2009 |
20120182668 | SOLID ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD THEREOF - A solid electrolytic capacitor and manufacturing method, in which an oxidation-resistant coating layer configured to surround the surface of a terminal reinforcing material underlies a capacitor element. The solid electrolytic capacitor includes a capacitor element having a positive polarity internally and having one end to which an anode wire is inserted; a cathode leading-out layer; a pair of terminal reinforcing materials coupled with both bottom sides of the capacitor element; an oxidation resistant coating layer surrounding the surface of the pair of terminal reinforcing materials; a mold part surrounding the outer periphery of the capacitor element, while exposing the other end of the anode wire, the other side of the cathode leading-out layer, and the lower surfaces of the pair of terminal reinforcing materials; and anode and cathode terminals formed on both sides of the mold part and the lower surfaces of the terminal reinforcing materials. | 07-19-2012 |
Patent application number | Description | Published |
20110039480 | Polishing Pads Including Sidewalls and Related Polishing Apparatuses - A polishing pad may include a base and a plurality of polishing protrusions on a surface of the base. Each polishing protrusion may include a sidewall defining an opening in a surface of the polishing protrusion opposite the base. In addition, portions of the sidewall opposite the base may define a contact surface. | 02-17-2011 |
20120083189 | CHEMICAL MECHANICAL POLISHING APPARATUS HAVING PAD CONDITIONING DISK AND PRE-CONDITIONER UNIT - A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves. | 04-05-2012 |
20140094101 | CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER - This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same. | 04-03-2014 |
20150097251 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - Semiconductor devices may include a semiconductor substrate with a first semiconductor fin aligned end-to-end with a second semiconductor with a recess between facing ends of the first and second semiconductor fins. A first insulator pattern is formed adjacent sidewalls of the first and second semiconductor fins and a second insulator pattern is formed within the first recess. The second insulator pattern may have a top surface higher than a top surface of the first insulator pattern, such as to the height of the top surface of the fins (or higher or lower). First and second gates extend along sidewalls and a top surface of the first semiconductor fin. A dummy gate electrode may be formed on the top surface of the second insulator. Methods for manufacture of the same and modifications are also disclosed. | 04-09-2015 |
20150140900 | CMP APPARATUS - Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used. | 05-21-2015 |
20160064380 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - Semiconductor devices may include a semiconductor substrate with a first semiconductor fin aligned end-to-end with a second semiconductor with a recess between facing ends of the first and second semiconductor fins. A first insulator pattern is formed adjacent sidewalls of the first and second semiconductor fins and a second insulator pattern is formed within the first recess. The second insulator pattern may have a top surface higher than a top surface of the first insulator pattern, such as to the height of the top surface of the fins (or higher or lower). First and second gates extend along sidewalls and a top surface of the first semiconductor fin. A dummy gate electrode may be formed on the top surface of the second insulator. Methods for manufacture of the same and modifications are also disclosed. | 03-03-2016 |
Patent application number | Description | Published |
20090103326 | DISPLAY DEVICE HAVING LIGHT GUIDE UNIT - A light guide unit for a point light source includes a light incident portion, a first reflecting portion and a second reflecting portion. The light emitted from the point light source enters to the light incident portion. The light incident portion includes an optical pattern diffusing an incident light corresponding to the point light source. The first reflecting portion reflects a first light of the incident light. The second reflecting portion roundly connects the first reflecting portion to the light incident portion and reflects a second light of the incident light. | 04-23-2009 |
20090185103 | TWO-WAY BACKLIGHT ASSEMBLY AND TWO-WAY LILQUID CRYSTAL DISPLAY APPARATUS HAVING THE SAME - In a two-way backlight assembly and a two-way LCD apparatus, the two-way backlight assembly provides light emitted from one light source to a first direction where a main LCD panel is placed and to a second direction where a sub LCD panel is placed. Also, a sub mold part for receiving the sub LCD panel comprises a black-colored material so as to prevent reflection of the light. Accordingly, thickness and power consumption of the backlight assembly may be reduced and display quality may be also improved by preventing leakage of the light at ends of the sub LCD panel. | 07-23-2009 |
20100172155 | LIGHT GUIDE UNIT FOR POINT LIGHT SOURCE, BACKLIGHT ASSEMBLY HAVING THE LIGHT GUIDE UNIT AND DISPLAY DEVICE HAVING THE SAME - A light guide unit for a point light source includes a light incident portion, a first reflecting portion and a second reflecting portion. The light emitted from the point light source enters to the light incident portion. The light incident portion includes an optical pattern diffusing an incident light corresponding to the point light source. The first reflecting portion reflects a first light of the incident light. The second reflecting portion roundly connects the first reflecting portion to the light incident portion and reflects a second light of the incident light. | 07-08-2010 |
20150160034 | ROUTE GUIDANCE APPARATUS AND METHOD USING DRIVE LANE RECOGNITION - A route guidance apparatus includes a location information generator, a route configurer, a road lane configurer, a controller, and an output unit. The location information generator is configured to generate location information. The route configurer is configured to configure a drive route to a destination using the location information, map information, and traffic information. The road lane configurer is configured to photograph a drive lane on the drive route. The controller is configured to process data obtained from the road lane configurer and the route configurer. The output unit is configured to output guidance information of the drive lane. | 06-11-2015 |
20150161796 | METHOD AND DEVICE FOR RECOGNIZING PEDESTRIAN AND VEHICLE SUPPORTING THE SAME - A method and a device for recognizing a pedestrian and a vehicle supporting the same are provided. The method includes collecting, by a controller, a far-infrared image using a far-infrared imaging device and detecting a pedestrian candidate group from the far-infrared image. In addition, the method includes extracting, by the controller, pedestrian features based on previously normalized pedestrian database (DB) learning and comparing the pedestrian features with the pedestrian DB learning results to determine similarity. The controller is configured to perform pedestrian recognition based on the comparison result. | 06-11-2015 |
20150302591 | SYSTEM FOR DETECTING OBSTACLE USING ROAD SURFACE MODEL SETTING AND METHOD THEREOF - A system for detecting an obstacle includes an image acquisitor configured to acquire image data around a camera. An obstacle detector is configured to apply a road surface model using a horizon or a vanishing point to the image data and perform a sliding window on a road surface region to detect the obstacle. | 10-22-2015 |
20160112816 | APPARATUS AND METHOD FOR RECOGNIZING HORN USING SOUND SIGNAL PROCESSOR - An apparatus and a method for recognizing a horn using a sound signal processor are provided. The apparatus includes a data storage unit configured to acquire and store surrounding sound data and a sound signal processor configured to sample a sound signal within the sound data, perform signal conversion, and define and extract the frequency signals. In addition, a horn recognizer is configured to combine the extracted frequency signals, accumulate the frequency signals, and digitize a change rate of the accumulated frequency signals. Further, an output data determiner is configured to determine whether the digitized change rate of the frequency signals is equal to or greater than a threshold value to determine whether and when the horn is generated. | 04-21-2016 |
Patent application number | Description | Published |
20090253259 | Solder ball attachment jig and method for manufacturing semiconductor device using the same - Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes. | 10-08-2009 |
20100096749 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability. | 04-22-2010 |
20100288739 | LASER PROCESSING DEVICE - Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision. | 11-18-2010 |
20120164825 | SEMICONDUCTOR PACKAGE WITH A METAL POST AND MANUFACTURING METHOD THEREOF - Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability. | 06-28-2012 |