Patent application number | Description | Published |
20150308874 | AIRFLOW SENSOR - Provided is a gas flow sensor that includes a heat-sensitive element for measurement disposed inside a duct through which a gas to be measured flows and a support mechanism for supporting the heat-sensitive element for measurement inside the duct. The heat-sensitive element for measurement includes an insulating film; a thin film thermistor portion formed on the surface of the insulating film with a thermistor material; a pair of comb electrodes which have a plurality of comb portions and are pattern-formed on the thin film thermistor portion using a metal so as to face each other; and a pair of pattern electrodes which are pattern-formed on the surface of the insulating film and are connected to the pair of comb electrodes. The support mechanism is disposed such that the planar direction of the insulating film is parallel to the direction of gas flow in the duct. | 10-29-2015 |
20150315695 | METAL-NITRIDE THERMISTOR MATERIAL, MANUFACTURING METHOD THEREFOR, AND FILM-TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and a high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (Ti | 11-05-2015 |
20150325345 | METAL-NITRIDE THERMISTOR MATERIAL, MANUFACTURING METHOD THEREFOR, AND FILM-TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and a high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Cr | 11-12-2015 |
20150332817 | METAL-NITRIDE THERMISTOR MATERIAL, MANUFACTURING METHOD THEREFOR, AND FILM-TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and a high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Cr | 11-19-2015 |
20150337433 | METAL-NITRIDE THERMISTOR MATERIAL, MANUFACTURING METHOD THEREFOR, AND FILM-TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and a high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (Ti | 11-26-2015 |
20150362381 | TEMPERATURE SENSOR - Provided is a temperature sensor that includes a pair of lead frames, a sensor portion connected to the pair of lead frames, and an insulating holding portion which is fixed to the pair of lead frames and holds the lead frames. The sensor portion includes an insulating film having a strip shape, a thin film thermistor portion pattern-formed at the center portion of the surface of the insulating film, a pair of comb electrodes which have a plurality of comb portions and are pattern-formed on at least one of the top or the bottom of the thin film thermistor portion with facing each other and a pair of pattern electrodes, of which one end is connected to the pair of comb electrodes and the other end is connected to the pair of lead frames at both ends of the insulating film, pattern-formed on the surface of the insulating film, wherein the thin film thermistor portion is disposed on the distal end of the insulating film in a state of being bent into a substantially U-shape, and both ends of the insulating film are fixed to the pair of lead frames. | 12-17-2015 |
Patent application number | Description | Published |
20150023394 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which exhibits high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the metal nitride material for a thermistor, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Ti | 01-22-2015 |
20150036723 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which exhibits high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the metal nitride material for a thermistor, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: Ti | 02-05-2015 |
20150042445 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. | 02-12-2015 |
20150049788 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. | 02-19-2015 |
20150055682 | FILM-TYPE THERMISTOR SENSOR - Provided is a film-type thermistor sensor which can be surface-mounted and can be directly deposited on a film or the like without baking. The film-type thermistor sensor includes an insulating film; a thin-film thermistor part formed on the front side of the insulating film; the pair of front side pattern electrodes in which a pair of counter electrode parts facing each other is disposed above or below the thin-film thermistor part and is formed on the front side of the insulating film; and a pair of back side pattern electrodes formed on the back side of the insulating film in such a manner as to face a part of the pair of front side pattern electrodes, wherein the front side pattern electrodes and the back side pattern electrodes are electrically connected via via-holes formed so as to penetrate the insulating film. | 02-26-2015 |
20150061820 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. | 03-05-2015 |
20150061821 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. | 03-05-2015 |
20150071326 | TEMPERATURE SENSOR AND METHOD FOR PRODUCING SAME - Provided are a temperature sensor that is hard to increase resistance in the electrode structure with respect to a Ti—Al—N thermistor material layer even under a high-temperature environment, and has a high reliability with a high heat resistance as well as a method for producing the same. The temperature sensor includes an insulation substrate; a thin film thermistor portion formed on the insulation substrate; and a pair of pattern electrodes formed on the insulation substrate with a pair of opposed electrode portions being arranged so as to be opposed to each other on the thin film thermistor portion, wherein the thin film thermistor portion is made of a Ti—Al—N thermistor material, and the pair of pattern electrodes has a Ti—N bonding layer formed on the thin film thermistor portion and an electrode layer made of a noble metal formed on the bonding layer. | 03-12-2015 |
20150085898 | TEMPERATURE SENSOR - Provided is a temperature sensor which does not easily cause a crack in a Ti—Al—N-based thermistor material layer when the film is bent, can be directly deposited on a film or the like without firing, and has a high reliability with a high heat resistance. The temperature sensor includes an insulating film | 03-26-2015 |
20150092820 | METAL NITRIDE FILM FOR THERMISTOR, PROCESS FOR PRODUCING SAME, AND THERMISTOR SENSOR OF FILM TYPE - Provided are a metal nitride film for a thermistor, which has an excellent bending resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride film for a thermistor, which consists of a metal nitride represented by the general formula: Ti | 04-02-2015 |
20150226616 | TEMPERATURE SENSOR - The temperature sensor is provided with a pair of lead frames, a sensor portion connected to the pair of lead frames, and an insulating holding portion which is fixed to the pair of lead frames and holds the lead frames. The sensor portion is provided with an insulating film; a thin film thermistor portion formed as a pattern on the surface of the insulating film with a thermistor material; a pair of interdigitated electrodes formed as patterns having multiple comb portions and facing each other on the thin film thermistor portion; and a pair of pattern electrodes connected to the pair of interdigitated electrodes and formed as patterns on the surface of the insulating film. The pair of lead frames is extended and adhered to the surface of the insulating film disposing the thin film thermistor portion therebetween and is connected to the pair of pattern electrodes. | 08-13-2015 |
20150260586 | TEMPERATURE SENSOR - The temperature sensor includes an insulating film; a thin film thermistor portion which is formed on the surface of the insulating film with a thermistor material of TiAlN; the pair of interdigitated electrodes which have a plurality of comb portions and are pattern-formed on the thin film thermistor portion using a metal so as to face each other; and the pair of pattern electrodes which are pattern-formed on the surface of the insulating film and are connected to the pair of interdigitated electrodes, wherein at least a part of each of the pattern electrodes is formed of a conductive resin. | 09-17-2015 |
20160118165 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high heat resistance and a high reliability and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: V | 04-28-2016 |
20160125982 | METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR - Provided are a metal nitride material for a thermistor, which has a high heat resistance and a high reliability and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride material for a thermistor consists of a metal nitride represented by the general formula: (M | 05-05-2016 |
Patent application number | Description | Published |
20110033794 | TONER, METHOD FOR PRODUCING THE SAME, AND PROCESS CARTRIDGE - A toner containing a binder, a colorant, and a wax having a molecular chain consisting of C—H bond and C—C bond, wherein the mass reduction of the wax at 165° C. is 10% by mass or less, and the total amount of the wax in the toner measured by a DSC method is 1% by mass to 8% by mass, wherein a ratio, Sbet/SF, of a BET specific surface area (Sbet) of the toner to an average circularity (SF) of the toner is 1.0 m | 02-10-2011 |
20110151372 | TONER, IMAGE FORMING METHOD USING THE TONER, AND IMAGE FORMING APPARATUS USING THE TONER - A toner obtained by a toner production method which includes dissolving or dispersing in an organic solvent a toner material containing at least a calixarene derivative and a binder resin or a binder resin precursor, to thereby prepare a solution or dispersion liquid of the toner material, adding the solution or dispersion liquid to an aqueous medium for emulsification or dispersion, to thereby prepare an emulsion or dispersion liquid, and removing the organic solvent from the emulsion or dispersion liquid. | 06-23-2011 |
20110200928 | METHOD FOR PRODUCING TONER, TONER, AND IMAGE FORMING METHOD USING THE SAME - A method for producing a toner, including: dispersing toner particles containing at least a binder resin in a first aqueous medium so as to produce an aqueous dispersion; and subjecting the aqueous dispersion to heat treatment, wherein the electric conductivity of the aqueous dispersion after the heat treatment is higher than the electric conductivity of the aqueous dispersion before the heat treatment by 50 μS/cm or less. | 08-18-2011 |
20110294058 | TONER - A toner containing a wax, wherein the wax has a mass decrease at 165° C. of 10% by mass or less, a molecular chain consisting of C—H bonds and C—C bonds, and a penetration of 5 mm to 25 mm, wherein a product of a ½ method softening point (° C.) of the toner and an amount of the wax on a surface of the toner is 8 to 20, and wherein the toner is obtained by a method including emulsifying or dispersing in an aqueous medium a toner material liquid, which is a liquid containing a toner material, which contains the wax. | 12-01-2011 |
20120021347 | TONER, METHOD FOR FORMING TONER, DEVELOPER, AND IMAGE FORMING METHOD - To provide a toner A containing: base particles, each containing polyester, microcrystalline wax, and a colorant; and spherical silica particles having an average primary particle diameter of 100 nm to 150 nm, wherein the microcrystalline wax has an onset temperature of 45° C. to 60° C. as determined by DSC, and a carbon number distribution of 25 to 55. | 01-26-2012 |
20130130171 | TONER - A toner including a core particle, an inner shell layer covering the core, and an outer shell layer covering the inner shell layer is provided. The core particle includes a resin P. The inner shell layer includes fine particles of a resin A. The outer shell layer includes fine particles of a resin B. The toner satisfies the following formulae (1) to (3): | 05-23-2013 |
20130216944 | TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - A toner contains a binder resin, a colorant, and a releasing agent, wherein the toner contains toner particles, and wherein a proportion of the toner particles containing one or more voids having diameters D | 08-22-2013 |
20130224648 | ELECTROSTATIC IMAGE DEVELOPING TONER PARTICLES AND DEVELOPER - Electrostatic image developing toner particles including: a crystalline polyester resin; a non-crystalline polyester resin; a releasing agent; and a colorant, wherein the electrostatic image developing toner particles have a glass transition temperature of 40° C. to 60° C. where the glass transition temperature is measured with a differential scanning calorimeter (DSC), and wherein the electrostatic image developing toner particles have an adhesive force between the toner particles of 1.4 mN to 2.2 mN where the adhesive force between the toner particles is measured after the electrostatic image developing toner particles have been stored at 50° C. | 08-29-2013 |
20130243488 | TONER, TWO-COMPONENT DEVELOPER, AND IMAGE FORMING APPARATUS - A toner including: toner base particles; and external additive, the toner base particles each comprising binder resin and colorant, wherein the external additive comprises coalesced particles, the coalesced particles are each a non-spherical secondary particle in which primary particles are coalesced together, and an index of a particle size distribution of the coalesced particles is expressed by Formula (1): | 09-19-2013 |
20130244155 | TONER, TWO-COMPONENT DEVELOPER AND IMAGE FORMING APPARATUS - A toner including: toner base particles; and an external additive, the toner base particles each comprising a binder resin and a colorant, wherein the external additive comprises non-spherical particles and spherical particles, wherein the non-spherical particles are each a secondary particle in which spherical primary particles are coalesced together, and wherein the non-spherical particles and the spherical particles in the external additive satisfy a relationship expressed by the following formula (1): | 09-19-2013 |
20130244156 | TONER FOR DEVELOPING ELECTROSTATIC IMAGE, TWO-COMPONENT DEVELOPER AND IMAGE FORMING APPARATUS - A toner for developing an electrostatic image, including: toner base particles each including a binder resin and a releasing agent; and inorganic fine particles, wherein the toner includes the inorganic fine particles as an external additive on a surface of the toner base particle, wherein the toner base particles have a BET specific surface area of 2.5 m | 09-19-2013 |
20130244158 | TONER SET, DEVELOPER SET, AND IMAGE FORMING APPARATUS - A toner set, including: a transparent toner including a binder resin a, a releasing agent a and no colorant; and one or more color toners, each including a binder resin b, a colorant b and a releasing agent b, wherein the binder resin a includes a non-crystalline resin α and a crystalline resin α, the binder resin b includes a non-crystalline resin β and a crystalline resin β, the releasing agent a has an average particle diameter as a long diameter of 0.2 μm to 2.0 μm, and there is a relationship of 1 | 09-19-2013 |
20140072349 | DEVELOPING DEVICE AND IMAGE FORMING APPARATUS - A developing device, including: a developer bearing member, which is disposed opposite to an electrostatic latent image bearing member and which bears thereon a developer for developing an electrostatic latent image formed on the electrostatic latent image bearing member and conveys the developer to a developing region, wherein the developer includes a toner and a carrier, the toner containing: a toner base containing a binder resin and a colorant; and an external additive, wherein the external additive contains coalescent particles each made up of a plurality of coalescing primary particles, and wherein a work function Wc of the carrier and a work function Ws of the developer bearing member satisfy a relationship of the following formula (1): | 03-13-2014 |
20140140731 | TONER, DEVELOPER, IMAGE FORMING APPARATUS AND IMAGE FORMING METHOD - A toner including: a binder resin; a releasing agent; and a colorant, wherein the binder resin contains a crystalline polyester resin and a non-crystalline polyester resin, wherein the releasing agent has an endothermic peak temperature of 60° C. to 80° C. at the second temperature rising in differential scanning calorimetry, and wherein the releasing agent is an ester wax which satisfies the following expressions (1) and (2): 1.1 Pa·s≦η*a≦2.0 Pa·s . . . Expression (1) 0.001≦η*b/η*a≦1.00 . . . Expression (2) where in Expressions (1) and (2), η*a denotes a complex viscosity (Pa·s) determined by measuring a dynamic viscoelasticity of the releasing agent at a measurement frequency of 6.28 rad/s, and η*b denotes a complex viscosity (Pa·s) determined by measuring a dynamic viscoelasticity of the releasing agent at a measurement frequency of 62.8 rad/s. | 05-22-2014 |
20140220485 | TONER, DEVELOPER AND IMAGE FORMING APPARATUS - To provide a toner, which contains silica particles containing first silica particles, and second silica particles, wherein the toner is a toner produced by depositing the silica particles on surfaces of base particles, the first silica particles have an average primary particle diameter of 75 nm to 250 nm, the second silica particles have an average primary particle diameter of 10 nm to 50 nm, a mass ratio of the first silica particles to the base particles is 0.010 to 0.040, a mass ratio of the second silica particles to the base particles is 0.005 to 0.030, a liberation ratio of the silica particles from the toner by a ultrasonic vibration method is 5% by mass to 20% by mass, and an amount of particles having primary particle diameters of 30 nm or smaller in the silica particles librated from the toner by the ultrasonic vibration method is 20% by number or less. | 08-07-2014 |
20140234767 | ELECTROSTATIC CHARGE IMAGE DEVELOPING TONER - Provided is an electrostatic charge image developing toner, including: toner base particles including a polyester resin as a binder resin; and an external additive on the surface of the toner base particles. The external additive includes silica. The silica is produced by sol-gel method, and is aspherical. The percentage of change in the specific surface area of the toner when it is stored under high-temperature, high-humidity conditions is from 25% to 45%. | 08-21-2014 |
20140270874 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image bearing member; a charger; an irradiator; a development device having an accommodation unit to accommodate toner to obtain a visible image; a transfer device; and a fixing device to fix the visible image transferred onto a recording medium. The fixing device having a fixing rotation member; and a pressure rotation member to form a nipping portion by contacting the fixing rotation member, wherein the surface pressure of the nipping portion is 1.5 kgf/cm | 09-18-2014 |
20140348546 | TONER HOUSING CONTAINER AND IMAGE FORMING APPARATUS - Toner housing container includes: container body mountable on toner conveying device and housing toner supplied into toner conveying device; conveying portion provided in container body and conveying toner from longer direction one end of container body to other end at which container opening portion is provided; pipe receiving port provided at container opening portion and receiving conveying pipe fixed to toner conveying device; and uplifting portion to move toner conveyed by conveying portion toward toner receiving port of conveying pipe. Toner has loose apparent density of 0.28 g/cm | 11-27-2014 |
20150104739 | TONER, DEVELOPER, AND IMAGE FORMING APPARATUS - A toner, containing: toner base particles; and an external additive, the toner base particles each including a binder resin and a releasing agent, wherein the external additive includes non-spherical coalesced particles in each of which primary particles are coalesced together, and wherein the coalesced particles satisfy the following formula (1): Nx/1,000×100≦30% where Nx is a number of the primary particles present alone relative to 1,000 of the coalesced particles, as observed under a scanning electron microscope after stirring 0.5 g of the coalesced particles and 49.5 g of a carrier placed in a 50 mL bottle for 10 minutes by means of a mixing and stirring device at 67 Hz. | 04-16-2015 |
20150378272 | IMAGE FORMING METHOD, TONER, AND IMAGE FORMING APPARATUS - An image forming method is provided. The method includes the steps of forming an electrostatic latent image on a photoconductor; developing the electrostatic latent image into a toner image with a toner; transferring the toner image onto a recording medium having a smoothness of 20 s or less; and fixing the toner image on the recording medium. The toner exhibits an adhesion force of 100 gf or more, where the adhesion force is the maximum value of a pull force between a layer of the toner and standard paper determined by a tacking test with a probe temperature of 140° C. | 12-31-2015 |
Patent application number | Description | Published |
20080197280 | METHOD AND APPARATUS FOR MEASURING PATTERN DIMENSIONS - It is difficult for a material having low resistance to electron beam irradiation to obtain an electron microscopic image having a high S/N ratio. A conventional image smoothing process can improve stability of measurement, but this process has a problem of measurement errors for absolute values, reduction of sensitivity, deterioration of quality of cubic shape information and the like. In the present invention, by performing an image averaging process without deteriorating cubic shape information of a signal waveform in consideration of dimension deviation of a measurement target pattern, measurement stability is compatible with improvement of precision and sensitivity. Accordingly, it is possible to realize measurement of pattern dimensions and shapes with high precision and control of a highly sensitive semiconductor manufacturing process using the measurement. | 08-21-2008 |
20080319696 | Method and Its System for Calibrating Measured Data Between Different Measuring Tools - The present invention relates to a method and its system for calibrating measured data between different measuring tools. A method of calibrating measured data between different measuring tools includes the steps of: measuring the CD average dimension and roughness of an object to be measured using a CD-SEM tool; calculating the number of the cross section measurement points required for calibration by statistically processing the roughness; measuring the cross section of the object to be measured using the cross section measuring tool to satisfy the number of the cross section measurement points, thereby calculating the CD average dimension of the cross section measurement height specified in the obtained cross section measurement result; and calculating a calibration correction value being a difference between the CD average dimension of the object and the CD average dimension of the cross section measurement height of the object. | 12-25-2008 |
20090212215 | SCANNING ELECTRON MICROSCOPE AND METHOD OF MEASURING PATTERN DIMENSION USING THE SAME - In dimension measurement of semiconductor pattern by CD-SEM, the error value between dimensional measurement value and actual dimension on the pattern is much variational as it is dependent on the cross-sectional shape of the pattern, and a low level of accuracy was one time a big problem. In the present invention, a plurality of patterns, each different in shape, were prepared beforehand with AFM measurement result and patterns of the same shape measured by CD-SEM. These measurement results and dimensional errors were homologized with each other and kept in a database. For actual measurement of dimensions, most like side wall shape, and corresponding CD-SEM measurement error result are called up, and the called-up error results are used to correct CD-SME results of measurement object patterns. In this manner, it becomes possible to correct or reduce dimensional error which is dependent on cross-sectional shape of the pattern. | 08-27-2009 |
20120126116 | PATTERN SHAPE SELECTION METHOD AND PATTERN MEASURING DEVICE - The present invention has an object to propose a method and an apparatus for selecting a pattern shape, wherein, when estimating a shape based on comparison between an actual waveform and a library, the method and the apparatus can appropriately estimate the shape. As an embodiment to achieve the object, a method and an apparatus for selecting a pattern shape by comparing an obtained shape with pattern shapes memorized in the library are proposed, wherein plural pieces of waveform information are obtained under a plurality of waveform acquiring conditions based on radiation of a charged particle beam onto a specimen; and a pattern shape memorized in the library is selected by referring, with respect to the plural pieces of waveform information, to a library memorizing plural pieces of waveform information acquired under different waveform acquiring conditions for each of a plurality of pattern shapes. | 05-24-2012 |
20120181426 | Scanning Electron Microscope and a Method for Imaging a Specimen Using the Same - (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed. | 07-19-2012 |
20130195346 | METHOD AND APPARATUS FOR MONITORING CROSS-SECTIONAL SHAPE OF A PATTERN FORMED ON A SEMICONDUCTOR DEVICE - To enable SEM-based management of a cross-sectional shape or manufacturing process parameters of a semiconductor device pattern to be measured, the association between the shape or parameters and SEM image characteristic quantities effective for estimating the shape or parameters is saved as learning data. The image characteristic quantities are collated with learning data to estimate the shape or to monitor the process parameters. Accuracy and reliability is achievable by calculating three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and then judging whether additional learning is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability. | 08-01-2013 |
20140145078 | SCANNING ELECTRON MICROSCOPE AND A METHOD FOR IMAGING A SPECIMEN USING THE SAME - (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed. | 05-29-2014 |
Patent application number | Description | Published |
20100258233 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE - Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %. | 10-14-2010 |
20110074010 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. | 03-31-2011 |
20120298408 | SUBSTRATE FOR POWER MODULE AND POWER MODULE - A substrate for a power module comprises a substrate main body having a plate-shape, a first surface, which is one surface of the substrate main body and a mounting surface that a semiconductor device is mounted on, and a second surface, which is the other surface of the substrate main body and an insulation layer is formed on, wherein the substrate main body is made of a metal matrix composite plate composed of a metal matrix composite in which metal is filled into a carbonaceous material. | 11-29-2012 |
20130010429 | METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE - A method for producing a substrate for a power module with a heat sink includes a heat sink bonding step for bonding a heat sink to the surface of a second metal plate. The heat sink bonding step includes: a Cu layer forming step for forming a Cu layer on at least one of the surface of the second metal plate and a bonding surface of the heat sink; a heat sink laminating step for laminating the second metal plate and the heat sink via the Cu layer; a heat sink heating step for pressing in the lamination direction and heating the second metal plate and the heat sink, to diffuse Cu in the Cu layer into the second metal plate and the heat sink; and a molten metal solidifying step for solidifying the molten metal formed with Cu diffusion, to bond the second metal plate and the heat sink. | 01-10-2013 |
20130232783 | CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE - Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %. | 09-12-2013 |
20130335921 | SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE - Provided is a power module substrate including a ceramic substrate, and a metal plate which contains aluminum or an aluminum alloy, and which is stacked and bonded on a surface of the ceramic substrate, wherein one or more additional elements selected from Ag, Zn, Ge, Mg, Ca, Ga, and Li are solid-solubilized in the metal plate, and the Ag concentration in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.05% by mass and less than or equal to 10% by mass, or the total concentration of Zn, Ge, Mg, Ca, Ga, and Li in the metal plate in the vicinity of the interface with the ceramic substrate is greater than or equal to 0.01% by mass and less than or equal to 5% by mass. | 12-19-2013 |
20140015140 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. | 01-16-2014 |
20140192486 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities. | 07-10-2014 |
20150022977 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %. | 01-22-2015 |
20150034367 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE - A power module substrate including an insulating substrate, a circuit layer formed on one surface of the insulating substrate, and a metal layer formed on the other surface of the insulating substrate, wherein the circuit layer is composed of copper or a copper alloy, one surface of this circuit layer functions as an installation surface on which an electronic component is installed, the metal layer is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness t | 02-05-2015 |
20150035137 | SOLDER JOINT STRUCTURE, POWER MODULE, POWER MODULE SUBSTRATE WITH HEAT SINK AND METHOD OF MANUFACTURING THE SAME, AND PASTE FOR FORMING SOLDER BASE LAYER - There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member. | 02-05-2015 |
20150041188 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEATSINK, POWER MODULE, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE - A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding. | 02-12-2015 |
20150055302 | POWER MODULE SUBSTRATE WITH HEATSINK, POWER MODULE SUBSTRATE WITH COOLER AND POWER MODULE - A power module substrate with a heatsink includes: a power module substrate provided with a ceramic substrate, a circuit layer and a metal layer; and a heatsink bonded to the metal layer via a solder layer and composed of copper or a copper alloy. The metal layer is formed by bonding an aluminum plate in which the content of Al is 99.0 to 99.85% by mass to the ceramic substrate, and the solder layer is formed of a solid-solubilized-hardening type solder material including Sn as a major component and a solid-solubilized element being solid-solubilized into a matrix of Sn. | 02-26-2015 |
20150055303 | POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE WITH HEAT SINK - This power module substrate with a heat sink includes a power module substrate having a circuit layer disposed on one surface of an insulating layer, and a heat sink bonded to the other surface of this power module substrate, wherein the bonding surface of the heat sink and the bonding surface of the power module substrate are each composed of aluminum or an aluminum alloy, a bonding layer ( | 02-26-2015 |
20150208496 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE - This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate | 07-23-2015 |
20150251382 | BONDING STRUCTURE OF ALUMINUM MEMBER AND COPPER MEMBER - A bonding structure of an aluminum member and a copper member includes: the aluminum member composed of aluminum or an aluminum alloy, and the copper member composed of copper or a copper alloy in which the aluminum member and the copper member are bonded together by solid phase diffusion bonding; an intermetallic compound layer that is made of copper and aluminum and is formed in a bonding interface between the aluminum member and the copper member; and an oxide dispersed in an interface between the copper member and the intermetallic compound layer in a layered form along the interface. | 09-10-2015 |
20150255419 | SEMICONDUCTOR DEVICE AND CERAMIC CIRCUIT SUBSTRATE, AND PRODUCING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device comprises a circuit layer composed of a conductive material, and a semiconductor element mounted on the circuit layer, wherein an underlayer having a porosity in the range of 5 to 55% is formed on one surface of the circuit layer, a bonding layer composed of a sintered body of a bonding material including an organic substance and at least one of metal particles and metal oxide particles is formed on the underlayer, and the circuit layer and the semiconductor element are bonded together via the underlayer and the bonding layer. | 09-10-2015 |
20150282379 | HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE, AND METHOD FOR PRODUCING HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE - A heat-sink-attached-power module substrate ( | 10-01-2015 |
20150313011 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY - A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate ( | 10-29-2015 |
20150319876 | POWER MODULE - In a power module according to the present invention, a copper layer composed of copper or a copper alloy is provided at a surface of a circuit layer onto which a semiconductor element is bonded, and a solder layer formed by using a solder material is formed between the circuit layer and the semiconductor element. An alloy layer containing Sn as a main component, 0.5% by mass or more and 10% by mass or less of Ni, and 30% by mass or more and 40% by mass or less of Cu is formed at the interface between the solder layer and the circuit layer, the thickness of the alloy layer is set to be within a range of 2 μm or more and 20 μm or less, and a thermal resistance increase rate is less than 10% after loading a power cycles 100,000 times under a condition where an energization time is 5 seconds and a temperature difference is 80° C. in a power cycle test. | 11-05-2015 |
20150319877 | POWER MODULE - A power module is provided with a copper layer composed of copper or a copper alloy on a surface of a circuit layer to which a semiconductor device is bonded, and a solder layer that is formed by using a solder material is formed between the circuit layer and the semiconductor device. An average crystal grain size which is measured by EBSD measurement in a region having a thickness of up to 30 μm from the surface of the circuit layer in the solder layer is 10 μm or less, the solder layer has a composition that contains Sn as a main component, 0.01 to 1.0% by mass of Ni, and 0.1 to 5.0% by mass of Cu, and a thermal resistance increase rate when a power cycle is loaded 100,000 times is less than 10% in a power cycle test. | 11-05-2015 |
20150366048 | POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE - The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding. | 12-17-2015 |
20160035660 | BONDING BODY, POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE - A bonding body includes: an aluminum member composed of aluminum; and a metal member composed of any one of copper, nickel, and silver, wherein the aluminum member and the metal member are bonded together. In a bonding interface between the aluminum member and the metal member, a Ti layer and an Al—Ti—Si layer are formed, the Ti layer being disposed at the metal member side in the bonding interface, and the Al—Ti—Si layer being disposed between the Ti layer the aluminum member and containing Si which is solid-solubilized into Al | 02-04-2016 |
Patent application number | Description | Published |
20080248326 | AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL - A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%. | 10-09-2008 |
20090229864 | INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK - An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b≦1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy. | 09-17-2009 |
20100230473 | Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL - A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%. | 09-16-2010 |
20100285331 | METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE, AND POWER MODULE - A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified. | 11-11-2010 |
Patent application number | Description | Published |
20080227001 | IMAGE FORMING METHOD AND PROCESS CARTRIDGE - An image forming method, including recharging untransferred toner remaining on a latent electrostatic image bearing member by using a recharging member to remove the untransferred toner from the latent electrostatic image bearing member, wherein the recharging member is a conductive member a surface of which has a contact angle of 108° or more with pure water and a Shore D hardness of 50 to 65; the coverage of the surface of the toner by an external additive is 150% or less; and a releasing agent peak ratio obtained by ATR method is 0.02 to 0.1. | 09-18-2008 |
20080273898 | IMAGE FORMING APPARATUS - An image forming apparatus that is more capable of preventing the occurrence of image quality deterioration caused by defective charging of a photoreceptor than the conventional one. As a charging device, there is used a member which has: a conductive sheet that causes the surface thereof applied with a predetermined bias to abut against the surface of the photoreceptor after passing through a primary transfer nip obtained by abutment between the photoreceptor and an intermediate transfer belt and before entering a development step performed by a developing device; a conductive brush member that applies a predetermined bias to the surface of the photoreceptor obtained after passing through the position of abutment with the sheet and before entering the development step; and a charging roller that uniformly charges the surface of the photoreceptor after passing through the position of abutment with the brush and before entering the development step. Furthermore, at least during a predetermined first period, a bias having a polarity same as the uniformly charging polarity of the photoreceptor is applied to the conductive sheet and brush member. | 11-06-2008 |
20090028606 | PROCESS CARTRIDGE AND IMAGE FORMING APPARATUS INCLUDING SAME - A process cartridge includes a latent image carrier, a charging unit, a latent image forming unit, a developing unit, a transfer unit, a rotary brush contacting a curved surface of the latent image carrier to form a nip, and a brush housing including a first tip and a second tip, covering the rotary brush such that a place where the rotary brush contacts the latent image carrier is opened. A downstream end of the nip where the rotary brush contacts the latent image carrier in the rotation direction of the rotary brush is not higher than a center of curvature of the latent image carrier where the rotary brush contacts, and the first tip of the brush housing is downstream of the rotary brush, further toward the latent image carrier than a tangent to the surface of the latent image carrier at the downstream end of the nip. | 01-29-2009 |
20090067887 | IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND DEVELOPING DEVICE - An image forming apparatus includes a plurality of image carriers, a latent image forming unit, and a plurality of developing units. Each of the developing unit forms an image to have a color difference of equal to or less than about five with respect to an initial unicolor image formed by using a toner not containing a reversely-transferred toner of another color when a toner contained in a toner container is consumed by about 70%. | 03-12-2009 |
20120045254 | DEVELOPER REGULATOR, DEVELOPMENT DEVICE, AND IMAGE FORMING APPARATUS INCORPORATING SAME - A developer regulator to restrict an amount of a developer, including a base portion; an intermediate portion continuous with the base portion, the intermediate portion having a flat area on one face, the flat area having a roughened surface; and a distal end continuous with the intermediate portion, the distal end being bent relative to the base portion in a direction opposite the one face in which the flat area is formed. | 02-23-2012 |
20130058670 | IMAGE DEVELOPING DEVICE, PROCESS CARTRIDGE INCLUDING IMAGE DEVELOPING DEVICE, AND IMAGE FORMING DEVICE INCLUDING IMAGE DEVELOPING DEVICE - An image developing device includes a developer supporting body; a first conveyance path in which a first conveyance member is arranged; a second conveyance path in which a second conveyance member is arranged; and a partition member that partitions the first conveyance path and the second conveyance path and that has a first communication port and a second communication port. The first communication path and the second communication path communicates with each other through the first communication port and the second communication port. The image developing device includes a developer amount detection unit that includes an optical detection unit arranged in the second conveyance path and that optically detects an amount of the developer in the image forming device. The developer is caused to accumulate in the vicinity of the developer amount detection unit. | 03-07-2013 |
20130142530 | IMAGE FORMING APPARATUS - An image forming apparatus includes a rotatable photoconductor, a charging unit, an exposure unit to expose the photoconductor to reduce an electrical potential at the photoconductor, a developing unit to charge the toner held on a toner bearing member with friction and attract the toner to the exposed portion on the photoconductor by supplying a development voltage from a first power source and using an electrical potential difference between the toner bearing member and the photoconductor in the development area, a reverse development voltage controller to supply a reverse development voltage while a non-charged portion on the photoconductor passes the development area, and a developer reducing potential applier to supply a development restraining potential and an absolute value smaller than a target charging potential to the photoconductor while the reverse development voltage is supplied. | 06-06-2013 |
20130195487 | COLOR IMAGE FORMING APPARATUS - Provided is a color image forming apparatus that includes: image carriers that form toner image of black and other colors; an intermediate transfer body that makes contact with the image carriers; and transfer units that transfer the toner images on the image carriers to the intermediate transfer body. A line velocity difference is set between the image carriers and the intermediate transfer body. An accelerated cohesion degree of toner is equal to or larger than 54%. A linear velocity difference X | 08-01-2013 |
20130236217 | DEVELOPMENT DEVICE, AND IMAGE FORMING APPARATUS AND PROCESS UNIT INCORPORATING SAME - A development device to develop a latent image using developer having a degree of agglomeration of 54% or greater includes a developer bearer to carry developer thereon, and a developer supply member to contact the developer bearer to supply developer to a surface of the developer bearer. The developer supply member is disposed to satisfy at least one of two conditions: a biting amount of the developer supply member relative to the developer bearer is 0.7 mm or greater; and a contact pressure of the developer supply member against the developer bearer is 30 N/m or greater. | 09-12-2013 |
20130266332 | IMAGE FORMING APPARATUS AND IMAGE FORMING METHOD - An image forming apparatus including a latent image bearing member, a charger, a latent image forming device, a developing device, and a transfer device is provided. The transfer device is adapted to transfer a toner image formed on the latent image bearing member onto an intermediate transfer member or a recording medium by action of a transfer elected field in a transfer position where the latent image bearing member faces the transfer device. When a non-charged portion of the latent image bearing member that has not been charged to a predetermined potential by the charger passes through the transfer position, a strength of the transfer electric field is lowered than that in transferring the toner image. | 10-10-2013 |
20140161471 | IMAGE FORMING APPARATUS - An image forming apparatus includes a latent image forming device that forms a latent image, a latent image carrier that carries the latent image, a development device that develops the latent image, and a controller. The development device includes a developer carrier that faces the latent image carrier and carries toner on a rotary surface thereof that rotates in a rotation direction perpendicular to a width direction of the developer carrier, and a regulation member that regulates the thickness of a layer of the toner on the surface of the developer carrier. The controller moves the toner on lateral end regions in the width direction of the surface of the developer carrier toward the latent image carrier. The end regions are located outside a maximum image forming region within a regulation member facing region of the surface of the developer carrier facing the regulation member. | 06-12-2014 |
20150192882 | SEAL, CLEANING UNIT WITH SEAL, TRANSFER UNIT WITH SEAL, DEVELOPING UNIT WITH SEAL, PROCESS CARTRIDGE WITH SEAL, IMAGE FORMING APPARATUS WITH SEAL, AND IMAGE FORMING METHOD - A seal is provided to contact a rotating body installed in an image forming apparatus. Pencil hardness of the sealing element is about | 07-09-2015 |