Patent application number | Description | Published |
20120283683 | Diaper - A diaper includes first and second sheets having elastic strings, and a crotch section with an absorbent body connected to the first and second sheets. The first sheet includes two first margins, each of which is contiguous to one of first outermost edges, and a first notch that is indented inwardly from one of the first outermost edges to extend inwardly through and beyond the adjacent first margin. The second sheet includes two second outermost edges, two second margins. The second margins are thermal bonded respectively to the first margins to form thermal seams. The first notch forms a first opening contiguous to one of the thermal seams to provide good ventilation and to ease tearing of the diaper at the thermal seam. | 11-08-2012 |
20140023822 | SHAPED SHEET LAMINATE, METHOD AND APPARATUS FOR MANUFACTURING THE SAME - There are provided a shaped sheet laminate that is adapted for an absorbent article and that has a specific structure to enhance the absorbing effect of the absorbent article, a method for manufacturing the shaped sheet laminate, and a shaping apparatus adapted to manufacture the shaped sheet laminate. The shaping apparatus includes a first roller having a rolling surface, a plurality of indentations that are indented from the rolling surface, a plurality of annular inner wall surfaces respectively defining the indentations, and a plurality of suction holes that are in air communication the respective indentations. Each of the annular inner wall surfaces has an annular outer edge that meets the rolling surface. | 01-23-2014 |
20140141677 | Non-Woven Fabric and Method for Fabricating the Same - A non-woven fabric includes a filament fiber web and a composite fiber web that is entangled with the filament fiber web and that includes composite staple fibers and cellulose fibers. The composite staple fibers and the cellulose fibers are fusion-bonded together. A method of fabricating a non-woven fabric includes: (a) air laying and thermally treating composite staple fibers and cellulose fibers so as to form a composite fiber web, the composite staple fibers and the cellulose fibers in the composite fiber web being fusion-bonded together, and (b) disposing the composite fiber web between two filament fiber webs followed by subjecting to water-jet treatment such that the composite fiber web and the filament fiber webs are entangled with each other. | 05-22-2014 |
20140221952 | SANITARY ARTICLE AND METHOD FOR MAKING THE SAME - A sanitary article includes an absorbent pad including an upper sheet layer, a lower sheet layer, and a pulp-and-SAP powder layer combination. The powder layer combination is constituted by alternate layers of pulverized pulp and superabsorbent polymer (SAP) powder. A method for making the sanitary article is also disclosed. | 08-07-2014 |
20150028520 | METHOD FOR MAKING A FEMALE MEMBER OF A HOOK-AND-LOOP FASTENER - A method for making a female member of a hook-and-loop fastener includes the steps of: (a) bonding together a base layer and a surface layer, that is formed from a fiber material and that is superimposed on the base layer, by applying heat to the surface layer so that fibers of the surface layer are curled; and (b) immediately after step (a), subjecting the surface layer to a rapid cooling treatment so as to set the curled fibers of the surface layer. | 01-29-2015 |
20150065003 | NONWOVEN FABRIC COMPOSITE AND METHOD FOR MAKING THE SAME - A nonwoven fabric composite includes a spunbond nonwoven fabric layer having a plurality of bonded fibers, an air-laid nonwoven pulp web layer having a plurality of pulp fibers and overlying the spunbond nonwoven fabric layer to cooperatively form an inner laminate with the pulp web layer, and a pair of nonwoven carded fiber web layers each having a plurality of carded fibers. The nonwoven carded fiber web layers sandwich the inner laminate therebetween. The bonded fibers, the pulp fibers, and the carded fibers are entangled with one another. A ratio of tensile strength of the nonwoven fabric composite in a machine direction to tensile strength of the nonwoven fabric composite in a cross-machine direction is not greater than 4. | 03-05-2015 |
Patent application number | Description | Published |
20120186060 | MANUFACTURING METHOD OF AN IRON-TYPE GOLF CLUB HEAD - A manufacturing method of an iron-type golf club head has acts of: forming a blank for an iron-type club head with a raw material selected from the group of medium-carbon and low-carbon steel, wherein the blank has a striking face integrally-formed; heating a center of the striking face on the blank to a predetermined quenching temperature; quenching the blank to cool down the blank rapidly to form a hardened layer, wherein a hardness of the striking face gradually decreases radially from the center to a periphery of the striking face; machining the striking face to form multiple grooves, and surface treating the blank to accomplish the iron-type golf club head. Therefore, the iron-type golf club head has a softer head body and a harder striking face to have the inclined angles of the hosels easily adjusted, as well as high resistance of the striking face. | 07-26-2012 |
20130281229 | WOOD GOLF CLUB HEAD - A wood golf club head has a sole plate, a crown, a strike face and a hosel that are all made of metal and are welded together. The sole plate is formed by forging to have different thicknesses at different parts and has a weight formed as a thicker part of the sole plate. Therefore, when the wood golf club head is manufactured, the shape, the size and the position of the weight is precisely set based on the design of the wood golf club head. Then the gravity center of the wood golf club head is accurately determined. Moreover, since the weight is directly formed on the sole plate without any gaps and the shape of the weight is simple and smooth, the wood golf club head performs a clear and pleasing striking sound while it strikes. | 10-24-2013 |
20140123471 | MANUFACTURING METHOD OF AN INTEGRALLY FORGED GOLF CLUB HEAD - A manufacturing method of an integrally forged golf club head has acts of forging a crude rod to form a blank of a main body of a golf club head, mounting a weight in a mounting recess of the blank of the main body of the golf club head, covering the mounting recess with an outer cover, and then welding and forging the blank of the main body of the golf club head and the outer cover to form a golf club head. Thus, the at least one weight is securely held in the golf club head and does not come off the golf club head, and also no noise occurs when the golf club head strikes a golf ball. Furthermore, the at least one weight is not exposed so that the golf club head has a good appearance and improved quality. | 05-08-2014 |
20140141698 | SURFACE TREATING METHOD FOR A GOLF CLUB HEAD - A surface treating method for a golf club head made of carbon steel basically has one nitriding step and two oxidizing steps. The method further has polishing, sandblasting and rinsing steps and so on processed prior to or between the basic steps, and then has polishing and oil immersing steps and so on processed after the basic steps. The finished golf club head has uniform dark appearance and also has good corrosion resistance and abrasion resistance. Furthermore, the surface of the finished golf club head does not peel off. Moreover, the method also has advantages including low pollution and low cost. | 05-22-2014 |
20150011326 | STRIKE PLATE OF A GOLF CLUB HEAD - A strike plate of a golf club head has a striking zone and an elastic annular part defined around the striking zone and adjacent to the edge of the strike plate. Multiple annular grooves are formed in the elastic annular part on the rear face of the strike plate and are arranged at intervals. Multiple annular flanges are formed on the rear face. Each annular flange is formed between two adjacent annular grooves. The elastic annular part with multiple thicker and thinner parts alternately arranged provides elasticity as a spring. Therefore, when any part of the striking zone of the strike plate is stricken on the golf ball, the elastic annular part generates a sufficient elastic effect to effectively enlarge the sweet spot on the strike plate. | 01-08-2015 |
20150031471 | Iron Golf Club Head - An iron golf club head has a strike plate mounted securely in a front face of a head body. The head body has a sealed cavity formed in back of the strike plate so that only the peripheral edge of the strike plate is connected to the head body. When the iron golf club head strikes the golf ball, the strike plate deforms to independently bear the striking force and the cavity provides room to receive the deformation of the strike plate. Therefore, the rebounding effect is enhanced when the iron golf club head hits the golf ball. | 01-29-2015 |
20150047747 | SURFACE TREATING METHOD FOR A GOLF CLUB HEAD - A surface treating method for a golf club head made of carbon steel basically has one nitriding step and two oxidizing steps. The method further has polishing, sandblasting and rinsing steps and so on processed prior to or between the basic steps, and then has polishing and oil immersing steps and so on processed after the basic steps. The finished golf club head has uniform dark appearance and also has good corrosion resistance and abrasion resistance. Furthermore, the surface of the finished golf club head does not peel off. Moreover, the method also has advantages including low pollution and low cost. | 02-19-2015 |
20150290503 | TOP CROWN OF A GOLF CLUB HEAD - A top crown of a golf club head has a crown body and multiple reinforcing ribs formed on at least one of an inner surface and an outer surface of the crown body. The reinforcing ribs are arranged as a mesh including multiple grids. The top crown can be hot forged to form the meshed reinforcing ribs. With the meshed reinforcing ribs on the top crown, a thickness of the crown body of the top crown can be appropriately reduced and the strength of the crown body is enhanced by the reinforcing ribs. Accordingly, elasticity of the top crown of the golf club head is increased and the top crown has low center of gravity. | 10-15-2015 |
Patent application number | Description | Published |
20130171766 | Annealing Methods for Backside Illumination Image Sensor Chips - A method includes performing a grinding on a backside of a semiconductor substrate. An image sensor is disposed on a front side of the semiconductor substrate. An impurity is doped into a surface layer of the backside of the semiconductor substrate to form a doped layer. A multi-cycle laser anneal is performed on the doped layer. | 07-04-2013 |
20130193539 | Method for Increasing Photodiode Full Well Capacity - A backside illuminated CMOS image sensor comprises an extended photo active region formed over a substrate using a first high energy ion implantation process and an isolation region formed over the substrate using a second high energy ion implantation process. The extended photo active region is enclosed by the isolation region, which has a same depth as the extended photo active region. The extended photo active region helps to increase the number of photons converted into electrons so as to improve quantum efficiency. | 08-01-2013 |
20130207220 | Image Sensor Cross-Talk Reduction System and Method - A system and method for reducing cross-talk between photosensitive diodes is provided. In an embodiment an isolation region comprising a first concentration of dopants is located between the photosensitive diodes. The photosensitive diodes have a second concentration of dopants that is less than the first concentration of dopants, which helps to prevent diffusion from the photosensitive diodes to form a potential path for undesired cross-talk between the photosensitive diodes. | 08-15-2013 |
20130230941 | Implanting Method for Forming Photodiode - An implanting method for forming a photodiode comprises providing a substrate with a first conductivity, growing an epitaxial layer on the substrate, implanting ions with a second conductivity in the epitaxial layer from a front side of the substrate and implanting ions with the first conductivity in the epitaxial layer from the front side of the substrate to form a photo active region adjacent to the front side and a photo inactive region underneath the photo active region. By employing the implanting method, an average doping density of the photo active region is approximately ten times more than an average doping density of the photo inactive region. | 09-05-2013 |
20150262823 | Conformity Control for Metal Gate Stack - A method includes forming a dummy gate stack over a semiconductor substrate, wherein the semiconductor substrate is comprised in a wafer. The method further includes removing the dummy gate stack to form a recess, forming a gate dielectric layer in the recess, and forming a metal layer in the recess. The metal layer is over the gate dielectric layer. The formation of the metal layer includes placing the wafer against a target, applying a DC power to the target, and applying an RF power to the target, wherein the DC power and the RF power are applied simultaneously. A remaining portion of the recess is then filled with metallic materials, wherein the metallic materials are overlying the metal layer. | 09-17-2015 |
Patent application number | Description | Published |
20130250221 | DISPLAY DEVICE - A display device including an active device array substrate having an active surface, an opposite substrate, a first alignment unit, a second alignment unit, a liquid crystal layer and a sealant is provided. The opposite substrate disposed above the active device array substrate has a light transmissive surface, wherein the active surface and the light transmissive surface face each other. The first alignment unit is disposed on the active device array substrate and located on the active surface. The second alignment unit is disposed on the opposite substrate and located on the light transmissive surface, wherein the first alignment unit aligns with the second alignment unit. The liquid crystal layer is disposed between the first and the second alignment units. The sealant directly connects the active surface and the light transmissive surface, and surrounds peripherals of the liquid crystal layer, the first alignment unit, and the second alignment unit. | 09-26-2013 |
20150210538 | MEMS PACKAGE STRUCTURE - A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid. | 07-30-2015 |
20150284241 | MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided. | 10-08-2015 |
Patent application number | Description | Published |
20120032127 | ASSISTANCE MECHANISM FOR ASSISTING PATIENTS TO STAND UP - An assistance mechanism includes a base, a rotatable link, a lifting unit and a power unit which provides power to the lifting unit so that the lifting unit drives the rotatable link. A seat is connected to the rotatable link so that when the rotatable link is activated, the user sitting on the seat is transformed from a sit status into a stand status. This effectively assists the user who does not have sufficient muscle forces to stand up by the assistance mechanism. | 02-09-2012 |
20120035512 | UPPER LIMBS REHABILITATION DEVICE - An upper limbs rehabilitation device includes a main body, a rail, a movable member and a grip, wherein the main body has a first link and a second link pivotably connected to the first link. The rail is connected to the second link. The user holds the grip that is pivotably connected to the movable member and swings the upper limb to move the movable member along the rail so as to exercise the upper limb in multiple degrees of freedom. | 02-09-2012 |
20140128984 | ARTIFICIAL IMPLANT FOR CARPOMETACARPAL JOINT - An artificial implant for a carpometacarpal (CMC) joint used for replacing a CMC joint surface of the first metacarpal bone is provided and includes: an insert portion having an inserting end for inserting into a bone marrow cavity exposed from an incision of the first metacarpal bone, and a front end; an articular replacement portion connected to the front end of the inserting portion and disposed outside the incision of the first metacarpal bone, and having an articular profile surface to replace the CMC joint surface of the first metacarpal bone; and an attached flange protruded from a peripheral of the articular replacement portion, attached to an outer bone surface of the first metacarpal bone adjacent to the incision, and having at least one suture hole, through which at least one suture passes for assisting to fix an abductor pollicis longus (APL) to the outer bone surface. | 05-08-2014 |
20150085293 | Portable system for simultaneously operating optical far field imaging, tomography and spectroscopy - A portable optical tomography design for performing elastographic deformation mapping of tissues comprises a coherence light source providing one light beam; a scanning microscope comprising a waveguide having two terminals, a coupler disposed on one terminal, an actuating member connected to the waveguide or the coupler, a first optical reflection member, a beam splitter, and a Fourier-domain spectrometer. The waveguide is actuated by the actuator to traverse a horizontal and vertical motion to prescribe a two-dimensional plane for scanning the tissue sample. Optical fiber is used to connect above elements therebetween. The Fourier-domain spectrometer is coupled with the beam splitter and comprises a second reflection member and an interferogram capturing member. An interferogram produced from the Fourier-domain spectrometer is carried over to a digital signal processor and subsequently an optical coherence tomography image device to generate a three-dimensional image for the scanned tissue. | 03-26-2015 |
20150105778 | BONE FIXATION PLATE - A bone fixation plate for fixing a fracture part of a bone is disclosed and can stably fix on a surface of a bone. The bone fixation plate has a protruding curved face, an indentation curved face and two rows of through holes. The protruding curved face has a blank portion and two binding portions. A suture is retained in the through holes formed close to two end edges of the binding portions, so that the stability of the bone fixation plate is improved. | 04-16-2015 |
Patent application number | Description | Published |
20100073787 | PIEZOELECTRIC-DRIVING OPTICAL LENS - A piezoelectric-driving optical lens is disclosed, which comprises: a lens, having a barrel with a friction ring annularly mounted on the outer wall of the barrel as the outer diameter of the friction ring is larger than that of the barrel; a plurality of piezoelectric stators, arranged surrounding the lens and abutted against the friction ring, for providing a rotation driving force to the lens for focusing or zooming function; and a seat, for receiving the lens and the plural piezoelectric stators; wherein, the plural piezoelectric stators can actuate simultaneously to output a maximum driving torque. | 03-25-2010 |
20120154882 | OPTICAL SCANNING PROJECTION SYSTEM - An optical scanning projection system includes a scanning light source component, a second reflecting element, a transparent element, a scanning element, a photosensitive element and a control module. The transparent element receives a main light beam emitted by the scanning light source component and reflects a part of the main light beam to be a reflected light. The reflected light is reflected by the second reflecting element, and the scanning element reflects the reflected light from the second reflecting element in a scanning manner. The photosensitive element receives the reflected light from the scanning element and outputs a sensing signal, and the control module actuates or stops actuating the scanning light source component according to the sensing signal. Therefore, when the scanning element is damaged, the control module may instantly stop actuating the scanning light source component, thereby enhancing the using safety of the optical scanning projection system. | 06-21-2012 |
20130181109 | OPTICAL SCANNING PROJECTION MODULE - An optical scanning projection module includes a scanning light component including a plurality of sub light sources and at least one light-splitting element, a main light reflective element, a scanning element and a photosensitive element. Sub light beams of the sub light sources are converged to form a main light beam. One of the sub light beams travels to the light-delivering element to form a partial reflective light beam and a partial penetrating light beam. With a scanning manner, the partial reflective light beam or the partial penetrating light beam is reflected by the scanning element to be an inspection light, and the main light beam is reflected by the scanning element to be a projection light. The photosensitive element outputs a sensing signal according to the inspection light. Thus, the optical scanning projection module controls the operation of the scanning light component according to the sensing signal. | 07-18-2013 |
20150108782 | BEAM SPLITTING MODULE AND PROJECTOR DEVICE USING THE SAME - A beam splitting module and a projector device using the same are provided. The beam splitting module comprises a projector, a first reflective mirror and a second reflective mirror. The projector projects a first split image, a second split image and a third split image. The first reflective mirror reflects the first split image to a real image forming plate to form a first projection image. The second reflective mirror reflects the second split image to the real image forming plate to form a second projection image. The third split image is projected on the real image forming plate through a space between the first reflective mirror and the second reflective mirror to form a third projection image. | 04-23-2015 |
Patent application number | Description | Published |
20120205703 | Light-Emitting Diode Package Device and Method for Making the Same - A light-emitting diode package device includes: a base unit defining a packaging space; a light-emitting diode die that is disposed inside the packaging space to electrically connect to the base unit and that is capable of emitting light; and an encapsulant that is filled in the packaging space to encapsulate the light-emitting diode die and that includes an upper surface to be exposed to external environment, and a plurality of microstructures formed on the upper surface. | 08-16-2012 |
20120205707 | LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package includes: a frame unit, and at least one light-emitting diode chip including a chip body and a contact layer disposed between the chip body and the frame unit. One of the frame unit and the contact layer contains a magnetic material, and the other one of the frame unit and the contact layer contains a material capable of being magnetically attracted to the magnetic material. | 08-16-2012 |
20120218749 | LIGHTING-EMITTING DEVICE - A light-emitting device including a substrate and a plurality of the semiconductor light-emitting diode dice having dominant wavelengths between 440 nm and 490 nm is disclosed. The semiconductor light-emitting diode dice are disposed on the substrate and electrically connected to the substrate. The difference in the wavelength of the semiconductor light-emitting diode dice between the maximum dominant wavelength and the minimum dominant wavelength is at least 10 nm and the average dominant wavelength is between 450 nm and 470 nm. Therefore, by the above arrangement, it not only homogenizes the light emitted from the light-emitting device of the present invention, but also depletes the surplus stocks of the semiconductor light-emitting diode dice on the production line. | 08-30-2012 |
20130056776 | PLATE - A plate including a substrate, a metal reflection layer and an oxidation protection layer is provided. The substrate has a first surface and a second surface opposite to the first surface. The metal reflection layer is disposed on the first surface of the substrate. The oxidation protection layer covers the metal reflection layer. The metal reflection layer is disposed between the oxidation protection layer and the first surface of the substrate. At least one light emitting diode chip is adapted to eutectic bonding on the plate. | 03-07-2013 |
20130146912 | ELECTRONIC DEVICE - An electronic device including an insulating substrate, a plurality of conductive vias and a chip is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The conductive vias pass through the insulating substrate. The chip is disposed on the upper surface of the insulating substrate and includes a chip substrate, a semiconductor layer and a plurality of contacts. The semiconductor layer is located between the chip substrate and the contacts. The contacts are electrically connected to the conductive vias. The material of the insulating substrate and the material of the chip substrate are the same. | 06-13-2013 |
20130146913 | ELECTRONIC DEVICE - An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate. | 06-13-2013 |
20130146915 | LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE - A light emitting diode including a first doped layer, a light emitting layer, a second doped layer and a substrate is provided. A plurality of first grooves penetrate through the second doped layer and the light emitting layer. Thus, a partial surface of the first doped layer is exposed. At least one of the plurality of first grooves extends to edges of the second dope layer and the light emitting layer. An insulating layer is disposed over a part of second doped layer and extends to sidewalls of the first grooves. A first contact is set in the first grooves and electrically connected to the first doped layer. A second contact is set on the second doped layer and electrically connected to the second doped layer. By the first grooves, the first contact can be electrically connected to the first doped layer for improving current spreading. | 06-13-2013 |
20130148344 | LIGHT EMITTING DEVICE - A light emitting device including an insulating substrate, a plurality of light emitting diode (LED) chips and a patterned conductive layer is provided. The insulating substrate has an upper surface. The LED chips are disposed on the insulating substrate and located on the upper surface. The dominant wavelengths of the LED chips are in a wavelength range of a specific color light and the dominant wavelengths of at least two of the LED chips are different. The patterned conductive layer is disposed between the insulating substrate and LED chips, and electrically connected to the LEDs chip. | 06-13-2013 |
20130153944 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers. | 06-20-2013 |
20130221394 | LIGHT EMITTING DIODE AND FLIP-CHIP LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) is revealed. The LED includes a substrate, a first-type-doped layer, a light emitting layer, a second-type-doped layer, a plurality of first grooves, a second groove, an insulation layer, a first contact, and a second contact. The LED features that the second groove is connected to one end of each first groove and penetrates the second-type-doped layer and the light emitting layer to expose a part of the first-type-doped layer. The contact area between the first contact and the first-type-doped layer is increased. Therefore, the LED is worked at high current densities without heat accumulation. Moreover, the light emitting area is not reduced and the light emitting efficiency is not affected. The LED is flipped on a package substrate to form a flip-chip LED package. | 08-29-2013 |
20130277093 | SUBSTRATE STRUCTURE - A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches. | 10-24-2013 |
20130285083 | LIGHT EMITTING MODULE - A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region. | 10-31-2013 |
20140252118 | SPRAY COATING APPARATUS - A spray coating apparatus including a containing tank, a spray nozzle, and a detection unit is provided. The containing tank contains a glue. The spray nozzle is connected to the containing tank to spray and coat the glue on a work piece. The detection unit detects specification data of the glue on the work piece. | 09-11-2014 |
20140306246 | LIGHT SOURCE MODULE - A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances. | 10-16-2014 |
20140319562 | LIGHT-EMITTING DIODE PACKAGE STRUCTURE - An LED package structure of the invention includes a light-emitting device and a transparent molding compound. The light-emitting device has an upper surface. The transparent molding compound is disposed on the light-emitting device and covers the upper surface, in which the transparent molding compound has a top surface and a bottom surface opposite to each other and a first outside surface connecting the top surface and the bottom surface. A surface area of the first outside surface is greater than or equal to four times of a horizontal projection area of the upper surface. | 10-30-2014 |
20140339576 | FLIP-CHIP LIGHT-EMITTING DIODE UNIT - A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration. | 11-20-2014 |
20150252966 | LIGHT EMITTING DEVICE - A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region. | 09-10-2015 |
Patent application number | Description | Published |
20100265393 | DE-INTERLACING APPARATUS AND METHOD AND MOVING CAPTION COMPENSATOR - A de-interlacing method includes the following steps. A de-interlacing pixel datum of a target pixel is obtained according to a current field and multiple correlated fields. A caption region of the current field is defined according to the fields, and a region motion vector and a region confidence are correspondingly obtained. When the target pixel belongs to the caption region, a compensation pixel datum of the target pixel is obtained by motion compensation according to at least a part of the fields and the region motion vector, and the target pixel is judged as a foreground pixel or a background pixel to output a compensation select signal according to the region motion vector and the region confidence. The de-interlacing pixel datum or the compensation pixel datum is outputted as a correlated pixel datum of the target pixel according to the compensation select signal. | 10-21-2010 |
20120082394 | IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - An image processing apparatus including an image detecting unit, an image interpolating unit and an image blending unit is provided. The image detecting unit detects a pixel difference value of an image frame and a previous image frame or a next image frame thereof and outputs a weight value according to the pixel difference value. The image interpolating unit interpolates a pixel value of the image frame in an intra-field interpolation method and an inter-field interpolation method. The image blending unit blends the pixel value interpolated in the intra-field interpolation method and the pixel value interpolated in the inter-field interpolation method to restore the image frame according to the weight value. An image processing method is also provided. | 04-05-2012 |
20120140116 | IMAGE ADJUSTING CIRCUIT AND IMAGE ADJUSTING METHOD - An image adjusting method is adapted to an image adjusting circuit. The image adjusting method includes following steps. An image signal is received and up-sampled to generate a first up-sampled image signal and a second up-sampled image signal. The first up-sampled image signal includes interpolated pixels and original pixels. Values of the interpolated pixels and the original pixels are detected, and a weight value is outputted according to the detection result. Whether the values of the interpolated pixels are adjusted or not is determined based on the detection result. According to the weight value, the second up-sampled image signal and the adjusted first up-sampled image signal are mixed to output a mixed image signal. An image adjusting circuit is also provided. | 06-07-2012 |
20140161350 | COLOR TRANSLATION METHOD AND COLOR TRANSLATION APPARATUS - A color translation method and a color translation apparatus adapted to map a data point from a first color space to a second color space are provided. At least four color axes coordinating with a plurality of first reference points and a plurality of second reference points corresponding to the first reference points are used to divide the first color space and second color space into a plurality of first sub-spaces and a plurality of second sub-spaces. A target first sub-space where the data point is located is found, and then a corresponding target second sub-space is also found. According to a positional relationship between the data point and the first reference points which define the target first sub-space, an interpolation operation is applied to the second reference points which define the target second sub-space so as to obtain a mapped point in the second color space. | 06-12-2014 |
20150091123 | LIGHT SENSOR - Provided is a light sensor including a substrate, a dielectric layer, a plurality of pixels, a plurality of spacers, and a plurality of metal interconnects. The dielectric layer is located on the substrate. The pixels are located in the dielectric layer. The spacers are located on the sidewall of openings between adjacent pixels. The metal interconnects are located in the openings and cover the spacers so as to be electrically connected to the corresponding pixels. | 04-02-2015 |
Patent application number | Description | Published |
20080297378 | NUMERAL INPUT METHOD - A numeral input method simply uses the keys of a mobile phone or some of a computer keyboard and the beginning point and the ending point of each English letter manually written by hand on the keys to achieve a numeral code system for the English alphabet. So, under the mode, Chinese characters and English alphabets (small and capital letters), numerals and simple symbols can be retrieved, even available for other languages. It can lessen the knocking times on the keys and make input operated easily and conveniently like writing on a mobile phone or a keyboard, an people all over the world speaking diverse languages can key in sentences, information, etc. more easily and quickly. | 12-04-2008 |
20090249528 | RAINCOAT - A raincoat includes a main body made of transparent plastic and consisting of two hiding members. The two hiding members are connected with each other, respectively provided with a flexible strip around their outer circumference and plural uniting members attached to a front side and a rear side. So the front side and the rear side of the two hiding members can be united with each other in wear and disunited from each other in folding. Further, plural stabilizing members are provided on an inner surface of the two hiding members for attaching around arms of a user and parts of a motorbike. This raincoat is easy to wear on a person only or a person and a motorbike together at the same time. | 10-08-2009 |
20100167244 | LANGUAGE TEACHING SYSTEM OF ORIENTATION PHONETIC SYMBOLS - A language teaching system of orientation phonetic symbols includes a pronunciation teaching module containing a word bank unit and an identification-conversion unit. The word bank unit includes large Chinese vocabulary, English single word data, and Chinese and English phonetic symbol word data. The arrangement of each English letter marked to English orientation phonetic symbol word is the same as a specified English single word, and the arrangement of each English letter marked to Chinese orientation phonetic symbol word is the same as the Chinese phonetic symbols of a specified Chinese character. A specified letter of the English phonetic symbol word is marked with a pronunciation auxiliary mark at its periphery to represent its sound. The identification-conversion unit collates the Chinese orientation phonetic symbol word and displays it on a screen. | 07-01-2010 |
Patent application number | Description | Published |
20110208237 | FORCEPS FOR PATHOLOGICAL DIAGNOSIS - A forceps for pathological diagnosis includes first and second proximate arm segments including finger-operable grip ends that are movable towards or away from each other, first and second distal arm segments including grasping-jaw ends that are movable towards or away from each other, a coupling member disposed to bring the relative movement between the first and second proximate arm segments into synchronization with that between the first and second distal arm segments, an ultrasonic probe mounted to the grasping-jaw end of the first distal arm segment, and adapted to transmit ultrasonic waves towards a target tissue that is clamped between the grasping-jaw ends and to receive reflected ultrasonic waves traveling from the target tissue, and a shielding member disposed on the grasping-jaw end of the second distal arm segment, and capable of partially reflecting ultrasonic waves transmitting through the target tissue. | 08-25-2011 |
20110208255 | INTRODUCER DEVICE FOR USE IN NUSS PROCEDURE - An introducer device is for use in Nuss procedure to guide a steel bar in retrieving an insertion route which passes through and between a patient's sternum and heart. The introducer device includes an elongated introducer body and an ultrasonic probe. The introducer body extends in a lengthwise direction to terminate at a leading tip end for coupling the concave steel bar to retrieve the insertion route, and a grip end opposite to the leading tip, and has a curve segment configured to establish the insertion route when the leading tip end is led to pass through and between the sternum and the heart. The curve segment has a concave sternum-side surface and a convex heart-side surface. The ultrasonic probe is coupled to the leading tip end to transmit ultrasonic waves towards the heart and to receive reflected ultrasonic waves traveling from the heart when passing through and between the sternum and the heart. | 08-25-2011 |
20120217780 | ADJUSTABLE OFFICE CHAIR - An adjustable office chair includes a base device, and a seat device disposed on the base device. The seat device includes a fixed seat section, a rear seat section connected pivotally to and disposed behind the fixed seat section, a front seat section connected pivotally to and disposed in front of the fixed seat, and an invertible seat section connected pivotally to a side of the front seat section distal from the fixed seat section. The invertible seat section is movable to a position directly above the fixed seat section to allow a user to sit thereon. The front and invertible seat sections are movable to align with the fixed seat section to allow the user to sit on the fixed seat section. The rear seat section is movable to an inclined position to allow the user to lie on the seat device. | 08-30-2012 |
20130012770 | COMBINED RETRACTOR AND ENDOSCOPE SYSTEM - A combined retractor and endoscope system includes a retraction ring and an endoscope unit. The retraction ring includes a tubular inner surface defining a passageway. The endoscope unit includes a flexible arm that can be positioned stably and moved between an edge of an incision and an outer peripheral surface of the retraction ring, and a camera attached to one end of the flexible arm. In a preferred embodiment, the flexible arm has a flexible outer tube body incorporating a support strip that can be bent together with the outer tube body to retain a bent configuration of the outer tube body. | 01-10-2013 |
20130018230 | SURGICAL RETRACTOR HAVING A LIGHTING UNITAANM SU; Ying-ChiehAACI Tainan CityAACO TWAAGP SU; Ying-Chieh Tainan City TWAANM CHEN; Chao-KunAACI Tainan CityAACO TWAAGP CHEN; Chao-Kun Tainan City TWAANM FONG; YaoAACI Tainan CityAACO TWAAGP FONG; Yao Tainan City TW - A surgical retractor includes an outer ring unit, a tubular retraction membrane made of a resilient material and including an inner surface defining a passageway, and a lighting unit. The tubular retraction membrane has an outer tubular end connected to the outer ring unit and rollable about the outer ring unit. The lighting unit is connected to an inner tubular end of the retraction membrane and includes a light-emitting ring, and a heat-dissipation ring in contact with the light-emitting ring. | 01-17-2013 |
20140058234 | DEVICE FOR DETECTING BLOOD-OXYGEN LEVEL ASSOCIATED WITH ONE OR MORE MUCOUS MEMBRANE REGIONS - A device adapted for insertion into one or more of an esophagus, a stomach, an intestine and a colon for detecting a blood-oxygen level associated with at least one mucous membrane region in said one or more of the esophagus, the stomach, the intestine and the colon is disclosed. The device includes a flexible and elongated main body, and a blood oxygen level detecting unit. The blood oxygen level detecting unit includes one or more blood oxygen level detecting modules disposed on the main body and capable of generating one or more signals associated with the blood oxygen level(s) of one or more mucous membrane regions nearby the blood oxygen level detecting module(s). | 02-27-2014 |
20140069423 | TRACHEAL TUBE FOR SECRETION REMOVAL - A tracheal tube includes an airway tubular body, an inflatable cuff disposed on the airway tubular body, a suction conduit extending along the airway tubular body to terminate at a suction opening, and a guiding unit disposed on the airway tubular body and adjacent to the suction opening. The guiding unit includes at least one guiding member having a plurality of ribs. Each two adjacent ones of the ribs define a guiding groove that extends toward the suction opening and that terminates at a confluent region in fluid communication with the suction opening so as to guide secretions in the trachea to the suction opening. | 03-13-2014 |
20150157307 | ILLUMINATED SURGICAL RETRACTOR SYSTEM AND MAGNETICALLY-CONTROLLED ILLUMINATION DEVICE - An illuminated surgical retractor system includes a surgical retractor and at least one illumination device. The surgical retractor includes an outer ring, a light-transmissive hollow inner ring, and a tubular retraction membrane which extends between the output ring and the inner ring and which has a first open end connected to and spread open by the outer ring and a second open end connected to and spread open by the inner ring. The illumination device is disposed in the inner ring and is operable to emit a light beam. The illumination device includes a magnetic component which is responsive to an applied magnetic field to cause the illumination device to change a direction in which the light beam is emitted. | 06-11-2015 |
Patent application number | Description | Published |
20080295874 | WET PROCESSING APPARATUSES - A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level. | 12-04-2008 |
20090087929 | METHOD AND SYSTEM FOR IMPROVING WET CHEMICAL BATH PROCESS STABILITY AND PRODUCTIVITY IN SEMICONDUCTOR MANUFACTURING - A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing. | 04-02-2009 |
20090111269 | SILICON WAFER RECLAMATION PROCESS - By exposing a process control wafer having a porous low-k-dielectric layer thereon in an HF-based low-k dielectric etching solvent comprising a dilating additive and a passivating additive, the pores in the low-k dielectric layer are dilated some of which connect with one another to form one or more continuous channels extending through the thickness of the dielectric layer and allowing the HF-based solvent to reach down to the substrate. Then the passivating additive component of the HF-based etching solvent forms a passivation layer at the dielectric layer and the substrate interface that protects substrate from the HF-based etchant. | 04-30-2009 |
20090233447 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a dielectric layer deposited thereon involves removing most of the dielectric layer by plasma etching leaving a residual film of the dielectric and then removing the residual dielectric film by a wet etching process. The combination of the dry and wet etching provides effective removal of the dielectric material without damaging the wafer substrate and any residual wet etching byproduct particulate remaining on the wafer substrate is then removed by APM cleaning and scrubbing. | 09-17-2009 |
20110223767 | CONTROL WAFER RECLAMATION PROCESS - A method of recycling a control wafer having a low-k dielectric layer deposited thereon involves etching a portion of the low-k dielectric layer using a plasma resulting in a residual film of the low-k dielectric layer and byproduct particulates of carbon on the substrate. The residual dielectric film is removed by wet etching with a low polarization organic solvent that includes HF and a surfactant. | 09-15-2011 |
20130263900 | WET PROCESSING APPARATUSES - A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level. | 10-10-2013 |
Patent application number | Description | Published |
20120275072 | POWER MANAGEMENT CIRCUIT AND HIGH VOLTAGE DEVICE THEREIN - A high voltage device includes a high voltage transistor and a protection device. The high voltage transistor has a first end and a second end, in which the first end is coupled to a voltage input/output terminal. The protection device is coupled between the second end of the high voltage transistor and a ground terminal, and has a parasitical equivalent circuit. When the voltage input/output terminal is charged based on positive ESD charges, the current corresponding to the positive ESD charges flows from the voltage input/output terminal through the high voltage transistor and the equivalent circuit in the protection device toward the ground terminal. A power management circuit is also disclosed herein. | 11-01-2012 |
20140027815 | Fast Turn On Silicon Controlled Rectifiers for ESD Protection - Fast turn on silicon controlled rectifiers for ESD protection. A semiconductor device includes a semiconductor substrate of a first conductivity type; a first well of a second conductivity type; a second well of the second conductivity type; a first diffused region of the first conductivity type and coupled to a first terminal; a first diffused region of the second conductivity type; a second diffused region of the first conductivity type; a second diffused region of the second conductivity type in the second well; wherein the first diffused region of the first conductivity type and the first diffused region of the second conductivity type form a first diode, and the second diffused region of the first conductivity type and the second diffused region of the second conductivity type form a second diode, and the first and second diodes are series coupled between the first terminal and the second terminal. | 01-30-2014 |
20140139958 | ESD PROTECTION CIRCUITS AND METHODS - An electrostatic discharge protection circuit includes a first LC resonator circuit coupled to an input node and disposed in parallel with an internal circuit that is also coupled to the input node, and a second LC resonator circuit coupled in series with the first LC resonator circuit at a first node. The first LC resonator circuit is configured to resonate at a different frequency than a frequency the second LC resonator circuit is configured to resonate. | 05-22-2014 |
20140160606 | ESD Protection Apparatus - An electrostatic discharge (ESD) protection structure comprises a first NPN transistor and a second NPN transistor connected in parallel. The bases of the first NPN transistor and the second NPN transistor are coupled together and further coupled to a first voltage potential and a second voltage potential through two deep trench capacitors respectively. The ESD protection structure further comprises a third deep trench capacitor and a fourth deep trench capacitor coupled between the first voltage potential and the second voltage potential. | 06-12-2014 |
20140268439 | ELECTROSTATIC DISCHARGE (ESD) CONTROL CIRCUIT - One or more electrostatic discharge (ESD) control circuit are disclosed herein. In an embodiment, an ESD control circuit has first and second trigger transistors, first and second ESD transistors, and first and second feedback transistors. The ESD transistors provide ESD current paths for ESD current generated during an ESD event. The first and second trigger transistors are on during normal operation to maintain the ESD transistors in an off state. During an ESD event, the first and second transistors are turned off to enable the first and second ESD transistors to provide ESD current paths. The first and second feedback transistors turn on during an ESD event to reinforce the on state of the ESD transistors and to reinforce the off state of the trigger transistors. In this way, the ESD control circuit stably provides multiple ESD current paths to discharge ESD current. | 09-18-2014 |
20150091054 | SCRs with Checker Board Layouts - An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips. | 04-02-2015 |
20150311342 | FINFET WITH ESD PROTECTION - In some embodiments, a field effect transistor structure includes a substrate, a fin structure and a gate structure. The fin structure is formed over the substrate. The fin structure includes a first channel region, a first source or drain region and a second source or drain region. The first source or drain region and the second source or drain region are formed on opposite ends of the first channel region, respectively. The well region is formed of the same conductivity type as the second source or drain region, connected to the second source or drain region, and extended to the substrate. The first gate structure wraps around the first channel region in the fin structure. | 10-29-2015 |