Patent application number | Description | Published |
20090244894 | LED ASSEMBLY FOR LED LAMP CONSISTING OF MULTIPLE LED UNITS EACH HAVING A HEAT SINK - An LED assembly for an LED lamp includes a replaceable bracket and a plurality of LED units mounted on the bracket. The bracket includes a frame and a plurality of mutually crossed beams interconnected in the frame to define a plurality of square openings. Each LED unit includes a printed circuit board, a heat sink secured below the printed circuit board and fixed on the bracket, and a plurality of LEDs mounted on the printed circuit board to be exposed in the openings in the bracket. The bracket can have different configuration so that light beams generated by the LEDs are parallel to each other, in a convergent manner or in a divergent manner. | 10-01-2009 |
20090266513 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader. | 10-29-2009 |
20090267474 | LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP - An LED lamp includes a heat dissipation device and a plurality of LED modules. The heat dissipation device includes a heat conductive member and a fin unit. The LED modules are attached to a top surface of a first plate of the heat conductive member. The heat conductive member comprises a plurality of posts embedded in the top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid therein. The first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. Screws are used to extend through the LED modules to threadedly engage in the posts thereby to intimately mount the LED modules on the top surface of the first plate of the heat conductive member. | 10-29-2009 |
20090268409 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein. | 10-29-2009 |
20090268476 | LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP - A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module. | 10-29-2009 |
20090310372 | LED LAMP HAVING ACTIVE HEAT DISSIPATION STRUCTURE - An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing. | 12-17-2009 |
20090321054 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion. | 12-31-2009 |
20100014966 | FASTENING DEVICE FOR FANS - A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan. | 01-21-2010 |
20100103674 | LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP - An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces. | 04-29-2010 |
20100128482 | LIGHT SOURCE DEVICE HAVING HEAT DISSIPATION MODULE - A light source device includes a first heat dissipation structure, an LED module, a heat energy convertor and a fan. The first heat dissipation structure includes a heat dissipation base, a first fin group attached on a top surface of the heat dissipation base. The LED module is attached on a bottom surface of the heat dissipation base of the first heat dissipation structure. The heat energy convertor is thermally connected to the heat dissipation base of the first heat dissipation structure through heat pipes, and configured for changing heat energy generated by the LED module into kinetic energy. The fan is disposed over the first fin group and driven by the heat energy convertor. | 05-27-2010 |
20100139893 | HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader includes a base with a cavity defined therein and a cover mounted on the base to thereby hermetically seal the cavity of the base. A predetermined quantity of working liquid is contained in the cavity. The heat spreader further includes a first wick structure formed on an inner surface of the base, a second wick structure formed on an inner surface of the cover and a third wick structure embedded in the first wick structure. The first and second wick structures are made of metal mesh, carbon nanotube array or bundle of fibers and the third wick structure is made of sintered metal powder. In use, the third wick structure is positioned corresponding to a heat generating electronic component. | 06-10-2010 |
20100139894 | HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a heat spreader for absorbing heat from a heat-generating source, a tank covering on the heat spreader and hermetically engaging with the heat spreader, a first wick layer formed on an inner face of the tank, a second wick layer formed on an inner face of the heat spreader, and a supporting member located between the tank and the heat spreader. A chamber is defined between the tank and the heat spreader and contains working fluid therein. The supporting member is arranged in a wave shape and supports the first wick layer and the second wick layer. | 06-10-2010 |
20100155019 | EVAPORATOR AND LOOP HEAT PIPE EMPLOYING IT - The disclosure relates to an evaporator and a loop heat pipe employing it. The evaporator includes a shell having an evaporation chamber and a compensation chamber defined therein, a partition being received in the shell and partitioning the evaporation chamber and the compensation chamber, and a wick structure being adhered to an inner wall of the shell corresponding to the evaporation chamber and extending through the partition and into the compensation chamber. The loop heat pipe includes the evaporator mentioned above, a pipe connecting two opposite ends of the evaporator to form a closed loop and a working medium contained in the closed loop. | 06-24-2010 |
20100206522 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion. | 08-19-2010 |
20100243216 | LIQUID-COOLING DEVICE - A liquid-cooling device includes a heat exchanger defining a cavity therein and a liquid-guiding component received in the cavity. The liquid-guiding component includes a body and a fixing portion extending from the body and fixed to the heat exchanger. A first liquid passage is defined through the body and a second liquid passage is formed between the body and an inner sidewall of the heat exchanger surrounding the cavity. The first liquid passage is in fluid communication with the second liquid passage via a bottom of the cavity. An outlet and an inlet are formed at an end of the liquid-guiding component and in fluid communication with the first and second liquid passages. Liquid flows in the cavity of the heat exchanger via the first liquid passage and has a sufficient contact with the inner sidewall of the heat exchanger. | 09-30-2010 |
20100258273 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate. | 10-14-2010 |
20100294200 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber. | 11-25-2010 |
20110030921 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber. | 02-10-2011 |
20110048341 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a container, a wick structure attached to an inner surface of the container, and a supporting structure received in the container and abutting against opposite sidewalls of the container. The supporting structure is generally in the form of a metallic sheet and comprises a plurality of supporting members extending upwardly from thereof. A through hole is defined in the supporting member from top to bottom. An opening is defined between the adjoining supporting members. Opposite ends of the supporting members abut against the wick structure located at the opposite sidewalls of the container. | 03-03-2011 |
20110255285 | ILLUMINATION DEVICE WITH HEAT DISSIPATION STRUCTURES - An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air. | 10-20-2011 |