Patent application number | Description | Published |
20110216472 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor which provides favorable properties and characteristics such as dielectric characteristics, insulation properties, temperature characteristics, and high temperature load characteristics and provides favorable thermal shock resistance, even when dielectric ceramic layers are reduced in layer thickness to increase the number of layers has dielectric ceramic layers containing, as their main constituent, a barium titanate based compound represented by the general formula ABO | 09-08-2011 |
20110222205 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic (and capacitor containing it) balancing high temperature load characteristics and temperature characteristics of capacitance even when layer thickness is less than 1 μmhas a mixture of different crystal grains containing a barium titanate compound as the main constituent. The first crystal grains can contain rare earth element solid solution region lat the surface layer section. The second crystal grains have a core-shell structure including a shell section having a rare earth element solid solution present. The first and second crystal grains are 12% to 84% f and 16% to 88%, respectively, of the total number of crystal grains. | 09-15-2011 |
20120257322 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor having a large capacity and high reliability includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes and alternately disposed inside the ceramic sintered body to be opposed to each other in a stacking direction of the ceramic layers with one of the ceramic layers being interposed between the adjacent first and second inner electrodes. The ceramic sintered body includes a first portion in which the first and second inner electrodes are opposed to each other, and a second portion positioned outside the first portion. A ratio (Ic/Ia) of c-axis peak intensity (Ic) to a-axis peak intensity (Ia) measured with an XRD analysis of the one of the ceramic layers is about 2 or more. | 10-11-2012 |
20120326558 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component having excellent mechanical characteristics and internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, and low defective rate includes a laminate having a plurality of laminated ceramic layers and a plurality of Al/Cu alloy-containing internal electrodes at specific interfaces between ceramic layers; where the Al/Cu ratio of the Al/Cu alloy is 80/20 or more. | 12-27-2012 |
20120326559 | LAMINATED CERAMIC ELECTRONIC COMPONENT - Provided is a laminated ceramic electronic component having excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and internal electrodes at a plurality of specific interfaces between the ceramic layers and having an Al/Ni alloy as a component; and an external electrode formed on the outer surface of the laminate, wherein the Al/Ni ratio of the Al/Ni alloy is 85/15 or more. | 12-27-2012 |
20120326561 | LAMINATED CERAMIC ELECTRONIC COMPONENT - Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of ceramic material design freedom, low cost, low defective rate and various properties. It includes a laminate of a plurality of laminated ceramic layers and a plurality of internal electrodes at specific interfaces between ceramic layers. The internal electrodes contain an Al/Mg alloy in which the Al/Mg ratio is 65/35 or more. | 12-27-2012 |
20120326562 | LAMINATED CERAMIC ELECTRONIC COMPONENT - Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes a laminate which has a plurality of laminated ceramic layers and internal electrodes formed along at a plurality of specific interface between the ceramic layers and having an Al/Ti alloy as a component; and an external electrode formed on the outer surface of the laminate. The Al/Ti ratio of the Al/Ti alloy is 91/9 or more. | 12-27-2012 |
20130002092 | LAMINATED CERAMIC ELECTRONIC COMPONENT - Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Mn alloy internal electrodes at a plurality of specific interfaces between the ceramic layers and an external electrode formed on the outer surface of the laminate, wherein the Al/Mn ratio of the Al/Mn alloy is 80/20 or more. | 01-03-2013 |
20130107418 | DIELECTRIC CERAMIC COMPOSITION AND LAMINATED CERAMIC ELECTRONIC COMPONENT | 05-02-2013 |
20130140946 | LAMINATED CERAMIC ELECTRONIC COMPONENT - Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Si alloy-containing internal electrodes at a plurality of specific interface between ceramic layers; and an external electrode formed on the outer surface of the laminate, wherein the Al/Si ratio of the Al/Si alloy is 85/15 or more. | 06-06-2013 |
20130148256 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers, and an external electrode located on an outer surface of the laminated body. In the laminated ceramic electronic component, the ceramic layers have a composition including a main constituent of a barium titanate-based compound and Bi | 06-13-2013 |
20130194717 | DIELECTRIC CERAMIC, STACK CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THESE - A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba | 08-01-2013 |
20130342958 | MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes | 12-26-2013 |
20140016243 | MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - Provided in a dielectric ceramic having flat capacitance characteristics and a high dielectric constant, and a multilayer ceramic electronic component (such as a multilayer ceramic capacitor) in which the dielectric ceramic is used. A multilayer ceramic capacitor includes a multilayer body having a plurality of dielectric ceramic layers and a plurality of internal electrodes, and external electrodes formed on the multilayer body. The composition of the multilayer body includes any of a bismuth layered compound containing Sr, Bi and Ti, a bismuth layered compound containing Sr, Bi and Nb, and a bismuth layered compound containing Ca, Bi and Ti as a primary ingredient, Bi and at least one of Cu, Ba, Zn and Li, and satisfies the conditions that if the Ti content is 400 molar parts or the Nb content is 200 molar parts, then (Bi content-Ti content) or (Bi content-Nb content) is equal to or greater than 1 molar part and less than 7.5 molar parts and the total content of Cu, Ba, Zn and Li is equal to or greater than 1 molar part and less than 10 molar parts. | 01-16-2014 |
20140022696 | ELECTRONIC COMPONENT - A laminate body includes a plurality of ceramic layers and capacitor conductors embedded in the laminate body so as to be opposed to each other via one of the ceramic layers. The capacitor conductors are made of an Al-based material, and the capacitor conductors include narrow portions, respectively, which function as fuse elements. The narrow portions have an average width smaller than an average width of portions of the capacitor conductors other than the narrow portions. As a result, the electronic component has an improved capability to protect its function as a capacitor when a short circuit occurs between capacitor conductors. | 01-23-2014 |
20140160626 | Laminated Ceramic Capacitor - A laminated ceramic capacitor that includes a laminated body that has dielectric ceramic layers including crystal grains and crystal grain boundaries and has internal electrode layers; and external electrodes on the surface of the laminated body and electrically connecting the internal electrode layers exposed at the surfaces of the laminated body. When a direct-current voltage is applied to the laminated ceramic capacitor, the voltage/current curve has a critical point dividing the curve into a first area on the lower-voltage side and a second area on the higher-voltage side, an electric field obtained by dividing the critical voltage at the critical point by the thickness of one of the dielectric ceramic layers when the voltage (V)/current (I) characteristics are measured at 25° C. is 10 V/μm or more, and the voltage/current curve has a slope of 3 or less in the second area. | 06-12-2014 |
20140175942 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component. | 06-26-2014 |
20140185185 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT, AND CERAMIC ELECTRONIC COMPONENT - A raw ceramic portion is formed on each of first and second lateral surfaces of a raw ceramic body. The raw ceramic portions contain ceramic particles and more of at least one constituent selected from Ba, Mg, Mn, and a rare-earth element between the ceramic particles than the ceramic section of the raw ceramic body in terms of total amount. The raw ceramic body is fired with the raw ceramic portions thereon. In this way, a ceramic electronic component is obtained that has a main body left after the raw ceramic body is fired with the raw ceramic portions thereon. | 07-03-2014 |
Patent application number | Description | Published |
20100014210 | DIELECTRIC CERAMIC MATERIAL AND MONOLITHIC CERAMIC CAPACITOR - A dielectric ceramic material is composed of a perovskite compound represented by ABO | 01-21-2010 |
20100053843 | DIELECTRIC CERAMIC, METHOD FOR PRODUCING DIELECTRIC CERAMIC, AND MONOLITHIC CERAMIC CAPACITOR - A dielectric ceramic contains a barium titanate and Li. In the dielectric ceramic, the following inequalities are satisfied: 0.5≦e≦6.0, 0.0603-04-2010 | |
20110069424 | LAMINATED CERAMIC ELECTRONIC COMPONENT - It is harder to realize structural defects when the thickness of an internal electrode is reduced in a laminated ceramic electronic component, such as a laminated ceramic capacitor, when the internal electrodes contain a base metal as their conductive constituent, and the dielectric ceramic layers are formed from a dielectric barium titanate ceramic, and as an accessory constituent, at least one alkali metal element selected from Li, K, and Na, each of the internal electrodes has a thickness of 0.5 μm or less, and the content of the alkali metal element in the dielectric ceramic is 0.2 parts by mol or more with respect to 100 parts by mol of the main constituent. | 03-24-2011 |
20110075318 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component has a variety of superior mechanical properties and electrical properties, including a high degree of freedom in the design for ceramic materials, and can be manufactured at low cost and with a low percentage of defective products. The laminated ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes containing Al as a main constituent, the internal electrodes being arranged along specific interfaces between the ceramic layers, and external electrodes located on an outer surface of the laminate, wherein surface layer sections of the internal electrodes include an Al | 03-31-2011 |
20150332854 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component has a variety of superior mechanical properties and electrical properties, including a high degree of freedom in the design for ceramic materials, and can be manufactured at low cost and with a low percentage of defective products. The laminated ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes containing Al as a main constituent, the internal electrodes being arranged along specific interfaces between the ceramic layers, and external electrodes located on an outer surface of the laminate, wherein surface layer sections of the internal electrodes include an Al | 11-19-2015 |
Patent application number | Description | Published |
20140154818 | DEFECT DETECTION METHOD, METHOD FOR REPAIRING ORGANIC EL ELEMENT, AND ORGANIC EL DISPLAY PANEL - A defect detection method for an organic EL element having a first electrode, a second electrode, and a functional layer and a light-emission layer disposed between the electrodes, including: applying a first voltage, between the electrodes, that, when the organic EL element includes, between the electrodes, a defective portion that is a potential cause of non-light emission of the light-emission layer, reduces electrical resistance of a first portion, of the functional layer, corresponding to the defective portion and makes the organic EL element detectable as a dark spot, whose light-emission layer does not emit light; and after applying the first voltage, applying a second voltage between the electrodes and detecting whether or not the organic EL element is the dark spot, the second voltage, when the organic EL element does not include the defective portion, causing the light-emission layer to emit light. | 06-05-2014 |
20140253133 | METHOD FOR MANUFACTURING EL DISPLAY APPARATUS - The present disclosure relates to a method for manufacturing an EL display apparatus including a light-emitting portion in which a light emitting layer is disposed between a pair of electrodes, a thin film transistor array device for controlling light emission of the light-emitting portion, and an EL display panel in which a plurality of pixels of colors of R, G, and B are disposed. After production of the EL display panel, an inspection step is performed to apply, to each of the pixels, a voltage which is preset for each of the colors of R, G, and B of the pixels, the voltage applied in the inspection step is a potential difference that is a reverse bias voltage opposite to an anode voltage and a cathode voltage during lighting, and the potential difference allows a faulty pixel to turn to a dead dot. | 09-11-2014 |
Patent application number | Description | Published |
20130225443 | METHOD OF EXAMINING POLYCYSTIC KIDNEY DISEASE AND METHOD OF SCREENING FOR THERAPEUTIC AGENT OF THE DISEASE - The present invention provides a method of examining polycystic kidney disease or a complication of polycystic kidney disease using a gene(s) selected from the group consisting of NTNG1, POSTN, TNC, KAL1, BST1, ACAT2, INSIG1, SCD, HSD3B1, KRT7, USP40, SULT1E1, BMP6, CD274, CTGF, E2F7, EDN1, FAM43A, FRMD3, MMP10, MYEOV, NR2F1, NRCAM, PDCK1, PLXNA2, SLC30A3, SNAI1, SPOCD1, MMP1, TFPI2, HMGA2, KRTAP4-7, KRTAP4-8, KRTAP4-9, MYPN, RPPH1, and SIAE, and a method of screening for a therapeutic agent or a preventive agent therefore, and further vascular endothelial cells or vascular mural cells obtained via differentiation induction from iPS cells formed from a somatic cell of a subject suffered from polycystic kidney disease and having cerebral aneurysm as a complication. | 08-29-2013 |
Patent application number | Description | Published |
20090243097 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CONSTANT FILM AND MANUFACTURING METHOD THEREOF - A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks. | 10-01-2009 |
20100144095 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench formed in parts of a semiconductor wafer, a sealing film and others corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entirety including the separated silicon substrates from being easily warped. | 06-10-2010 |
20100144096 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped. | 06-10-2010 |
20100144097 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM - First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped. | 06-10-2010 |
20100173455 | SEMICONDUCTOR DEVICE HAVING SEALING FILM AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a plurality of wiring lines which are provided on an upper side of a semiconductor substrate and which have connection pad portions, and columnar electrodes are provided on the connection pad portions of the wiring lines. A first sealing film is provided around the columnar electrodes on the upper side of the semiconductor substrate and on the wiring lines. A second sealing film is provided on the first sealing film. The first sealing film is made of a resin in which fillers are not mixed, and the second sealing film is made of a material in which fillers are mixed in a resin. | 07-08-2010 |
20120074564 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device comprises a semiconductor substrate having a connection pad, an external connection electrode provided on the semiconductor substrate to be connected to the connection pad, and a sealing film provided to cover the external connection electrode, wherein an opening is provided in the sealing film to expose a center of the upper surface of the external connection electrode, and the sealing film is provided to cover an outer peripheral part of the upper surface of the external connection electrode. | 03-29-2012 |
Patent application number | Description | Published |
20100061408 | LASER APPARATUS - Provided is a laser apparatus including: a DFB fiber laser | 03-11-2010 |
20120177363 | OPTICAL SIGNAL OUTPUT APPARATUS, ELECTRICAL SIGNAL OUTPUT APPARATUS, AND TEST APPARATUS - To efficiently apply jitter to an optical signal using a simple configuration, provided is an optical signal output apparatus that outputs an optical pulse pattern signal including jitter, the optical signal generating apparatus comprising a light source section that outputs an optical signal having an optical frequency corresponding to a frequency control signal; an optical modulation section that modulates the optical signal output by the light source section, according to a designated pulse pattern; and an optical jitter generating section that delays an optical signal passed by the optical modulation section according to the optical frequency, to apply jitter to the optical signal. | 07-12-2012 |
20120269521 | LIGHT SOURCE, OPTICAL SIGNAL GENERATOR, AND ELECTRICAL SIGNAL GENERATOR - To efficiently apply jitter to an optical signal using a simple configuration, provided is an optical signal generating apparatus that outputs an optical pulse pattern signal including jitter, the optical signal generating apparatus comprising a light source section that outputs laser light having an optical frequency corresponding to a frequency control signal, an optical modulation section that modulates an optical signal output by the light source section, according to a designated pulse pattern, and an optical jitter generating section that delays an optical signal passed by the optical modulation section according to the optical frequency, to apply jitter to the optical signal. | 10-25-2012 |
20130068971 | ELECTROMAGNETIC WAVE EMISSION DEVICE - An electromagnetic wave emission device includes a nonlinear crystal, a prism, and a cylindrical lens. The nonlinear crystal has an optical waveguide, receives exciting light having at least two wavelength components, and outputs an electromagnetic wave having a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] by means of the Cherenkov phase matching. The prism includes an electromagnetic wave input surface receiving the electromagnetic wave from the optical waveguide and an electromagnetic wave transmission surface through which the electromagnetic wave which has entered from the electromagnetic wave input surface passes. The cylindrical lens has two bottom surfaces opposed to each other, a flat surface intersecting with the two bottom surfaces, and a curved surface intersecting with the two bottom surfaces and the flat surface, wherein the flat surface is in contact with the electromagnetic wave transmission surface. | 03-21-2013 |
20130075597 | ELECTROMAGNETIC WAVE DETECTION DEVICE - According to the present invention, an electromagnetic wave detection device includes an optical waveguide, an electromagnetic wave input unit, and a phase difference measurement unit. According to the thus constructed electromagnetic wave detection device, an optical waveguide is a nonlinear crystal, and includes a branching portion for receiving a probe light pulse, and causing the probe light pulse to branch into two beams of branching light, and two branching light transmission portions for receiving the branching light from the branching portion, and transmitting the branching light. An electromagnetic wave input unit inputs an electromagnetic wave having a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] tilted by an angle generating Cherenkov phase matching with respect to a travel direction of the branching light into one of the two branching light transmission portions. | 03-28-2013 |
20130181146 | ELECTROMAGNETIC WAVE EMISSION DEVICE - An electromagnetic wave emission device includes a nonlinear crystal which receives exciting light Lp having two wavelength components λ | 07-18-2013 |
20130284950 | ELECTROMAGNETIC WAVE EMISSION DEVICE - According to the present invention, an electromagnetic wave emission device includes a nonlinear crystal having an optical waveguide; and a prism including an electromagnetic wave input surface and an electromagnetic wave transmission surface. The electromagnetic wave transmission surface includes a rotation surface which is a trajectory of a tilted line segment rotated about a central axis of the electromagnetic wave input surface, the tilted line segment being tilted with respect to the central axis. The tilted line segment and the central axis are on the same plane. The central axis is in parallel to an extending direction of the optical waveguide. The central axis passes through a projection of the optical waveguide into the electromagnetic wave input surface. | 10-31-2013 |
20140166883 | ELECTROMAGNETIC WAVE MEASUREMENT DEVICE, MEASUREMENT METHOD, AND RECORDING MEDIUM - According to the present invention, an electromagnetic wave measurement device includes: an electromagnetic wave detector, a frequency component acquisition unit, and a thickness indication quantity deriving unit. An object to be measured is disposed on a substrate and includes at least two layers, and the electromagnetic wave detector detects a substrate-surface-reflected electromagnetic wave which has been made incident to the object, has been reflected by the substrate, and has passed through the object. The frequency component acquisition unit acquires an amplitude of a frequency component of the substrate-surface-reflected electromagnetic wave. The thickness indication quantity deriving unit derives a thickness indication quantity based on the amplitude of the frequency component of the substrate-surface-reflected electromagnetic wave and a relationship between the thickness indication quantity and the amplitude of the frequency component of the substrate-surface-reflected electromagnetic wave. | 06-19-2014 |
Patent application number | Description | Published |
20090295699 | DRIVE CIRCUIT, ACTIVE MATRIX SUBSTRATE, AND LIQUID CRYSTAL DISPLAY DEVICE - Off-leak current of a TFT, required for a drive circuit configured with a TFT of a single conductivity type, is realized with simple manufacturing steps. The impurity concentration of a source region and a drain region of a TFT is set between 2*10 | 12-03-2009 |
20100244037 | THIN FILM TRANSISTOR, ITS MANUFACTURING METHOD, AND LIQUID CRYSTAL DISPLAY PANEL AND ELECTRONIC DEVICE USING SAME - A thin film transistor (TFT) is provided which is capable of reducing leakage currents in a polycrystalline silicon TFT without causing an increase in manufacturing processes. Source/drain regions of an activated layer of the TFT to be formed in a circuit region and pixel region formed on a glass substrate of a liquid crystal display panel for a mobile phone is formed so that its boron impurity falls within a range of 2.5×10 | 09-30-2010 |
20110080538 | OPTICAL ELEMENT MANUFACTURING METHOD, OPTICAL ELEMENT EXPOSURE DEVICE, OPTICAL ELEMENT, LIGHTING OPTICAL DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - Provided is an optical element manufacturing method that is capable of forming various kinds of shapes and capable of achieving sophisticated functions, improved yields, and cost reductions. The method includes: a step that applies a transparent photosensitive resin on a transparent substrate with light-shielding patterns provided thereon; a step that forms transparent layers by performing patterning through irradiating exposure light of an arbitrary amount on the transparent photosensitive resin via the transparent substrate with the light-shielding patterns provided thereon; a step that forms light absorption layers by filling a black curable resin between the transparent layers; and an irradiation step that irradiates the exposure light in an oblique direction to the surface of the transparent substrate where the light-shielding patterns are formed in a state where the transparent substrate is being bent. | 04-07-2011 |
20110085182 | IMAGE FORMING APPARATUS - An image forming apparatus includes: a functional element substrate to which a pixel is formed in a predetermined cycle; an opposed substrate formed on the functional element substrate; and an optical device arranged on the opposed substrate, which includes a transparent layer and an optical absorption layer arranged in a cycle of 1/n (n is an integer number) of the cycle of arranging the pixel, and restricts spread of transmitted light. | 04-14-2011 |
20130201573 | OPTICAL ELEMENT - To provide an optical element capable of suppressing at least either aggregation of the protruded patterns or generation of dents in the light absorbing layer during manufacturing steps. The micro louver includes: a transparent substrate; a transparent layer formed on a surface of the transparent substrate; provided that the surface of the transparent layer in contact with the transparent substrate of the transparent layer is a bottom face and the opposite side thereof is an upper face, a plurality of protruded patterns formed on the transparent layer by being isolated from each other by having the upper face as the top face; and a light absorbing layer formed between the protruded patterns. Further, regarding the section of the protruded pattern as a face perpendicular to the surface of the transparent substrate, a width on the upper face side of is wider than a width on the bottom face side. | 08-08-2013 |
20160077363 | OPTICAL ELEMENT, AND DISPLAY DEVICE, ELECTRONIC APPARATUS, LIGHTING DEVICE USING THE SAME - There is such an issue with the well-known optical element that it is difficult to achieve a high transmittance since the transmittance is determined according to the pattern size of the light transmission regions, so that the luminance of the display device to which such optical element is mounted is deteriorated. Provided is an optical element which employs a structure in which the shape of a conductive pattern where electrophoretic particles cohere in a wide viewing field mode is formed in a comb-like shape and plural stages and plural rows of light transmission regions are disposed in the spaces between the comb teeth. This makes it possible to exclude the electrophoretic particles from the regions other than the comb-like electrode for allowing the light to transmit that part. | 03-17-2016 |
20160077364 | OPTICAL ELEMENT, AND DISPLAY DEVICE, ELECTRONIC APPARATUS, LIGHTING DEVICE USING THE SAME - To provide an optical element capable of stably securing an intermediate mode between two operations modes. The optical element of the present invention includes: a first transparent substrate; a second transparent substrate provided by opposing to the first transparent substrate; a plurality of first conductive patterns and second conductive patterns disposed in parallel to each other on a face of the first transparent substrate opposing to the second transparent substrate; light transmission regions disposed between the first conductive patterns and the second conductive patterns; a transparent conductive film disposed on a face of the second transparent substrate opposing to the first transparent substrate; and an electrophoretic element disposed between the neighboring light transmission regions, which is constituted with light-shielding electrophoretic particles of a specific electric charge and a transmissive dispersion material. | 03-17-2016 |
Patent application number | Description | Published |
20110075088 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE - A wiring board of the present invention has pads disposed in a plurality of rows including: first row pads each being connected to a respective one of the connection wires that is long in length; and second row pads ( | 03-31-2011 |
20110182046 | ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - The present invention provides a reduced size electronic circuit device, a manufacturing method of the same, and a display device having the same made by the manufacturing method. The electronic circuit device of the present invention is an electronic circuit device, wherein a first electronic component and a second electronic component are respectively connected electrically to a third electronic component; the first electronic component is bonded to the third electronic component through a first adhesive layer; the second electronic component is bonded to the third electronic component through the first and second adhesive layers; and one of the first adhesive layer and the second adhesive layer contains an anisotropic conductive material and the other adhesive layer does not contain the anisotropic conductive material. | 07-28-2011 |
20110193239 | SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE PROVIDED WITH THE SAME - Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC ( | 08-11-2011 |
20120006584 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE - A wiring board of the present invention ( | 01-12-2012 |
20120080789 | SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended) - Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface. | 04-05-2012 |
20120133876 | LIQUID CRYSTAL PANEL - A region for mounting components such as an IC chip is sufficiently ensured on a glass substrate with which a liquid crystal panel is configured, without reducing the number of panel pieces to be taken from a large panel. A liquid crystal panel is composed of a first glass substrate ( | 05-31-2012 |
20120236230 | DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - Disclosed is a device substrate wherein an insulating layer ( | 09-20-2012 |
20130335940 | ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE - A wiring substrate ( | 12-19-2013 |
20150029436 | DISPLAY APPARATUS - A display apparatus is provided with: a frame; a display panel, which is fixed to the frame; and a plurality of flexible printed circuit boards, which are disposed adjacent to each other, and each of which has one end side pressure bonded to the display panel, and the other end side bent to the frame side, which is the reverse side of the display panel. The display apparatus has adhesive areas wherein a surface of the display panel is adhered and fixed to the frame, the adhesive areas being in areas overlapping the flexible printed circuit boards. In regions among the flexible printed circuit boards adjacent to each other, non-adhesive areas where the surface of the display panel is not adhered and fixed to the frame are provided. | 01-29-2015 |
20150109550 | DISPLAY DEVICE - A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate ( | 04-23-2015 |
20150319849 | COMPONENT FIXING STRUCTURE, CIRCUIT BOARD, AND DISPLAY PANEL - The present invention provides a component securing structure that forms a wiring unit on a TFT glass substrate that is capable of transmitting UV light. A component, such as a driver IC and/or an FPC, is electrically connected to the wiring unit and is secured to the TFT glass substrate by a UV-curable ACF. An opening for transmitting UV light is formed in a light shielding layer of the wiring unit. UV light irradiated from the back side of the TFT glass substrate passes through the opening and directly irradiates the UV-curable ACF. | 11-05-2015 |
Patent application number | Description | Published |
20110122337 | DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME - A drive IC chip ( | 05-26-2011 |
20110169022 | BOARD MODULE AND METHOD OF MANUFACTURING SAME - A liquid crystal display device ( | 07-14-2011 |
20110169791 | DISPLAY DEVICE - In a liquid crystal display device ( | 07-14-2011 |
20110169792 | DISPLAY PANEL - The present invention provides a display panel in which, without providing connection terminals, the number of which corresponds to the number of test terminals of a liquid crystal panel, on a circuit board such as an FPC board, miniaturization is obtained while reducing costs such as the mounting cost and material cost of the circuit board, and stable operation is performed. A liquid crystal panel ( | 07-14-2011 |
20110199569 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE - A wiring board of the present invention ( | 08-18-2011 |
20140092338 | DISPLAY MODULE AND DISPLAY DEVICE - A display module | 04-03-2014 |
20150279792 | DRIVE CHIP AND DISPLAY APPARATUS - This drive chip has a configuration that is provided with: a base main body; two terminal groups that are respectively disposed along the base main body sides in the longitudinal direction of the base main body, said sides facing each other; a narrow-pitch section in one terminal group wherein terminals are disposed in a zigzag manner in two or more rows, said narrow-pitch section having a narrow terminal pitch in the longitudinal direction; a rough pitch section in the one terminal group, said rough pitch section having a terminal pitch in the longitudinal direction wider than that of the narrow pitch section; and a dummy bump that is disposed between the two terminal groups, said dummy bump being disposed parallel to the rough pitch section. | 10-01-2015 |
20150334839 | COMPONENT-FIXING METHOD, CIRCUIT SUBSTRATE, AND DISPLAY PANEL - The present invention involves forming wiring sections on a substrate capable of UV-ray transmission, and fixing a component to be electrically connected to the wiring sections onto the substrate using a UV-curable ACF. When doing so, fluidity in the UV-curable ACF is produced by applying pressure to the component, and UV rays are directly projected from the surface of the substrate even onto the UV-curable ACF areas shielded by the wiring sections. The UV-curable ACF is made to be fluid by applying pressure to the component after increasing fluidity of the UV-curable ACF by heating. | 11-19-2015 |
Patent application number | Description | Published |
20080204909 | POLYMER ACTUATOR AND OPTICAL UNIT - An object of the present invention is to provide a polymer actuator that does not need a special member for determining the output direction of the drive force or a support member, and which is simply configured with a small number of parts and is compact and low-cost. The present invention provides a polymer actuator that includes electrodes which are inelastic in a planar direction and sandwich a stretching portion of a dielectric polymer with a gradient in thickness, and also provides an optical system including the polymer actuator. | 08-28-2008 |
20080278030 | DRIVE UNIT AND DRIVE MODULE - A drive unit and drive module which use a shape memory alloy as a drive source to move a driven member, and which can drive at a high speed, independently of the ambient temperature and the position of the driven member. The timing of moving the driven member is controlled based on the position to which the driven member is moved, and based on the settling time for the driven member moved to that position to settle at that position, thus, the driven section can be moved in the minimum drive time, and this arrangement provides the drive unit and drive module that can drive at a high speed, independently of the ambient temperature and the position of the driven member. | 11-13-2008 |
20080278590 | DRIVE UNIT AND DRIVE MODULE - To provide a drive unit and a drive module which include a shape memory alloy as a drive source to move a driven member and are capable of the high-precision movement of the driven member to a reference position. A drive unit and a drive module can be provided by controlling, in the drive unit and the drive module which include the shape memory alloy as the drive source to move the driven member, the shape memory alloy so that the resistance of the shape memory alloy is equal to the resistance when the driven member is located at the reference position. | 11-13-2008 |
20090073302 | OPTICAL UNIT AND IMAGE PICKUP APPARATUS - An optical unit is provided which is characterized by compact configuration, high performance and minimized noise, and which has a drive element to drive a lens cone holding an image pickup optical system, and has the same outside diameter as the lens cone, wherein the optical unit drives the image pickup optical system by expanding and contracting the drive element in a direction of an optical axis of the image pickup optical system. An image pickup apparatus is provided which is characterized by compact configuration, high performance and minimized noise, and which has an optical unit coupled to an image pickup unit through a drive element, and has the same outside diameter as the optical unit, wherein the apparatus drives the optical unit by expanding and contracting the drive unit in a direction of an optical axis of the optical unit. | 03-19-2009 |
20100296183 | DRIVING DEVICE MADE OF SHAPE-MEMORY ALLOY - A storing section ( | 11-25-2010 |
20110032628 | DRIVE DEVICE - A drive device includes a setting unit | 02-10-2011 |
20120206615 | Drive Unit and Drive Module - To provide a drive unit and a drive module which include a shape memory alloy as a drive source to move a driven member and are capable of the high-precision movement of the driven member to a reference position. A drive unit and a drive module can be provided by controlling, in the drive unit and the drive module which include the shape memory alloy as the drive source to move the driven member, the shape memory alloy so that the resistance of the shape memory alloy is equal to the resistance when the driven member is located at the reference position. | 08-16-2012 |
Patent application number | Description | Published |
20100134558 | CARRIAGE AND RECORDING APPARATUS PROVIDED THEREWITH - A carriage mounting a head unit having a recording head thereon and reciprocatably supported on a recording apparatus, the carriage includes: a displacement mechanism displacing the head unit in the direction intersecting with a head surface of the recording head; and a tilt angle adjusting mechanism to adjust a tilt angle of the head unit in a rotation direction along the head surface. The tilt angle adjusting mechanism has a slidably contacting member slidably contacting with the head unit in the case of the displacement of the head unit to define the tilt angle of the head unit, and has an adjusting eccentric cam engaging with the slidably contacting member to adjust the position of the slidably contacting member. | 06-03-2010 |
20110032305 | RECORDING APPARATUS - A recording apparatus includes: a recording head that ejects ink; a sheet material that receives ink discarded from the recording head directly from the recording head or indirectly via another member; an ink absorption material that absorbs ink, and includes an ink absorption surface that forms a surface that intersects with an ink receiving surface of the sheet material that receives ink, and faces the ink receiving surface; and a sheet material movement unit that causes the sheet material to slide in at least a direction in which the ink receiving surface approaches the ink absorption surface. | 02-10-2011 |
20110292148 | RECORDING DEVICE - A recording device includes a cassette having a protruding portion; a lever as a transmission member in which the distance from a shaft portion to an abutting portion is shorter than the distance from the shaft portion to a connection portion, the lever transmitting a force that the abutting portion receives from the cassette to the connection portion as an acting force by rotating on shaft portion as the axis when the protruding portion of the cassette abuts on the abutting portion; a damper mechanism portion; a separation slope separating the papers; and a stopper as a restriction member restricting the movement of the papers at an upstream side position in the installation direction of the separation slope, and releasing the restriction on the movement of papers by retreating from the position where the stopper restricts the papers when receiving the acting force from the damper mechanism portion. | 12-01-2011 |
20120235345 | RECORDING MATERIAL FEED CASSETTE AND RECORDING APPARATUS - A recording material feed cassette includes first and second cassette portions. The second cassette portion is assembled so as to be capable of extending/retracting relative to the first cassette portion and, along with the first cassette portion, contains a recording material. A locking mechanism fixes the position of the second cassette portion relative to the first cassette portion. The locking mechanism has a lock portion capable of moving in a first direction that is orthogonal to the extension/retraction direction so as to take on a locked position and an unlocked position, an operation portion that is capable of moving in a second direction that follows the extension/retraction direction, and a connection portion that connects the lock portion and the operation portion and that is capable of deforming as a result of the movement of the lock portion in the first direction. | 09-20-2012 |
20130293634 | RECORDING APPARATUS AND LIQUID EJECTING APPARATUS - A recording apparatus includes a carriage which includes a recording head performing recording on a medium and is movable in a first direction; a shaft-shaped guide shaft which guides the carriage in the first direction and extends in the first direction; and a lubricant guiding unit which guides a lubricant to a sliding contact portion between the carriage and the guide shaft, wherein the lubricant guiding unit includes a cylindrical member which is loosely fitted on outside the guide shaft and the cylindrical member is rotated when the carriage is moved. | 11-07-2013 |
20140292880 | RECORDING DEVICE - Proper recording is performed whether a device is tilted or not while a cost increase is suppressed. A recording device includes a recording head which performs recording on a medium, a carriage which is moved in a first direction and a second direction opposite to the first direction, a guide which guides the carriage in the first direction and the second direction, a drive motor which drives the carriage, and a controller which executes a reciprocation load detection mode where a driving load on the drive motor due to a tilt of the recording device in a movement of the carriage in the first direction is detected and a driving load on the drive motor due to the tilt of the recording device in a movement of the carriage in the second direction is detected. | 10-02-2014 |
20150070414 | RECORDING APPARATUS - A recording apparatus includes a guiding shaft as a guiding portion that extends in a main scanning direction, a carriage, which is provided with a recording head that ejects ink, and which moves in the main scanning direction by sliding along the guiding shaft, and pressing units, which is provided in the carriage, and which presses the guiding shaft in a sub-scanning direction, and a sliding resistance is changed using the pressing units. | 03-12-2015 |
20150375544 | Fluid Ejecting Apparatus - A printing apparatus includes a cartridge, and a wiring cable which can transmit an electrical signal to the cartridge. The carriage is provided with a connector unit and a wiring board in a holder unit on which the cartridge is mounted. First and second electrode portions, and a connector unit are arranged on a first face of the wiring board. The wiring board is arranged at a position of being overlapped with the cartridge in a direction which goes along an arrow Y. A width of the wiring board in an arrow X direction is the same as a width of a cartridge arranging region in the holder unit, or is smaller than that. | 12-31-2015 |
Patent application number | Description | Published |
20090072806 | ELECTRONIC DEVICE HAVING MULTI-POWER SOURCE INTEGRATED CIRCUIT - An electronic device includes: an integrated circuit having a first circuit part, a second circuit part, a first power source line of the first circuit part, a second power source line of the second circuit part, and a coupling switch coupling the first power source line and the second power source line; a power source supply part which generates a power source to be supplied to the first and second circuit parts and which has a power source supply control circuit controlling the supply of power source to the second circuit part; and a power source control part that controls the power source supply control circuit and the coupling switch, wherein the power source control part controls the power source supply control circuit so as to supply a power source in accordance with the operating state of the second circuit part and closes the coupling switch. | 03-19-2009 |
20090316316 | ELECTRICAL CIRCUIT - An electrical circuit includes a first power supply line, a second power supply line, a detection circuit, a first switch device, and a nonlinear device. The detection circuit is connected to the first power supply line, and includes an output section that outputs a detection signal by detecting a change in potential of the first power supply line. The first switch device is provided between the first power supply line and the second power supply line, and is controlled by the detection signal. The nonlinear device is provided between the first or the second power supply line and the output section. | 12-24-2009 |
20090322297 | SERIES REGULATOR CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT - A series regulator circuit includes one or more transistors each having a channel with one end coupled to an input node to receive an input voltage and another end coupled to an output node, and having a control node to receive a control voltage, a control circuit configured to adjust the control voltage in response to a voltage of the output node such that the voltage of the output node is set equal to a voltage setting selected by an output voltage setting signal, and a switch circuit configured to change an operating condition, excluding the control voltage, of the one or more transistors in conjunction with a change in the voltage setting of the output node. | 12-31-2009 |
20110006606 | VOLTAGE REGULATOR CIRCUIT - A voltage regulator circuit includes: a first pulse generator configured to output a pulse whose level remains unchanged when an input signal of a first circuit is in a first period, and whose level changes from a second level to a first level when an edge of the input signal of the first circuit is detected after the first period; a second pulse generator configured to output a pulse from a time that the pulse output by the first pulse generator becomes the first level until a second period elapses; a first field-effect transistor having a source connected to a power supply potential node, and a drain connected to a power supply potential terminal of the first circuit; and a first switch configured to cause a potential at a gate of the first field-effect transistor to be a first potential. | 01-13-2011 |
20110304380 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits. | 12-15-2011 |