Ho, Hsinchu County
Chang-Yu Ho, Hsinchu County TW
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20110037475 | Battery Capacity Estimation by DCIR - A method of battery capacity measurement is actualized by battery internal resistance. This method establishes a controlled discharge path inside the battery module. The battery discharge current is a constant value despite of the variation of system loading current. The internal resistance measured by establishing this constant battery current can be used to obtain the battery capacity precisely. | 02-17-2011 |
20110193527 | Lithium Battery Module - A lithium battery module with multiple-cells connected in parallel is disclosed. The lithium battery module comprises a battery management unit, a power converter (optional) and each cell with an individual charging control switch and a discharging control switch in series connected with the cell and is independent controlled by the battery management unit so that a charger is capable of charging the designate cell or more or disable one among them. | 08-11-2011 |
20120112688 | Battery Module with Less Charging Time and Charging Method of the Same - The battery module comprises a main battery, a voltage converter, an auxiliary device, a battery management unit and a first set of switching devices and a second set of switching devices. The main battery provides the electric power. The auxiliary device is used to store the electric power. The battery management unit controls the main battery and the auxiliary device to charge or discharge through a first set of switching devices and a second set of switching devices, respectively. When the battery module is charged by an external charger, the auxiliary device and the main battery are charged simultaneously. When the external charger stops to charge the battery module, the battery management unit controls the auxiliary device through the second set of switching devices to continuously charge the main battery through the voltage converter. | 05-10-2012 |
Chan-Hsiao Ho, Hsinchu County TW
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20130079688 | APPARATUS OF CARDIOPULMONARY RESUSCITATOR - The present disclosure discloses an apparatus of cardiopulmonary resuscitator that is operated through a driving mechanism controlled and driven by air power. The driving mechanism functions to actuate a belt adapted to extend around a chest of a patient to generate reciprocating movement of pressing and releasing so as to achieve a purpose of cardiopulmonary resuscitation for recovering heartbeat and breathing of the patent. | 03-28-2013 |
20150039270 | METHOD FOR INSPECTING DEFECTS OF SOLAR CELLS AND SYSTEM THEREOF - A method and a system for inspecting a defect of a solar cell are provided, and the method includes: receiving inspecting data corresponding to the solar cell from an inspecting device; obtaining a current-voltage (I-V) curve of the solar cell according to the inspecting data; defining a first reference region on the I-V curve, and obtaining a plurality of first curve characteristics of the I-V curve in the first reference region; determining a defect type of the solar cell according to the first curve characteristics. | 02-05-2015 |
Chao-Wei Ho, Hsinchu County TW
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20130044122 | COLOR ADJUSTMENT CIRCUIT, DIGITAL COLOR ADJUSTMENT DEVICE AND MULTIMEDIA APPARATUS USING THE SAME - A digital color adjustment device for a multimedia apparatus is provided. The digital color adjustment device performs color adjustment on a received pixel color data and sends to a display unit of the multimedia apparatus for display. The digital color adjustment device includes a hue shift lookup table, a saturation mapping lookup table, a brightness transformation lookup table and a non-linear output lookup table. The digital color adjustment device performs gamut mapping non-linear adjustment and/or independent color non-linear adjustment. | 02-21-2013 |
Chia-Che Ho, Hsinchu County TW
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20150076505 | PATTERNED OPTO-ELECTRICAL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a patterned opto-electrical substrate, comprising a substrate, the substrate has a first patterned structure, a spacer region and a second patterned structure, wherein the second patterned structure is formed on one or both of the first patterned structure and the spacer region, and the first patterned structure is a micron-scale protruding structure or a micron-scale recessing structure, while the second patterned structure is a submicron-scale recessing structure. The present invention also relates to a method for manufacturing the aforementioned patterned opto-electrical substrate and light emitting diodes having the aforementioned patterned opto-electrical substrate. | 03-19-2015 |
Chia-Chiang Ho, Hsinchu County TW
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20130089153 | IMAGE COMPRESSION METHOD, AND ASSOCIATED MEDIA DATA FILE AND DECOMPRESSION METHOD - An image compression and decompression method is provided. The method includes steps of: dividing an original frame into a first portion and a second portion, scaling down the second porting to generate a shrunk portion, and recomposing the first portion and the shrunk portion to generate a recomposition frame and auxiliary information. The recomposition frame has a same size as that of the original frame. The recomposition frame is then encoded into frame data which is combined with the auxiliary information to generate a compressed data file. | 04-11-2013 |
20130301726 | METHOD AND ASSOCIATED APPARATUS FOR VIDEO DECODING - A method for video decoding includes: dividing a plurality of luma component data of a reference frame into a plurality of primary data and a plurality of secondary data, respectively stored in a first memory region and a second memory region; accessing the first memory region to perform a motion estimation; and accessing the second region to perform a luma motion compensation. | 11-14-2013 |
Chien-Hung Ho, Hsinchu County TW
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20120000066 | Method for Manufacturing Alloy Resistor - An alloy resistor and a fabrication method thereof are provided. A fabrication method of an alloy resistor includes: providing an alloy sheet having a plurality of openings spacing apart from each other and going through the alloy sheet and a plurality of alloy resistor units located between any two adjacent openings, wherein each of the alloy resistor units has an insulating cover area and a plurality of electrode ends on both sides of the insulating cover area; forming an insulating layer on a surface of the insulating cover area of the alloy resistor units by an electrodeposition coating process; cutting the alloy along a connecting portion, so as to obtain separated alloy resistor units; and forming a conductive adhesion material on the electrode ends of the alloy resistor units. An alloy resistor having an insulating layer with a smooth surface can be obtained by performing an electrodeposition coating process. | 01-05-2012 |
20120001212 | Light-Emitting Diode Packaging Structure and Substrate Therefor - A light-emitting diode (LED) packaging structure and a substrate for the packaging structure are provided. The light-emitting diode packaging structure includes a metal substrate having a first surface and a second surface opposite to the first surface, and the first surface has a concave portion with a sidewall and a bottom, allowing an anode film to be formed on the metal substrate; a plurality of electrically conductive pads formed on the bottom of the concave portion; an optical treatment layer formed on the sidewall of the concave portion; and an LED die mounted on the bottom of the concave portion and electrically connected to the electrically conductive pads. Desired electrical insulating property between any two adjacent electrically conductive pads can be obtained by the anode film formed on the metal substrate, while a good thermal conductivity of the metal substrate is maintained. | 01-05-2012 |
20120211792 | Package Substrate and Method for Forming the Same - A package substrate is disclosed. The package substrate includes a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions. A method for forming the package substrate is also disclosed. | 08-23-2012 |
20120317806 | Method for Forming Package Substrate - A method of making a package substrate includes steps of forming a plurality of trenches on a first surface of a metal plate, placing insulation material in the trenches, removing metal plate material under the second surface of the metal plate, and exposing the insulation material in the trenches from substrate. The resulting substrate body includes a conductive portion made of the metal plate, and an insulation portion made of the insulation material. The bonding layers on the opposite sides of the substrate are conducted by the conductive portion for heat dissipation, and are separated from one another by the insulation portion. | 12-20-2012 |
20130048602 | Method of Manufacturing a Metallized Ceramic Substrate - A method of manufacturing a metallized ceramic substrate includes forming a metal layer on a ceramic substrate, and forming on the metal layer a resist having a first patterned resist opening and a second patterned resist opening for the metal layer to be exposed therefrom. A first width of the first patterned resist opening is greater than the thickness of the metal layer, and a second width of the second patterned resist opening is less than the thickness of the metal layer. A wet-etching process is conducted, to form in the first patterned resist opening a patterned metal layer opening and form in the second patterned resist opening a patterned metal layer dent. Therefore, an internal stress between the metal layer and the ceramic substrate is reduced, and the yield rate and reliability of the metallized ceramic substrate is increased. | 02-28-2013 |
20130082292 | Light Emitting Diode Packaging Structure and Method of Fabricating the Same - A method of fabricating alight emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and the metallized ceramic heat dissipation substrate is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure of the present invention may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost. | 04-04-2013 |
20130089982 | Method of Fabricating a Substrate Having Conductive Through Holes - A method of fabricating a substrate having a plurality of conductive through holes is disclosed. Release films are formed on opposite sides of a substrate, and a plurality of through holes penetrating the release films and the substrate are formed. A first metal layer is formed on the release films and the sidewall of each of the through holes prior to removing the release films and the first metal layer thereon. A second metal layer is formed on the first metal layer on the sidewalls of the through holes by electroless plating. Compared to the prior art, the method is simpler and cheaper to carry out while the conductive through holes and a surface circuit layer thereof are fabricated separately, thereby avoiding disadvantage of forming a circuit layer on the surface of the substrate too thick. | 04-11-2013 |
20130098867 | Method for Selective Metallization on a Ceramic Substrate - A method of selective metallization on a ceramic substrate includes selectively forming an active brazing material on a predetermined area of a surface of a ceramic substrate, attaching the metal layer to the ceramic substrate with the active brazing material, performing a brazing process on the active brazing material, forming an etching stop layer on the metal layer and performing an etching process, and removing the etching stop layer. The method can be applied to a severe environment, and the conchoidal fracture between the ceramic substrate and the metal layer can also be avoided. The present invention not only simplifies the process but also improves the product yield. | 04-25-2013 |
20140001051 | Method of Electroplating and Depositing Metal | 01-02-2014 |
20140167911 | Resistor Component - A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability. | 06-19-2014 |
20140170848 | Method of Forming Substrate - A method of forming a substrate is provided, which includes steps of providing a metal plate having a first surface and a second surface; forming a plurality of recesses on the first surface of the metal plate by using laser cutting technique; filling the plurality of recesses with an insulating material; removing a part of the metal plate in a direction of from the second surface to the first surface, so that two ends of the insulating material are exposed, and a substrate body is formed by a conductor portion formed by the remaining part of the metal plate and an insulating portion formed by the insulating material; and forming a circuit layer on a first surface of the substrate body and a circuit layer on a second surface of the substrate body is provided. Thus, the two circuit layers are electrically connected by the conductor portion that also provides a heat dissipation path and are separated by the insulating portion. | 06-19-2014 |
20150303362 | Ceramic Substrate and Semiconductor Package Having the Same - A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers. | 10-22-2015 |
20150305201 | Carrier and Package Having the Carrier - A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements. | 10-22-2015 |
20160049372 | Ceramic substrate, package substrate, semiconductor chip package component and manufacturing method thereof - A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate. | 02-18-2016 |
Chih-Lin Ho, Hsinchu County TW
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20120141334 | SOLID REACTANT SHEET, SOLID REACTANT STACK, AND FUEL CARTRIDGE - A solid reactant sheet, a solid reactant stack, and a fuel cartridge are provided. The solid reactant sheet comprises an adhesive film and a plurality of solid reaction particles. The adhesive film has a first surface, a second surface opposite to the first surface, and a plurality of through holes connected between the first surface and the second surface. The plurality of solid reaction particles are adhered to the first surface, and the solid reaction particles react with a reactant for generating a gas. Furthermore, a solid reactant stack and a fuel cartridge are also provided. | 06-07-2012 |
20120251916 | FUEL CELL UNIT - A fuel cell unit including a membrane electrode assembly (MEA), a cathode collector plate, an anode collector plate, and a plurality of ribs is provided. The cathode collector plate is disposed at one side of the membrane electrode assembly. The anode collector plate is disposed at another side of the membrane electrode assembly. A material of the anode collector plate may be metal. The ribs are respectively disposed on the anode collector plate. A material of the ribs may be metal. The ribs and the anode collector slate form a plurality of gas channels for supplying a reaction gas to the membrane electrode assembly. | 10-04-2012 |
Chin Fu Ho, Hsinchu County TW
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20120218420 | Apparatus and Method for Calibrating Audio-Visual Signal - An apparatus for calibrating an audio-visual (AV) signal includes a controller for generating a control signal, a controllable filter for selectively filtering the AV signal in response to the control signal to output either the AV signal or a filtered AV signal; and a calibrator for generating a group of calibrating coefficients according to the filtered AV signal and calibrating the AV signal according to the group of calibrating coefficients. | 08-30-2012 |
Chung-Lien Ho, Hsinchu County TW
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20130178202 | Method and Communication Device for Handling Time Offsets between Communication Device and Transmission Points - A method of handling a plurality of time offsets between a communication device of a wireless communication system and a plurality of transmission points of the wireless communication system is disclosed. The method is utilized in the communication device, and comprises obtaining the plurality of time offsets by using a first reference signal; and transmitting the plurality of time offsets to the plurality of transmission points, respectively; wherein the plurality of transmission points compensate the plurality of time offsets, respectively, when communicating with the communication device. | 07-11-2013 |
Chung W. Ho, Hsinchu County TW
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20130319620 | BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF - A board separation apparatus and an operating method thereof are provided. The board separation apparatus includes a board separation machine and a composite board constituted of a plurality of circuit boards and carrier panels. The board separation machine includes a frame, first and second suction devices, and a linkage. The second suction device is positioned above the first suction device, and the composite board is placed in between the suction devices. The linkage connects the driving mechanism and second suction device. A separable interface layer is located in the composite board. When the suction devices are powered up to stick to the top and the bottom surfaces of the composite board, the linkage is pushed by the driving mechanism, so that the second suction device can move in relation to the first suction device, and one of the circuit board is separated from another one of the carrier panels. | 12-05-2013 |
Chun-Lung Ho, Hsinchu County TW
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20150282384 | FAN HOLDING STRUCTURE, HEAT-DISSIPATING MODULE WITH THE FAN HOLDING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - A heat-dissipating module including a fan holding structure and a fan is disclosed. The fan holding structure includes: a carrying body, at least one resilient clamping member, at least one resilient engaging member, and a plurality of resilient fixing members. The at least one resilient clamping member and the resilient fixing members are arranged on the carrying body. An electronic device includes an opening and at least one engaging member. The resilient engaging member corresponds to the engaging member, so that the heat-dissipating module with the fan holding structure is detachably arranged at the opening. The fan of the heat-dissipating module can be quickly and effectively detached and attached through the at least one resilient clamping member and the resilient fixing members. | 10-01-2015 |
20150331441 | OPERATION MEMBER AND ELECTRONIC DEVICES HAVING THE SAME - An operation member includes a body having an operating end and a coupling end, and a skirt member. The skirt member is arranged at the coupling end. The skirt member includes a base plate outwardly extending from the coupling end, a wall extending from the base plate, and a groove defined between the outer surface of the wall and the body. The electronic device includes a casing, an operation member, and a circuit module. The casing has portions defining an opening. The circuit module has a circuit board including a controller disposed thereon. The above-mentioned operation member is sleeved onto the controller and passes through the opening. The outer surface of the operation member and the opening define a gap therebetween. The groove is correspondingly arranged proximate to the gap to gather small particles entering the gap. | 11-19-2015 |
Fang-Yu Ho, Hsinchu County TW
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20150044591 | Fuel Cell Pack and Fuel Cell Pack Assembly - A fuel cell pack is disclosed. The fuel cell pack has N membrane electrode assemblies, N−1 connected conductive planes, an independent first electrode conductive layer, and an independent second electrode conductive layer, wherein N is an integer and 2≦N≦3000. Each connected conductive plane has a first electrode conductive layer and a second electrode conductive layer, wherein the first electrode conductive layer connects to the second electrode conductive layer. The independent first electrode conductive layer is corresponding to the second electrode conductive layer of the N−1th connected conductive plane; the independent second electrode conductive layer is corresponding to the first electrode conductive layer of the 1 | 02-12-2015 |
Fu-Yen Ho, Hsinchu County TW
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20140145976 | COLOR FILTER SUBSTRATE, IN-CELL OPTICAL TOUCH DISPLAY PANEL INCLUDING THE SAME AND MATERIALS OF INFRARED FILTER LAYER - A color filter substrate for an in-cell optical touch display panel is provided, which includes a substrate, a visible-light shielding structure, a color filter layer and an infrared filter layer. The visible-light shielding structure is disposed on the substrate to define sub-pixel regions and touch sensor regions of the substrate. The color filter layer covers the sub-pixel regions. The infrared filter layer covers the touch sensor regions. The infrared filter layer is made of a single infrared-light permeable material, which has a light transmittance in infrared-light wavelength range greater than a light transmittance in visible-light wavelength range. An in-cell optical touch display panel including the color filter substrate and materials of the infrared filter layer are also provided. | 05-29-2014 |
Hsin-Chia Ho, Hsinchu County TW
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20150330886 | APPARATUS AND METHOD FOR MIXING SOLUTION AND SYSTEM AND METHOD FOR MONITORING PARTICLES IN SOLUTION - An apparatus for mixing a solution includes first and second tanks, a sampling element, a flow control element, a mixing assembly, first and second air-intake systems, and first and second air-exhaust systems. The first tank has a first chamber. The second tank has a second chamber. The sampling element has an extraction port located in the first chamber. The flow control element connects and communicates with the first chamber. Two opposite ends of the mixing assembly connect and communicate with the first chamber and the second chamber, respectively. The first air-intake system and the first air-exhaust system connect and communicate with the first chamber. The second air-intake system and the second air-exhaust system connect and communicate with the second chamber. | 11-19-2015 |
20150340201 | APPARATUS AND METHOD OF APPLYING SMALL-ANGLE ELECTRON SCATTERING TO CHARACTERIZE NANOSTRUCTURES ON OPAQUE SUBSTRATE - An apparatus and methods for small-angle electron beam scattering measurements in a reflection or a backscattering mode are provided. The apparatus includes an electron source, electron collimation optics before a sample, electron projection optics after the sample, a sample stage capable of holding the sample, and a electron detector module. The electrons emitted from the source are collimated and positioned to impinge nanostructures on the sample. The signals resulting from the interactions between the impinging electrons and the nanostructures are further magnified by the electron projection optics to reach a sufficient angular resolution before recorded by the electron detector module. | 11-26-2015 |
Hsin-Liang Ho, Hsinchu County TW
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20160006348 | CHARGE PUMP APPARATUS - The invention provides a charge pump apparatus including a clock signal generator, a clock freezing circuit, a charge pump circuit, and a feedback circuit. The clock signal generator generates a clock signal. The clock freezing circuit directly receives the clock signal and an enable signal. The clock freezing circuit decides whether to pass or latch a voltage level of the clock signal according to the enable signal to generate a controlled clock signal. The charge pump circuit directly receives the controlled clock signal and operates a charge pump operation on an input voltage to generate a pumping voltage. | 01-07-2016 |
Hui-Chun Ho, Hsinchu County TW
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20100108002 | MULTI-CAM ELECTRIC VALVE MECHANISM FOR ENGINE - A multi-cam electric valve mechanism for engine is disclosed, which comprises: a motor fixed on a cylinder; a motor shaft wherein one side of it connected to the motor and rotated accordingly and the other side of it symmetrically provided with a plurality of rotors whose shafts are perpendicular to the motor shaft; a ring-shaped cam with a plurality of wave-shaped grooves on the circumference thereof corresponding to the rotors and for setting same; a rotation-stopping lever connected to the cylinder and cam respectively to let the cam linearly move along with it; and a valve lever wherein one side of it connected to the cam and the other side of it connected to a valve. | 05-06-2010 |
20100120577 | SPEED ADJUSTING MECHANISM FOR ROLLER TRACTION TOROIDAL CONTINUOUSLY VARIABLE TRANSMISSION - A speed adjusting mechanism for roller traction toroidal continuously variable transmission is disclosed, which comprises an input disk; an output disk coaxially and symmetrically positioned relative to the input disk; a rotation shaft thought the axis of input disk and output disk; a screw rod coaxially connected to the rotation shaft and being rotated accordingly; and a plurality of friction balls respectively contact with the input disk and output disk and rotate same; each friction ball respectively revolved on its own center axis and each center axis respectively connected to a supporting bracket and each supporting bracket respectively connected to an arc-shaped screw gear; wherein the screw rod is engaged to the screw gears so that they will rotate correspondingly to let each center axis tilt to the same extent so that the input disk and out disk will have different rotation rate. | 05-13-2010 |
20120126545 | ENGINE DEVICE - An engine device includes an engine, a power generating portion, a motor portion, and a transmission mechanism. The engine includes a piston and a cylinder, and the piston is arranged in the cylinder and moves back and forth between a top dead center and a bottom dead center. The power generating portion and the motor portion are annularly disposed on the periphery of the cylinder. When the piston moves from the top dead center towards the bottom dead center, the transmission mechanism drives a power generating rotor of the power generating portion to move correspondingly in a direction opposite to that of the piston and enables the power generating portion to generate electric power. When the piston is located at the bottom dead center, the motor portion actuates a motor rotor to move, and pushes the piston to move towards the top dead center through the transmission mechanism. | 05-24-2012 |
20140159512 | STATOR STRUCTURE - A stator structure includes a main body having multiple frames each having an arc panel, a main tooth, at least one secondary tooth, at least one main coil and at least one secondary coil. The main tooth and the secondary tooth are disposed at one face of the arc panel. The main coil is installed at the main tooth, and the secondary coil is installed at the secondary coil. A rotor is penetrated through the stator structure. The frames are in a multi-layer circular arrangement at the rotor, and a dislocation angle exists between the frame at any layer and the frame at the neighboring layer. | 06-12-2014 |
Hung Hui Ho, Hsinchu County TW
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20100128175 | DATA DECODING DEVICES AND DECODING METHODS THEREOF - Data decoding devices avoiding data error from incorrect sampling points caused by serious interference are disclosed. The data decoding devices receive an analog signal carrying a reference clock and at least one digital data. In the data decoding device, a slicer slices the analog signal at different sampling points by first and second sampling clocks to obtain first and second bitstreams, and the first and second sampling clocks have the same frequency and a predetermined phase difference. A data check unit evaluates whether the first bitstream is erroneous according to an error checking code thereof, outputs the first bitstream if it is error-free, and evaluates whether the second bitstream is erroneous according to the error checking code if the first bitstream is erroneous. | 05-27-2010 |
20110216982 | IMAGE DATA COMPRESSION APPARATUS FOR REFERRING TO AT LEAST ONE CHARACTERISTIC VALUE THRESHOLD TO SELECT TARGET COMPRESSION RESULT FROM CANDIDATE COMPRESSION RESULTS OF ONE BLOCK AND RELATED METHOD THEREOF - An exemplary image data compression apparatus includes a compression circuit, a characteristic value extracting circuit, and a selecting circuit. The compression circuit is utilized for applying a plurality of different compression approaches to a first block, and accordingly generating a plurality of first candidate compression results of the first block. The characteristic value extracting circuit is coupled to the compression circuit, and utilized for deriving a plurality of first characteristic values from the first candidate compression results, respectively. The selecting circuit is coupled to the compression circuit and the characteristic value extracting circuit, and utilized for selecting a target compression result of the first block from the first candidate compression results according to the first characteristic values and at least one characteristic value threshold. | 09-08-2011 |
I-Lin Ho, Hsinchu County TW
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20110171765 | MULTI-FIELD ARRANGING METHOD OF LED CHIPS UNDER SINGLE LENS - A multi-field arranging method of LED chips under a single lens includes the steps of: setting a first concentric circle on a bottom of a hemispherical lens, wherein the first concentric circle is centered at an axis of the hemispherical lens; and equidistantly arranging at least one first color chip, at least one second color chip and at least one third color chip on the first concentric circle in sequence. The present invention allows the color chips to present symmetrical light patterns through the hemispherical lens, thereby obtaining a light field with evener color mixture. | 07-14-2011 |
King-Yuan Ho, Hsinchu County TW
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20130141480 | SYSTEM AND METHOD FOR IMPROVING VISUAL EFFECT OF A DISPLAY DEVICE - A display system is disclosed. The display system comprises a display device; and a computing device. The computing device executes instructions to receive a first plurality of sub-pixel values of a first plurality of sub-pixels of an image. The first plurality of sub-pixels have a plurality of colors. The computing device further executes instructions to select a first sub-pixel of the first plurality of sub-pixels. The first sub-pixel has a first color and is spatially close to a second sub-pixel of the first plurality of sub-pixels. The second sub-pixel has the first color. The computing device further executes instructions to generate a second plurality of sub-pixel values of a second plurality of sub-pixels based on at least first and second sub-pixel values corresponding to the first and second sub-pixels of the first plurality of sub-pixels. | 06-06-2013 |
20130168666 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device is provided. A first semiconductor layer is disposed on a substrate and has a channel region and two doped regions beside the channel region. A first dielectric layer is disposed on the substrate and covers the first semiconductor layer. A gate is disposed on the first dielectric layer and corresponds to the channel region of the first semiconductor layer. A second dielectric layer is disposed on the first dielectric layer and covers the gate. A second semiconductor layer is disposed on the second dielectric layer and corresponds to the gate. The boundary of the second semiconductor layer does not exceed that of the gate. At least one first conductive plug penetrates through the first and second dielectric layers and contacts one doped region of the first semiconductor layer. At least one contact contacts the second semiconductor layer. A method of forming a semiconductor device is also provided. | 07-04-2013 |
Kung-Chi Ho, Hsinchu County TW
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20090026470 | SUPER THIN SIDE-VIEW LIGHT-EMITTING DIODE (LED) PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a side-view LED package is provided. A chip carrier is provided. An opaque housing is bonded with the chip carrier. An LED chip electrically connects the chip carrier by performing a chip-bonding process and the opaque housing has a cavity for accommodating the LED chip. A transparent encapsulant is disposed in the cavity wherein the transparent encapsulant has a side-view light output surface uncovered by the opaque housing and light emitted from the LED chip is output via the side-view light output surface. A portion of the opaque housing and a portion of the transparent encapsulant are removed for reducing an overall thickness of the opaque housing such that a top surface of the transparent encapsulant is uncovered by the opaque housing beside the side-view light output surface. An opaque protective layer is formed on the top surface of the transparent encapsulant and the opaque housing. | 01-29-2009 |
20100084683 | LIGHT EMITTING DIODE PACKAGE AND FABRICATING METHOD THEREOF - A light emitting diode (LED) package is provided. The LED package includes a carrier, a package housing, a strength enhancement structure, an ESD protector and an LED chip. The carrier has a first surface and a second surface. The carrier includes a first electrode and a second electrode, wherein a gap is between the first electrode and the second electrode. The package housing is disposed on the carrier and has a first aperture and a second aperture. The first surface is exposed by the first aperture while the second surface is exposed by the second aperture. The strength enhancement structure is disposed at the gap. The ESD protector is disposed on the carrier and located within the second aperture. The LED chip is disposed on the carrier and located within the first aperture, wherein the ESD protector and the LED chip is electrically connected to the carrier. | 04-08-2010 |
20120169251 | LIGHT EMITTING DIODE LAMP AND METHOD FOR FABRICATING THE SAME - A structure of a light emitting diode (LED) lamp and a method for fabricating the same are provided. In the structure of the LED lamp, LEDs are designed to approach an inner surface of a lampshade more closely, so that the LED lamp has high brightness and high light-use efficiency. The method for fabricating the LED lamp includes the following steps. First, a holder is provided and at least one flexible LED light bar is assembled on the holder. The flexible LED light bar is then forced to approach the holder, and the flexible LED light bar as well as the holder are inserted into the lampshade. After the flexible LED light bar and the holder are inserted into the lampshade, the flexible LED light bar is bent outward to approach the inner surface of the lampshade. After that, the holder and the lampshade are assembled on a socket. | 07-05-2012 |
Kunlin Ho, Hsinchu County TW
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20100005230 | DATA STORING METHODS AND APPARATUS THEREOF - A data storing method for non-volatile memory is provided, wherein the non-volatile memory includes at least one memory block having a plurality of strong pages and weak pages. A logic block writing command is received for storing the corresponding writing data into the memory block. It is then determined whether the writing data is larger than one page. The writing data is divided into a plurality of page data according to the memory size of the page when the writing data is larger than one page. Next, a first storing page for each page data is determined according to a starting writing page according to the logic block writing command. And, the page data are sequentially written into the first storing pages. Note that each first storing page is a strong page within the memory block. | 01-07-2010 |
Li-Hsun Ho, Hsinchu County TW
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20090243004 | Integrated structure for MEMS device and semiconductor device and method of fabricating the same - The present invention relates to an integrated structure for a MEMS device and a semiconductor device and a method of fabricating the same, in which an etch stopping device is included on a substrate between the MEMS device and the semiconductor device for protecting the semiconductor device from lateral damage when an oxide releasing process is performed to fabricate the MEMS device. The etch stopping device has various profiles and is selectively formed by an individual fabricating process or is simultaneously formed with the semiconductor device in the same fabricating process. It is a singular structure or a combined stacked multilayered structure, for example, a plurality of rows of pillared etch-resistant material plugs, one or a plurality of wall-shaped etch-resistant material plugs, or a multilayered structure of a stack of which and an etch-resistant material layer. | 10-01-2009 |
20100002894 | MEMS device and method of making the same - A MEMS device includes a vent hole structure and a MEMS structure disposed on a same side of a substrate. The vent hole structure adjoins the MEMS structure with an etch stop structure therebetween. The MEMS structure includes a chamber, the vent hole structure includes a metal layer having at least a hole thereon as a vent hole to connect the chamber of the MEMS structure through the etch stop structure. Accordingly, the MEMS device has a lateral vent hole. Furthermore, as the vent hole structure and the MEMS structure are disposed on the same side of the substrate, the manufacturing process is convenient and timesaving. | 01-07-2010 |
20100052179 | MEMS STRUCTURE AND METHOD FOR FABRICATING THE SAME - A microelectromechanical system (MEMS) structure and a fabricating method thereof are described. The MEMS structure includes a fixed part and a movable part. The fixed part is disposed on and connects with a substrate. The movable part including at least two first metal layers, a first protection ring and a first dielectric layer is suspended on the substrate. The first protection ring connects two adjacent first metal layers, so as to define a first enclosed space between the two adjacent first metal layers. The first dielectric layer is disposed in the enclosed space and connects the two adjacent first metal layers. | 03-04-2010 |
20100074458 | STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER AND FABRICATING METHOD THEREOF - A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region. | 03-25-2010 |
20100317138 | METHOD FOR FABRICATING MEMS STRUCTURE - A method for fabricating a MEMS is described as follows. A substrate is provided, including a circuit region and an MEMS region separated from each other. A first metal interconnection structure is formed on the substrate in the circuit region, and simultaneously a first dielectric structure is formed on the substrate in the MEMS region. A second metal interconnection structure is formed on the first metal interconnection structure, and simultaneously a second dielectric structure, at least two metal layers and at least one protection ring are formed on the first dielectric structure. The metal layers and the protection ring are formed in the second dielectric structure and the protection ring connects two adjacent metal layers to define an enclosed space between two adjacent metal layers. The first dielectric structure and the second dielectric structure outside the enclosed space are removed to form an MEMS device in the MEMS region. | 12-16-2010 |
20120205045 | SEMICONDUCTOR MACHINE AND CLEANING PROCESS THEREOF - A semiconductor machine and a cleaning process are provided. The semiconductor machine includes a chamber and a cleaning module. The cleaning process includes the following steps. Firstly, the semiconductor machine is used to perform a semiconductor manufacturing process, wherein a titanium-based material is etched in the semiconductor manufacturing process. Then, a cleaning task is activated to clean the semiconductor machine by using a cleaning agent including a gas mixture of a fluoride compound and oxygen. | 08-16-2012 |
20140291787 | STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER - A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate. | 10-02-2014 |
Ming-Feng Ho, Hsinchu County TW
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20150117819 | PLUGGABLE OPTICAL TRANSCEIVER MODULE - A pluggable optical transceiver module, connected to an optical signal interface which has an elastic plate having an aperture, includes a connector, a first cover, a second cover, a first fastening member, and a second fastening member. The connector includes a fixing block. The fixing block further has first and second fastening holes inwardly formed from the first and second surfaces of the fixing block, respectively. The first cover abuts against the first surface and has a first through hole communicated with the first fastening hole. The second cover abuts against the second surface and has a second through hole communicated with the second fastening hole. The second cover includes a first engaging block engaged in the aperture. The first and second fastening members are respectively fastened to the first and second fastening holes respectively via the first and second through holes. | 04-30-2015 |
Ming-Hsien Ho, Hsinchu County TW
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20160091997 | TOUCH PANEL HAVING RELATIVELY NARROW TRACE AREA AND MANUFACTURING METHOD THEREOF - Configurations of a touch panel having a relatively narrow trace area and a manufacturing method thereof are disclosed. In the proposed touch panel, the trace area includes a grounding layer, a first insulating layer configured on the grounding layer, and a first sensor trace configured on the first insulating layer. | 03-31-2016 |
Ming-Yu Ho, Hsinchu County TW
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20130278508 | TOUCH SENSING DEVICE AND TOUCH SENSING METHOD THEREOF - A touch sensing device is provided. The provided touch sensing device may include a touch sensing circuit having a conducting unit for generating an alternating current (AC) touch signal, a phase delaying circuit electrically coupled to the touch sensing circuit for receiving the AC touch signal and delaying the AC touch signal for a predetermined phase so as to derive a delayed signal, and a determination circuit electrically coupled to the touch sensing circuit and the phase delaying circuit for comparing intensities of the delayed signal and the AC touch signal with a predetermined threshold in order to derive a waveform-overlapping time period. When the waveform-overlapping time period is longer than a predetermined period, the determination circuit concludes the conducting unit is approached or contacted by the conductor. | 10-24-2013 |
Shien-Chih Ho, Hsinchu County TW
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20110316450 | BACKLIGHT DEVICE WITH ZONE CONTROL - A backlight unit usable in a liquid crystal display. In one embodiment, the backlight unit includes a substrate having an edge zone and a central zone surrounded by the edge zone, a first plurality of light emitting elements positioned in the central zone of the substrate, a second plurality of light emitting elements positioned in the edge zone of the substrate, and an electronic controlling means for controlling the light emitted from the first plurality of light emitting elements and the second plurality of light emitting elements such that in operation, the output power per unit area by the second plurality of light emitting elements in the edge zone is less than that by the first plurality of light emitting elements in the central zone. | 12-29-2011 |
Shiuan-Yi Ho, Hsinchu County TW
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20090323000 | PIXEL STRUCTURE - A pixel structure including a substrate, a scan line, a patterned common line, an active device, a data line, a passivation layer, and a pixel electrode is provided. The scan line, the patterned common line, and the active device are disposed on the substrate. The active device has an insulation layer extending outward to cover the scan line and the patterned common line. Besides, the patterned common line has at least a first side and a second side. Extending directions of the first side and the second side together form a first included angle. The data line is disposed on the insulation layer, and the active device is electrically connected to the scan line and the data line. The passivation layer covers the active device. The pixel electrode is disposed on the passivation layer and electrically connected to the active device. | 12-31-2009 |
Shou-Wen Ho, Hsinchu County TW
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20150121387 | TASK SCHEDULING METHOD FOR DISPATCHING TASKS BASED ON COMPUTING POWER OF DIFFERENT PROCESSOR CORES IN HETEROGENEOUS MULTI-CORE SYSTEM AND RELATED NON-TRANSITORY COMPUTER READABLE MEDIUM - A task scheduling method is applied to a heterogeneous multi-core system. The heterogeneous multi-core system has at least one first processor core and at least one second processor core. The task scheduling method includes: referring to task priorities of tasks of the heterogeneous processor cores to identify at least one first task of the tasks that belongs to a first priority task group, wherein each first task belonging to the first priority task group has a task priority not lower than task priorities of other tasks not belonging to the first priority task group; and dispatching at least one of the at least one first task to at least one run queue of at least one of the at least one first processor core. | 04-30-2015 |
20150121388 | TASK SCHEDULING METHOD FOR DISPATCHING TASKS BASED ON COMPUTING POWER OF DIFFERENT PROCESSOR CORES IN HETEROGENEOUS MULTI-CORE PROCESSOR SYSTEM AND RELATED NON-TRANSITORY COMPUTER READABLE MEDIUM - A task scheduling method is applied to a heterogeneous multi-core processor system. The heterogeneous multi-core processor system has at least one first processor core and at least one second processor core. The task scheduling method includes: referring to task priorities of tasks of the heterogeneous processor cores to identify at least one first task of the tasks that belongs to a first priority task group, wherein each first task belonging to the first priority task group has a task priority not lower than task priorities of other tasks not belonging to the first priority task group; and dispatching at least one of the at least one first task to at least one run queue of at least one of the at least one first processor core. | 04-30-2015 |
Sin Wei Ho, Hsinchu County TW
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20110197950 | PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING THE SAME - A photovoltaic module includes a solar module and a heat sink bonded with a solar unit in a vacuum heating pressing manner. The heat sink is used for dissipating thermal energy generated by the solar module. Through the structure, heat of the solar module can be dissipated more effectively, thereby increasing efficiency of photoelectric conversion. Besides, the structure of the photovoltaic module is simplified, a heat conduction interface material in the prior art is not required, and assembly can be performed in the vacuum heating pressing manner, thereby greatly simplifying the manufacturing procedure. | 08-18-2011 |
Wei-Hsuan Ho, Hsinchu County TW
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20120206379 | Single-layer and multi-touch projected capacitive apparatus - A single-layer and multi-touch projective-capacitive apparatus includes: (a) a substrate, (b) a conductive layer configured on the substrate, wherein the conductive layer consists of a plurality of first patterns, a plurality of second patterns, a plurality of third patterns and a plurality of fourth patterns, and (c) a plurality of conductive wires configured on the substrate respectively to connect with the first patterns, the second patterns, the third patterns and the fourth patterns. | 08-16-2012 |
20130106726 | TOUCHSCREEN AND TOUCH PANEL DISPLAY AND PRODUCING METHOD THEREOF | 05-02-2013 |
Wen-Cheng Ho, Hsinchu County TW
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20090297057 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus and a method thereof are introduced herein. In the method, an image is divided into a plurality of blocks, and a corresponding image processing ratio is set to each of the blocks, wherein each of the blocks includes a plurality of image unit data. Next, the image processing ratios are stored in a filter table, wherein the image unit data of each of the blocks has the corresponding image processing ratio. Next, the filter table is read out and decoded to generate a plurality of filter coefficients, and the corresponding image unit data is obtained according to each of the filter coefficients. Next, filter operation is performed to the corresponding image data and the filter coefficient for outputting a filter operated image data. The image processing ratio can be a zoon ratio or a blur ratio. | 12-03-2009 |
Wen Jen Ho, Hsinchu County TW
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20090196150 | Multi-stage lens driving device - A multi-stage lens driving device for driving an optical lens so as to perform the functions of zooming and/or focusing comprises: a front cover, a rear cover, a plurality of yokes, a plurality of driving coils, a lens seat, and a plurality of permanent magnets. The front cover is a hollow annular cover having a plurality of recesses formed on an inner periphery thereof and a plurality of holders on an outer periphery thereof. The rear cover can be combined with the front cover, thereby forming a receiving space therebetween. The lens seat is a hollow housing disposed in the receiving space. The yokes are provided in the recesses formed on the inner periphery of the front cover. The permanent magnets are surrounding and embedded in an outer periphery of the lens seat, disposed in correspondence to the yokes and spaced therefrom by a predetermined distance. The driving coils are provided respectively on the holders of the front cover, and correspond respectively to the yokes received in the recesses. When predetermined impulse currents of different directions are applied to the driving coils respectively, polarities of corresponding yokes are reversed, respectively. By virtue of magnetic attraction between the permanent magnets and the yokes, rotation of the lens seat in the receiving space is converted to linear axial translation. | 08-06-2009 |
Wen-Lung Ho, Hsinchu County TW
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20150115337 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure includes a substrate, an imaging pixel array disposed on a first region of the substrate, a first isolation disposed in the first region, a periphery circuitry disposed on a second region of the substrate, and a second isolation disposed in the second region. The imaging pixel array has a plurality of imaging pixels configured to capture image data. The periphery circuitry has a transistor configured to receive and process the image data. The first isolation has a first depth and a first protrusion projected from a surface of the substrate. The second isolation has a second depth and a second protrusion projected from the surface of the substrate. The first protrusion has a substantially same height as the second protrusion. The first depth is different from the second depth. | 04-30-2015 |
Yung-Fa Ho, Hsinchu County TW
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20140119294 | CONTROL METHOD OF AN ANTENNA SYSTEM - A control method of an antenna system includes the steps of configuring the antenna system to communicate with a plurality of stations, and configuring the antenna system to modify, at intervals of a predetermined time, a plurality of data acknowledgement (ACK) timeouts which correspond respectively to the stations, so that each of the data ACK timeouts substantially equals the round trip time of a packet for communication between the antenna system and the corresponding one of the stations. | 05-01-2014 |