Patent application number | Description | Published |
20090242758 | MULTISTAGE GAS CASCADE AMPLIFIER - A novel detector for a charged particle beam system which includes multiple gas amplification stages. The stages are typically defined by conductors to which voltage are applied relative to the sample or to a previous stage. By creating cascades of secondary electrons in multiple stages, the gain can be increased without causing dielectric breakdown of the gas. | 10-01-2009 |
20100108881 | SCANNING TRANSMISSION ELECTRON MICROSCOPE USING GAS AMPLIFICATION - A scanning transmission electron microscope operated with the sample in a high pressure environment. A preferred detector uses gas amplification by converting either scattered or unscattered transmitted electrons to secondary electrons for efficient gas amplification. | 05-06-2010 |
20100127190 | CHARGED PARTICLE BEAM MASKING FOR LASER ABLATION MICROMACHINING - An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser. | 05-27-2010 |
20100224592 | CHARGED PARTICLE BEAM PROCESSING - Electron-beam-induced chemical reactions with precursor gases are controlled by adsorbate depletion control. Adsorbate depletion can be controlled by controlling the beam current, preferably by rapidly blanking the beam, and by cooling the substrate. The beam preferably has a low energy to reduce the interaction volume. By controlling the depletion and the interaction volume, a user has the ability to produce precise shapes. | 09-09-2010 |
20110031394 | HIGH PRESSURE CHARGED PARTICLE BEAM SYSTEM - The current invention includes methods and apparatuses for processing, that is, altering and imaging, a sample in a high pressure charged particle beam system. Embodiments of the invention include a cell in which the sample is positioned during high pressure charged particle beam processing. The cell reduces the amount of gas required for processing, thereby allowing rapid introduction, exhaustion, and switching between gases and between processing and imaging modes. Maintaining the processes gases within the cell protects the sample chamber and column from contact with the gases. In some embodiments, the temperature of the cell walls and the sample can be controlled. | 02-10-2011 |
20110031655 | GAS-ASSISTED LASER ABLATION - An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample. | 02-10-2011 |
20110064191 | MICROCALORIMETRY FOR X-RAY SPECTROSCOPY - An improved microcalorimeter-type energy dispersive x-ray spectrometer provides sufficient energy resolution and throughput for practical high spatial resolution x-ray mapping of a sample at low electron beam energies. When used with a dual beam system that provides the capability to etch a layer from the sample, the system can be used for three-dimensional x-ray mapping. A preferred system uses an x-ray optic having a wide-angle opening to increase the fraction of x-rays leaving the sample that impinge on the detector and multiple detectors to avoid pulse pile up. | 03-17-2011 |
20110070381 | USE OF NITROGEN-BASED REDUCING COMPOUNDS IN BEAM-INDUCED PROCESSING - A system for beam-induced deposition or etching, in which a charged particle or laser beam can be directed to a work piece within a single vacuum chamber, either normally incident or at an angle. Simultaneously with beam illumination of the work piece, a deposition or etch precursor gas is co-injected or premixed with a purification compound and (optionally) a carrier gas prior to injection into the process chamber. The beam decomposes the deposition precursor gas to deposit a film only in areas illuminated by the beam, or decomposes the etch precursor gas to etch a film only in areas illuminated by the beam. Undesired impurities such as carbon in the deposited film are removed during film growth by interaction with adsorbed species on the work piece surface that are generated by interaction of the beam with adsorbed molecules of the film purification compound. Alternatively, the film purification compound can be used to inhibit oxidation of the material etched by the etch precursor gas. By co-injecting or premixing the deposition or etch precursor gas and film purification compound prior to injection, the deposition or etch process may be optimized with respect to growth/etch rate and achievable material purity. | 03-24-2011 |
20110115129 | Method and Apparatus for Laser Machining - A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam. | 05-19-2011 |
20120103945 | Method And Apparatus For Laser Machining - Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics. | 05-03-2012 |
20120112062 | Environmental Cell for Charged Particle Beam System - An environmental cell for a charged particle beam system allows relative motion between the cell mounted on an X-Y stage and the optical axis of the focusing column, thereby eliminating the need for a sub-stage within the cell. A flexible cell configuration, such as a retractable lid, permits a variety of processes, including beam-induced and thermally-induced processes. Photon yield spectroscopy performed in a charged particle beam system and using gas cascade amplification of the photoelectrons allows analysis of material in the cell and monitoring of processing in the cell. Luminescence analysis can be also performed using a retractable minor. | 05-10-2012 |
20120196440 | Method of Depositing Material - Material is deposited in a desired pattern by spontaneous deposition of precursor gas at regions of a surface that are prepared using a beam to provide conditions to support the initiation of the spontaneous reaction. One the reaction is initiated, it continues in the absence of the beam at the regions of the surface at which the reaction was initiated. | 08-02-2012 |
20120200007 | Charged Particle Beam Masking for Laser Ablation Micromachining - An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser. | 08-09-2012 |