Bagung
Detlev Bagung, Bernhardswald DE
Patent application number | Description | Published |
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20090242243 | PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD - A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers. | 10-01-2009 |
20100193223 | SOLDER RESIST COATING FOR RIGID-FLEX CIRCUIT BOARDS AND METHOD OF PRODUCING THE SOLDER RESIST COATING - A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating. | 08-05-2010 |
20110284275 | CIRCUIT BOARD HAVING GROWN METAL LAYER IN A FLEXIBLE ZONE - A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created. | 11-24-2011 |
Jorg-Olaf Bagung, Deutsch Evern DE
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20080282973 | MICROWIDTH-ADJUSTABLE SLOT NOZZLE - Apparatus for applying fluids such as adhesive, in particular hot melt adhesive, to a substrate. The apparatus includes a main body which can be connected to a fluid source, an application valve for selectively interrupting or enabling a flow of fluid, and a nozzle arrangement arranged on the main body for applying the fluid. The nozzle includes a distributor passage communicating with the fluid source, and the nozzle arrangement has at least one outlet opening for delivery of the fluid, which communicates with the distributor passage, and a closure body arranged movably in the distributor passage for varying the length, which can be acted upon with fluid, of the distributor passage. The distributor passage is provided in a one-piece portion of the nozzle arrangement. | 11-20-2008 |
20090255623 | APPARATUS AND METHODS FOR APPLYING ADHESIVE TO LABELS - An apparatus for applying adhesive to labels includes an adhesive transfer device having an adhesive receiving surface that receives adhesive from an adhesive applicator at a first location and moves the adhesive to a second location proximate a label supporting device for transferring the adhesive to a label supported on the label supporting device. In one embodiment, the adhesive transfer device may be adapted to receive labels from the label supporting device and to carry the labels to a third location for transfer of the labels to respective containers. | 10-15-2009 |
20110259265 | VOLUME COMPENSATION FOR APPLICATION HEADS WITH APPLICATION WIDTH ADJUSTMENT - A device for dispensing fluid onto a substrate includes a basic body, a fluid supply channel connectible to a fluid source for supplying the fluid, and a nozzle assembly which has a distribution channel that communicates with the fluid supply channel and which has an essentially elongated slit that communicates with the distribution channel. The slit includes at least one discharge opening for dispensing the fluid. The effective length of the distribution channel is variable by means of a closure element that is movable in the distribution channel. An equalization channel is connected with the distribution channel, and the volume of the equalization channel is adjustable. | 10-27-2011 |
Jörg-Olaf Bagung, Evern DE
Patent application number | Description | Published |
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20110052816 | METHOD AND APPARATUS FOR TREATING THE PERIPHERAL REGION OF A SANDWICH COMPONENT - The invention refers to a device and method for treating a peripheral region of a sandwich component, in particular of a sandwich component having a honeycomb structure and two spaced-apart coating layers and a core structure having a plurality of cavities. The invention is characterized by applying a layer of liquid thermoplastic material onto an peripheral region of the sandwich component such that thermoplastic material penetrates into cavities in the core structure of the sandwich component, and hardening the applied thermoplastic material. | 03-03-2011 |
Jörg-Olaf Bagung, Evern DE
Patent application number | Description | Published |
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20110052816 | METHOD AND APPARATUS FOR TREATING THE PERIPHERAL REGION OF A SANDWICH COMPONENT - The invention refers to a device and method for treating a peripheral region of a sandwich component, in particular of a sandwich component having a honeycomb structure and two spaced-apart coating layers and a core structure having a plurality of cavities. The invention is characterized by applying a layer of liquid thermoplastic material onto an peripheral region of the sandwich component such that thermoplastic material penetrates into cavities in the core structure of the sandwich component, and hardening the applied thermoplastic material. | 03-03-2011 |