Patent application number | Description | Published |
20090199765 | HIGH EFFICIENCY ELECTRO-STATIC CHUCKS FOR SEMICONDUCTOR WAFER PROCESSING - The present invention generally provides a high efficiency electrostatic chuck for holding a substrate in a processing volume. The high efficiency electrostatic chuck includes an electrode embedded within a high-purity, thermoplastic member. In particular, the high-purity, thermoplastic member may include a high-purity, polyaryletherketone having an extremely low level of metallic ions present therein. The high-purity, polyaryletherketone has excellent wear resistance, high temperature resistance, plasma resistance, corrosive chemical resistance, electrical stability, and strength as compared to polyimide films used in electrostatic chucks. The present invention also provides a simplified method of manufacturing the high efficiency electrostatic chuck. | 08-13-2009 |
20090242125 | Carrier Head Membrane - A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating. | 10-01-2009 |
20090278081 | PAD PROPERTIES USING NANOPARTICLE ADDITIVES - A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material. | 11-12-2009 |
20090305609 | CMP PAD IDENTIFICATION AND LAYER RATIO MODELING - The present invention relates to methods and apparatus for improving productivity of chemical mechanical polishing (CMP) processes and lowering operating costs of CMP systems. Embodiments of the present invention provide a method for improving the ratio of the layer thickness of composite polishing pads for improved removal rates. Embodiments of the present also provide specific polishing pad identification for monitoring and controlling processes developed for the specific pad to improve overall productivity and reduce downtime of the CMP system. | 12-10-2009 |
20100173566 | Carrier Head Membrane Roughness to Control Polishing Rate - An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness. | 07-08-2010 |
20100311311 | Carrier Head Membrane - A flexible membrane includes a horizontal central portion, a vertical portion coupled to the central portion, a thick rim portion coupled to the vertical portion, and an extension coupled to the thick rim portion. An outer surface of the horizontal central portion provides a mounting surface configured to receive a substrate. The thick rim portion has a thickness that is greater than a portion directly adjacent to the thick rim portion. The thick rim portion is between the extension and the vertical portion and a greatest dimension of the extension is less than the thickness of the thick rim portion. | 12-09-2010 |
20100330879 | LEAK PROOF PAD FOR CMP ENDPOINT DETECTION - In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and a solid light-transmissive window is secured in the recess. In another aspect, a polishing pad includes a polishing layer having a polishing surface, and the polishing surface includes a first region having a first plurality of grooves with a first depth extending partially but not entirely through the polishing layer and a second region surrounded by the first region and having a second plurality of grooves with a second depth extending partially but not entirely through the polishing layer, the second depth greater than the first depth. | 12-30-2010 |
20110013669 | EMI/RF SHIELDING OF THERMOCOUPLES - Embodiments disclosed herein generally relate to a temperature sensor disposed in an apparatus. In many semiconductor, liquid crystal display, solar panel or organic light emitting display fabrication processes, RF power is utilized to either ignite a plasma within the processing chamber or to provide supplemental energy to the process. Temperature control during many processes may be beneficial in order to produce a consistent product. Temperature sensors or thermocouples are sometimes utilized to measure the temperature of a substrate within a processing chamber. The RF power may have a negative impact on the temperature sensor. By coating the temperature sensor with a nanoparticle based metal coating, such as a silver coating, the negative impacts of the RF power on the temperature sensor may be reduced without contaminating the process, and an accurate temperature measurement may be obtained. | 01-20-2011 |
20110105000 | Chemical Mechanical Planarization Pad With Surface Characteristics - A polishing pad includes a polymer matrix and polyhedral oligomeric silsequioxane (“POSS”) molecules or soluble particles and a surfactant dispersed within the polymer matrix. A polishing pad can be formed by casting a liquid polymer on a conveyer belt having a casting surface with a set of projections and curing the liquid polymer on the conveyer belt such that a polymer matrix has a surface with a second set of projections complimentary to the first set of projections. | 05-05-2011 |
20110114519 | COMPONENT WITH ENHANCED SHELF LIFE - A process has been developed that significantly reduces moisture absorption of components, resulting in a component which is less susceptible to moisture and adsorption/absorption effects to the components functionality. In one embodiment, a component having reduced susceptibility to moisture exposure includes a component disposed in an air-tight package, the component having a blocking gas disposed in pores on a surface of the component. In another embodiment, a method for preparing a component having reduced susceptibility to moisture exposure includes driving water from a component in a controlled environment, exposing the component in the controlled environment to a blocking gas, removing the component in the controlled environment, and optionally sealing the component in an air-tight package. | 05-19-2011 |
20110180983 | LIFE ENHANCEMENT OF RING ASSEMBLY IN SEMICONDUCTOR MANUFACTURING CHAMBERS - The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring and an outer ring disposed radially outward of the inner ring. The inner ring will correspond to the location where the majority of erosion occurs during use. This inner ring can be flipped and reused until both sides have eroded beyond their service life. Collectively, the two rings generally have the shape of a single piece ring, but the service life of the ring assembly is longer than a conventional single piece ring. | 07-28-2011 |
20110217208 | MEASURING FLOW PROPERTIES OF MULTIPLE GAS NOZZLES OF A GAS DISTRIBUTOR - A gas nozzle measurement apparatus comprises a controllable gas source to provide across a gas plate having gas nozzles, a flow of gas at a constant pressure or constant flow rate, and a sensor plate sized to cover an area comprising at least a portion of the front face of the gas plate. The sensor plate comprises gas flow sensors arranged in locations that correspond to positions of individual gas nozzles of the gas nozzles of the gas plate such that each gas flow sensor can measure a pressure, flow rate, density, or velocity of a gas stream passing through the individual gas nozzle that faces the gas flow sensor, and generate a signal indicative of, or display, the pressure, flow rate, density, or velocity of the gas stream passing through the individual gas nozzle. | 09-08-2011 |
20120154974 | HIGH EFFICIENCY ELECTROSTATIC CHUCK ASSEMBLY FOR SEMICONDUCTOR WAFER PROCESSING - The present invention generally provides a high efficiency electrostatic chuck including a flex stack having an electrode disposed between two layers of dielectric material. At least one of the layers is a standard or high purity thermoplastic film. The flex stack may have a matte finish on the substrate supporting surface to provide benefits such as improved temperature distribution across the surface of the chuck. The non-substrate supporting or pedestal receiving side of the flex stack may be plasma treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. The electrode may be a sheet electrode on a release liner, which enables ease of manufacturing. | 06-21-2012 |
20130035022 | Two-Part Plastic Retaining Ring - A retaining ring includes a generally annular lower portion and a generally annular upper portion. The lower portion has a bottom surface for contacting a polishing pad during polishing and a top surface. The upper portion has a bottom surface secured to the top surface of the lower portion and a top surface configured to be mechanically affixed to and abut a rigid base of a carrier head. The lower portion is a first plastic, and the upper portion is a different second plastic that is about the same or more rigid than the first plastic. | 02-07-2013 |
20130324017 | TWO-PART RETAINING RING WITH INTERLOCK FEATURES - A retaining ring includes an annular lower portion and an annular upper portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, an inner rim projecting upward from the main body, an outer rim projecting upward from the main body and separated from the inner rim by a gap, and a plurality of azimuthally separated interlock features positioned between the inner rim and the outer rim, each interlock feature projecting upwardly from the main body. The annular upper portion has a top surface and a bottom surface and a plurality of azimuthally separated recesses in the bottom surface, the recesses defining thin portions of the upper portion, the plurality of interlock features fitting into the plurality of recesses. The lower portion is a plastic and the upper portion is a material that is more rigid than the plastic. | 12-05-2013 |
20140099485 | METHODS FOR BONDING SUBSTRATES - Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly. | 04-10-2014 |
20140165915 | THERMAL RADIATION BARRIER FOR SUBSTRATE PROCESSING CHAMBER COMPONENTS - An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer. | 06-19-2014 |
20140167327 | SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS - A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves. | 06-19-2014 |
20140238604 | LIFE ENHANCEMENT OF RING ASSEMBLY IN SEMICONDUCTOR MANUFACTURING CHAMBERS - The present invention generally relates to a ring assembly that may be used in an etching or other plasma processing chamber. The ring assembly generally includes an inner ring body having a top planar surface and a bottom planar surface, and an outer ring body having a top surface, a bottom surface substantially parallel to the top surface, and an inside surface that extends between the top surface and the bottom surface, the inside surface having a roof covering a portion of the inner ring body when the inner ring body is disposed adjacent the roof, wherein the inner ring body can be flipped into a different position so that a portion of the inner ring body that is not covered by the roof provides a substantially planar surface. | 08-28-2014 |
20140287662 | RETAINING RING WITH ATTACHABLE SEGMENTS - A retaining ring includes a generally annular upper portion having a top surface configured to be connected to a base of a carrier head and a lower surface, and a plurality of substantially identical arcuate segments detachably secured to the upper portion to form an annular lower portion. Each of the arcuate segments has an upper surface that abuts the lower surface of the upper portion and a bottom surface for contacting a polishing pad during polishing. | 09-25-2014 |