Patent application number | Description | Published |
20090190227 | COMPOUND LENS AND COMPOUND LENS ARRAY - An exemplary compound lens includes a rigid light pervious layer, a first plastic lens, and a second plastic lens. The rigid light pervious layer includes a first surface and a second surface opposite to the first surface. The first plastic lens is attached on the first surface, and is comprised of a first material. The second plastic lens is formed on the second surface, and is comprised of a second material. A refractive index of the first material is different from that of the second material. An optical axis of the first plastic lens is in alignment with an optical axis of the second plastic lens. | 07-30-2009 |
20090237929 | STREET ILLUMINATING DEVICE - A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board. | 09-24-2009 |
20090256273 | METHOD FOR MAKING LENSES - A method for making a plurality of lenses, includes steps of: providing a transparent substrate; jetting a plurality of first lumps of a first molding material on a first surface of the substrate using a first nozzle; press-molding the first lumps of the first molding material into a plurality of first optical structures using a first mold including a plurality of first molding surfaces corresponding to the first optical structures; jetting a plurality of second lumps of a second molding material on a second surface of the substrate using a second nozzle; press-molding the second lumps of the second molding material into a plurality of second optical structures using a second mold including a plurality of second molding surfaces corresponding to the second optical structures; and dicing the substrate to form a plurality of lenses each with one of the first optical structures and one of the second optical structures. | 10-15-2009 |
20090267248 | PROCESS FOR FABRICATING MOLDING STAMP - A process for fabricating a molding stamp mainly includes the steps of: (1) attaching a framework onto a substrate, the framework defining a number of through holes therein so that the framework and the substrate cooperatively define a number of molding cavities; (2) applying a UV curable resin in one of the molding cavities; (3) molding the UV curable resin in the one of the molding cavities using a printing stamp having a predetermined microlens pattern; (4) curing the UV curable resin to form a microlens unit; (5) removing the printing stamp; (6) repeating the steps (2) through (5) to form a number of microlens units on the substrate; (7) removing the framework from the substrate; (8) applying a thermosetting resin on the substrate to cover the microlens units; (9) curing the thermosetting resin to form the molding stamp; and (10) separating the molding stamp from the substrate. | 10-29-2009 |
20090277795 | PROCESS FOR FABRICATING MOLDING STAMP - A process for fabricating a molding stamp mainly includes the steps of: forming a metal seed film on a substrate; forming a photo resist layer on the metal seed film; exposing the photo resist layer by a direct writing method, and developing the photo resist layer thereby forming a pattern of the photo resist layer, the pattern made of a number of microlens structures and a through hole configured for exposing a portion of the metal seed film therefrom; electroforming a body on the substrate to cover the pattern of the photo resist layer, the body having an extending portion being connected with the metal seed film via the through hole of the photo resist layer; removing the photo resist layer from the substrate; and separating the electroformed body from the substrate. | 11-12-2009 |
20090316400 | LIGHT EMITTING DIODE STREET LIGHT - An exemplary light emitting diode (LED) streetlight includes an LED light source and a heat dissipating module. The LED light source includes a circuit board and a plurality of LEDs. The circuit board has a first surface and a second surface. The LEDs are disposed on the first surface and electrically connected to the circuit board. The heat dissipating module includes a heat conducting plate, a plurality of heat pipes containing a working liquid and a plurality of fins. The heat conducting plate has a bonding surface and a heat dissipating surface opposite to the bonding surface. Each heat pipe has a heated section thermally connected to the heat dissipating surface and a condensing section spaced from the heat dissipating plate and penetrate into the plurality of fins. The circuit board is fixed on the bonding surface of the heat conducting plate. | 12-24-2009 |
20100230836 | IMPRINT MOLD AND IMPRINT MOLDING METHOD - An exemplary imprint mold includes a surface, a plurality of molding portions arranged on the surface and a plurality of contraposition symbols arranged around the molding portions. The contraposition symbols include two first contraposition symbols arranged parallel to a first axis, two second contraposition symbols arranged parallel to a second axis, and four third contraposition symbols. The first axis and the second axis are perpendicularly intersecting at a geometrical center of the surface. Any two selected of the four third contraposition symbols are symmetrically positioned relative to each other about one of the first axis, the second axis, and the geometrical center. | 09-16-2010 |
20100244291 | IMPRINTING METHOD FOR MAKING OPTICAL COMPONENTS - An imprinting method for making optical components includes: providing an imprinting mold, the imprinting mold comprising a molding surface and a molding portion formed on the molding surface; providing a substrate comprising a first surface, the first surface comprising a plurality of supporting areas arranged in an array, each of the supporting areas configured for supporting a mass of molding material; applying a mass of molding material on each of the supporting areas; pressing the imprinting mold on each mass of the molding material; and solidifying the imprinted molding material to form the optical components. | 09-30-2010 |
20100246000 | WAFER LEVEL LENS MODULE ARRAY WITH SPACER ARRAY - An exemplary wafer level lens module array includes a first lens array, a second lens array above the first lens array, and a spacer array between the first and second lens arrays. The first lens array includes a number of first lenses, and two first aligning structures. The second lens array includes a number of second lenses, and two second aligning structures. The spacer array includes a number of through holes, and two third aligning structures. The first aligning structures respectively align with the third aligning structures, thereby the first lenses are coaxial with the respective the through holes. The second aligning structures respectively align with the third aligning structures, thereby the second lenses are coaxial with the respective through holes. | 09-30-2010 |
20100246018 | LENS HAVING ANTIREFLECTION AND LIGHT ABSORBING FILMS AND LENS ARRAY INCLUDING SUCH LENS - An exemplary lens includes a light permeable substrate having a first surface and a second surface at opposite sides thereof, a first antireflection film formed at the first surface, a first optically active part formed on the first antireflection film, and a first light absorbing film formed on the first antireflection film around the first optically active part. | 09-30-2010 |
20100247699 | IMPRINTING MOLD WITH GROOVE FOR EXCESS MATERIAL - An exemplary imprinting mold includes a molding surface, a microstructure, and grooves. The microstructure is formed on the molding surface and configured for molding an optical component. The grooves are defined in the molding surface and extend from the microstructure. | 09-30-2010 |
20100259830 | LENS, LENS ARRAY HAVING SAME AND METHOD FOR MAKING SAME - The present disclosure relates to a method for making a lens. In step | 10-14-2010 |
20100270692 | IMPRINTING MOLD AND METHOD FOR MAKING LENS ARRAY - An exemplary method for making a lens array is as follows. An imprinting mold and a substrate are provided. A blob of molding material is applied on each molding section of the substrate. The first alignment marks, and the second alignment mark of the imprinting mold are aligned with the fourth alignment marks, and the third alignment mark of one of the imprinting regions, respectively. The imprinting mold is pressed on the molding material on the imprinting region. The pressed portions of the imprinting region are solidified to obtain lenses in the imprinting region. The imprinting mold is pressed on another one of the imprinting region, and the imprinting mold is removed. This process is repeated for each other imprinting region. Thus, a lens array is obtained. | 10-28-2010 |
20100294095 | METHOD FOR MAKING MOLD CORE - A method for making a mold core for molding lenses of optical fiber connector, is provided. The method includes: providing a first fixture and a mold block, the first fixture defining a first cavity therein, a center of the first fixture located within the first cavity and deviated from a center of the first cavity; providing a lathe comprising a rotatable spindle and a drill bit aligning with the rotatable spindle; installing the blank in the first cavity of the first fixture, and mounting the first fixture to the spindle; machining a first mold cavity in the blank using the drill bit; reinstalling the blank in the first cavity by revolving the blank 180 degrees; and machining a second mold cavity in the blank using the drill bit, thereby obtaining a mold core having the first and the second mold cavities. | 11-25-2010 |
20110017294 | PACKAGE FOR SOLAR CELL CHIP - A solar cell package comprises a ceramic substrate, a light-electricity transformation unit provided on the substrate for transforming solar energy into electricity, and a sealing component covering the light-electricity transformation unit and the ceramic substrate. A Fresnel lens is disposed corresponding to the top of the light-electricity transformation unit, converges and concentrates solar energy onto the light-electricity transformation unit. | 01-27-2011 |
20110017295 | PACKAGE FOR SOLAR CELL CHIP - A solar cell package comprises a substrate, a light-electricity transformation unit provided on the substrate for transforming solar energy into electricity, a package component covering the light-electricity transformation unit and the substrate, and a carbon nanotube film. The carbon nanotube film is provided on a surface of the light-electricity transformation unit to increase heat dissipation. A Fresnel lens is disposed corresponding to the top of the light-electricity transformation unit, and converges and concentrates solar energy on the light-electricity transformation unit. | 01-27-2011 |
20110097432 | INJECTION MOLD - An exemplary injection mold for manufacturing a fiber optic connector includes a first mold, a second mold, an insert, two first positioning bar, and four second positioning bars. The first mold and the second mold cooperatively define a mold cavity. The mold cavity includes two lens molding recesses. The two inserts are attached to the second mold and located in the mold cavity. A dimension of each second bar in cross section is substantially smaller than that of each first positioning bar. One first positioning bar and two second positioning bars are arranged around each insert to position the insert, such that the inserts is suspended in the mold cavity and precisely aligns with the respective molding recesses. | 04-28-2011 |
20110132430 | SOLAR ENERGY CONVERSION DEVICE AND MODULE - An exemplary solar energy conversion device includes a substrate, a solar energy conversion chip, and a carbon nanotube layer. The substrate defines a through hole. The solar energy conversion chip is positioned on the substrate and covers the through hole. The solar energy conversion chip includes a light incident surface facing away from the substrate and a heat dissipating surface at an opposite side thereof to the light incident surface. The carbon nanotube layer is formed on the heat dissipating surface. | 06-09-2011 |
20110135253 | OPTICAL FIBER CONNECTOR - An exemplary optical fiber connector includes a housing, and two lenses. The housing defines two first blind holes each configured for receiving an optical fiber. The two lenses are formed on the housing and each of the lenses is aligned with a corresponding first blind hole. The two second blind holes are defined on the housing and each of the second blind hole run through the housing to the bottom of a corresponding first blind hole allowing glue to accumulate on the bottom of the first blind hole. | 06-09-2011 |
20110135257 | OPTICAL FIBER CONNECTOR - An exemplary optical fiber connector includes a housing, and two lenses. The housing defines two first blind holes each configured for receiving an optical fiber. The two lenses are formed on the housing and each of the lenses is aligned with a corresponding first blind hole. The two second blind holes are defined on the housing and each of the second blind holes running through the housing to a corresponding first blind hole to allow adhesive to fill between the sidewall of the optical fiber and the inner wall of the blind hole. | 06-09-2011 |
20110156082 | LED MODULE - An exemplary LED module includes a ceramic substrate, a heat spreader, a heat sink, an LED die, and a packaging layer. The substrate defines a hole extending therethrough from a top side to a bottom side thereof. The heat spreader is disposed in the hole with a top side thereof substantially coplanar with the top side of the substrate. An outer circumferential surface of the heat spreader contacts an inner circumferential surface of the substrate around the hole. The heat sink is attached to the top sides of the substrate and the heat spreader. The LED die is attached to a bottom side of the heat spreader, and the packaging layer encapsulates the LED die. | 06-30-2011 |
20110156292 | METHOD OF MANUFACTURING BRIGHTNESS ENHANCEMENT FILM AND ROLLER USED THEREIN - A method of manufacturing brightness enhancement film includes a roller with an outer surface and a plurality of micro-structures formed on the outer surface undergoing sandblasting, thereby forming a plurality of rough portions on the outer surface, rolling the blasted roller onto a substrate whereby the micro-structures and the rough portions imprint the substrate to form a plurality of brightness enhancement portions and a plurality of diffusion portions on the outer surface of the blasted roller, and cutting the imprinted substrate to provide a brightness enhancement film. | 06-30-2011 |
20110156294 | METHOD OF MANUFACTURING BRIGHTNESS ENHANCEMENT FILM AND ROLLER USED THEREIN - A method of manufacturing a brightness enhancement film utilizes a roller with an outer surface and a plurality of slot portions formed thereon by sandblasting and includes heating a substrate, rolling the textured roller on to the substrate such that the slot portions imprint the substrate and form a plurality of protrusions thereon, and cutting the substrate which has been imprinted to provide a brightness enhancement film. | 06-30-2011 |
20110156295 | EMBOSSING ASSEMBLY, MANUFACTURING METHOD THEREOF, AND EMBOSSING METHOD USING THE SAME - A method of manufacturing a brightness enhancement film includes the following: providing a embossing substrate, providing a first embossing assembly including a roller and an embossing layer applied on the roller, which is formed by electroforming and includes protruding micro-structures formed on the outer surface of the embossing layer, rolling the embossing layer onto the embossing substrate, and embossing the recessed micro-structures on a surface of the embossing substrate. | 06-30-2011 |
20110156308 | MOLDING INSERT CORE AND INSERT MOLDING PROCESS UTILIZING THE CORE - An exemplary molding insert core used in an insert mold includes two first molding bars, two second molding bars, two first support members, and two second support members. Each first molding bar is partially arranged on one first support member. Each second molding bar is partially arranged on one second support member. | 06-30-2011 |
20110220722 | RFID TAG ANTENNA AND METHOD FOR MAKING SAME - An exemplary radio frequency identification tag antenna includes a substrate and a patterned carbon nanotube layer. The patterned carbon nanotube layer is formed on the substrate. The carbon nanotube layer consists of a number of carbon nanotube segments. The carbon nanotube segments are connected end-to-end and well aligned. Each carbon nanotube segment includes a number of carbon nanotubes substantially parallel to each other. | 09-15-2011 |
20110278749 | MOLD FOR FORMING OPTICAL FIBER CONNECTOR AND METHOD FOR ADJUSTING THE MOLD - A mold for molding optical fiber connector includes a core pin, a core mold and a cavity mold. The core pin has insertion portion and a blind hole forming portion. The core mold is used to clamp the insertion portion of the core pin. The cavity mold includes a molding cavity and a through hole defined in the sidewall of the cavity mold, the molding cavity includes a lens forming portion used to mold the lens. A positioning block defining an aligning hole is positioned in the through hole, the aligning hole is used to clamp the blind hole forming portion of the core pin to make the blind hole forming portion align with the lens forming portion during the injection molding process. The present art also relate to a method for adjusting the mold. | 11-17-2011 |
20110280519 | BLIND HOLE INSERT FIXING DEVICE - A blind hole insert fixing device is configured for fixing a number of blind hole inserts. The blind hole insert fixing device includes a hollow housing defining a cavity and an engagement member received in the cavity. The housing includes a first inner surface and an opposing second inner surface in the cavity. The engagement member includes a body portion, a number of spring portions, and a number of engagement portions conforming to the blind hole inserts. The spring portions and the engagement portions are located at opposite sides of the body portion. The spring portions abut against the first inner surface. The engagement portions and the second inner surface cooperatively form a number of receiving spaces for receiving the blind hole inserts. The spring portions are configured for applying a force to the body portion in a direction away from the first inner surface. | 11-17-2011 |
20120008901 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes a female connector and a male connector. The female connector includes a first main body and a first lens portion. The first main includes at least one positioning slit and at least one recess defined in an inner surface of the first main body in the at least one positioning slit. The male connector is used for engagement with the female connector, and includes a second main body and a second lens portion for optically coupling with the first lens portion. The second main body includes at least one positioning post configured for insertion into the corresponding at least one positioning slit and at least one protrusion protruding from the at least one positioning post configured for insertion into the corresponding at least one recess. | 01-12-2012 |
20120019451 | TOUCH PANEL AND TOUCH DISPLAY DEVICE USING SAME - A touch panel includes a first electrically conductive substrate, a second electrically conductive substrate; and a plurality of insulators located between the first electrically conductive substrate and the second electrically conductive substrate. The second electrically conductive substrate includes a first carbon nanotube film facing the first electrically conductive substrate, and a second carbon nanotube film exposed outside the touch panel. | 01-26-2012 |
20120019935 | LIGHT RAY CONCENTRATION DEVICE - A light ray concentration device includes a concentrating lens and a base for holding the concentrating lens. The concentrating lens includes a planar surface defining a number of first Fresnel zones and a convex surface facing away from the planar surface and defining a number of second Fresnel zones. The first and second Fresnel zones are coaxial with each other. | 01-26-2012 |
20120077657 | PROTECTIVE FILM AND ROLLER USING THE SAME - A protective film includes an adhesive layer, a metal nitride layer, and an anti-adhesive layer. The metal nitride layer is coated on the adhesive layer. The anti-adhesive layer is coated on the metal nitride layer. | 03-29-2012 |
20120128306 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes an optical fiber cable including two optical fibers; and a connector plug connected to opposite ends of the optical fiber cable for electrical connection to an electronic device. The connector plug includes a shell, a photodiode, a laser diode; and an electrical connector for electrical connection to an electronic device. The photodiode, the laser diode and the electrical connector are housed in the metallic shell, the photodiode is optically coupled to a distal end of one corresponding optical fiber and electrically coupled to the electrical connector, the laser diode optically is coupled to a distal end of the other optical fiber and electrically coupled to the electrical connector. | 05-24-2012 |
20120148197 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes a main body, a number of lens portions, a number of restricting members, and a number of optical fibers. The main body includes a first side surface and a second side surface opposite to the first side surface. The main body defines a cavity between the first and second side surfaces, and a number of accommodating holes extending through the first side surface and communicating with the cavity. The lens portions are positioned on the second side surface, and each lens portion is coaxial with a corresponding accommodating hole. The restricting members are arranged in the cavity. The optical fibers are fixed in the accommodating holes. Each optical fiber is restricted by a corresponding restricting member and an end of each optical fiber is fixed at the focal plane of a corresponding lens portion. | 06-14-2012 |
20120148199 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes a number of optical fibers, a body, a number of supports and a cover. The body includes a number of lens portions at a first end thereof, a number of through holes at an opposite second end, and a recess located between the lens portions and the through holes. The through holes are in communication with the recess. The optical fibers extend through the respective through holes and terminate at the respective lens portions. The supports are formed in the recess. Each support supports and retains a portion of the corresponding optical fiber exposed in the recess. The cover is inserted in the recess. The cover and the supports cooperatively securely sandwich the exposed portions of the optical fibers in the body. | 06-14-2012 |
20120148200 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes a number of optical fibers, a body, a number of supports and a cover. The body includes a number of lens portions at a first end thereof, a number of through holes at an opposite second end, and a recess located between the lens portions and the through holes. The through holes are in communication with the recess. The optical fibers extend through the respective through holes and terminate at the respective lens portions. The supports are formed in the recess. Each support supports and retains a portion of the corresponding optical fiber exposed in the recess. The cover is received in the recess. The cover has a number of slanted faces spatially corresponding to the respective supports. The slanted faces and the supports cooperatively securely sandwich the exposed portions of the optical fibers in the body. | 06-14-2012 |
20120162616 | PROJECTOR WITH EYE PROTECTION MECHANISM - A projector includes a case, a projection lens, a shielding plate, and a controller received in the case. The case includes a sidewall defining an aperture. The projection lens is used for projecting a cone of light rays which passes through the aperture and a projection area. The shield plate is positioned on the sidewall. The driver is used for driving the shield plate to any of desired positions ranging from a first position in which the shield plate exposes the aperture to a second position in which the shield plate shields the aperture. The barrier detection device is used for generating a first signal if detecting no barrier presents in the projection area and generating a second signal if detecting a barrier presents in the projection area. The controller is used for controlling the driver to drive the shield plate to the first position if receiving the first signal. | 06-28-2012 |
20120170886 | OPTICAL FIBER COMMUNICATION APPARATUS - An optical fiber communication apparatus includes a laser diode, a light directing member, and an optical fiber. The laser diode is configured for emitting a laser beam along a first direction. The light directing member includes a converging lens portion and a reflecting surface. The converging lens portion is optically aligned with the laser diode and configured for converging the laser beam. The reflecting surface is obliquely oriented relative to a second direction and configured for reflecting the converged laser beam toward. The second direction is perpendicular to the first direction. The optical fiber is oriented along the second direction and configured for receiving the reflected converged laser beam. | 07-05-2012 |
20120273981 | METHOD FOR MAKING LENS ARRAY - An exemplary method for making a lens array requires an imprinting mold and a substrate. A blob of molding material is applied on each molding section of the substrate. First alignment marks, and second alignment mark of the imprinting mold aligned with third and fourth alignment marks on each one of the imprinting regions, respectively. The imprinting mold is pressed on the molding material on the imprinting region. The pressed portions of the imprinting region are solidified to obtain lenses in the imprinting region. The imprinting mold is pressed on another one of the imprinting region, and the imprinting mold is removed. This process is repeated for each other imprinting region. Thus, a large-scale lens array is obtained. | 11-01-2012 |
20120314996 | OPTICAL FIBER COMMUNICATION APPARATUS - An optical fiber communication apparatus includes a laser diode, a light guiding member, and an optical fiber. The laser diode emits a laser beam along a first direction. The light guiding member includes a first aspheric converging lens portion and a reflecting surface. The converging lens portion is optically aligned with the laser diode, and converges the laser beam. The reflecting surface obliquely oriented at θ degrees relative to the first direction, and the θ degrees rendering the converged laser beam totally internal reflecting toward. The index of the light guiding member is in a rang from 1.415 to 1.5 or from 1.65 to 1.7, and 37.32° θ<45° or 45°<θ56.3°. The optical fiber is oriented along a second direction receives the reflected converged laser beam, and the second direction substantially perpendicular to the first direction. | 12-13-2012 |
20120319314 | METHOD FOR FABRICATING LIGHT GUIDE PLATE - A method for fabricating a light guide plate includes the following steps. Injection molding a light guide plate to obtain a light guide plate with a stub. Cutting away the stub to obtain a light guide plate with a cut edge. Providing a thermal resetting apparatus having an nano release material layer. A thermal melting temperature of the nano release material layer is higher than that of the light guide plate, heating the thermal resetting apparatus to make a temperature of the nano release material layer higher than the thermal melting temperature of the nano release material layer. And resetting the cut edge of the light guide plate by contacting the nano release material layer of the thermal resetting apparatus with the cut edge of the light guide plate to obtain a light guide plate with a smooth edge. | 12-20-2012 |
20130015335 | DEVICE AND METHOD FOR ATTACHING PROTECTIVE FILM TO AND REMOVING PROTECTIVE FILM FROM LIGHT GUIDE PLATEAANM YU; TAI-CHERNGAACI Tu-ChengAACO TWAAGP YU; TAI-CHERNG Tu-Cheng TWAANM LIN; DA-WEIAACI Tu-ChengAACO TWAAGP LIN; DA-WEI Tu-Cheng TW - A device includes a first roller to roll down a protective film around the first roller, a conveying device to convey a light guide plate (LGP), and a first fan to generate charged ions and blow out the charged ions. While the rolled-down protective film is being placed onto the LGP being conveyed by the conveying device, the charged ions blown out by the first fan are adhered to a first surface of the protective film to generate static electricity and the first surface of the protective film is attached to the LGP by the static electricity. | 01-17-2013 |
20130027908 | LIGHT GUIDE PLATE AND BACKLIGHT MODULE INCLUDING SAME - A backlight module includes a light guide plate and a plurality of light sources. The light guide plate includes a wedge-shaped light incident part and a flat panel. The wedge-shaped light incident part and the flat panel have a common bottom surface. The height of the wedge-shaped light incident part is greater than that of the flat panel. The wedge-shaped light incident part includes a light incident surface perpendicular to the bottom surface and a sloped surface sloping relative to the light incident surface and connects to the flat panel. The sloped surface defines a plurality of V-shaped grooves for preventing light leak. The flat panel includes a light emitting surface opposite to the bottom surface. The plurality of light sources is positioned adjacent to the light incident surface. | 01-31-2013 |
20130029060 | LIGHT GUIDE PLATE REPAIRING METHOD - A light guide plate repairing method for repairing a light guide plate is provided. The light guide plate has a scratch on at least one surface. The light guide plate repairing method includes steps as followed: laying a UV curing adhesive on the at least one surface; scraping the UV curing adhesive on the surface of the light guide plate to fill the UV curing adhesive in the scratch by a scraper; emitting a UV light for illuminating the UV curing adhesive on the surface of the light guide plate to solidify the UV curing adhesive by a UV light source; polishing the surface of the light guide plate after the UV curing adhesive has been solidified by a polishing device; and wiping and cleaning the surface of the light guide plate after the surface of the light guide plate has been polished by a wiper. | 01-31-2013 |
20130033754 | COMPOUND OPTICAL FILM AND METHOD FOR MANUFACTURING SAME - A compound optical film comprises an unitary two-layer structure consisting of a light guide layer and a light reflective layer attached on the light guide layer. A plurality of light scattering particles are dispersed in the light guide layer adjacent to an interface between the light guide layer and the light reflective layer. The compound optical film can reduce the thickness of backlight module while the compound optical film is used in backlight module. The present art also relates to a manufacturing method for the compound optical film. | 02-07-2013 |
20130043607 | APPARATUS AND METHOD FOR CORRECTING WARPING OF LIGHT GUIDE PLATE - An apparatus for correcting any warping of a light guide plate includes a retaining device and a heating device. The retaining device includes a top pressing plate, a bottom supporting plate and an oil hydraulic cylinder on the top pressing plate. The oil hydraulic cylinder applies a pressing force on the top pressing plate, and the top pressing plate and the bottom supporting plate cooperatively sandwich and retain a light guide plate. The heating device has a coil of wire for surrounding the light guide plate. The coil of wire is configured for heating the light guide plate, the pressure and the heat thereby correcting the warp of the light guide plate. A method for correcting a warp of a light guide plate is also provided. | 02-21-2013 |
20130087312 | COOLING DEVICE FOR COOLING LIGHT GUIDE PLATE - A cooling device for cooling a plurality of light guide plates includes a plurality of positioning members stacked together, a support frame supporting the plurality of positioning members, and a cooling fan positioned in the support frame. Each positioning member includes a bottom plate and a side frame extending from an edge of the bottom plate. The bottom plate and the side frame cooperatively define a receiving groove for receiving the light guide plate. A plurality of support portions are formed on the bottom plate for supporting the light guide plate, and the bottom plate defines a plurality of penetrating holes around the support portions. The cooling device cools all the light guide plates evenly and quickly. | 04-11-2013 |
20130100697 | BACKLIGHT MODULE - A backlight module includes a light source assembly, a light guiding plate, an optical clear adhesive, and a light diffusion member. The diffusion member is positioned on the light guiding plate via the optical clear adhesive. The diffusion member includes yellow phosphor powders. The light source assembly includes a substrate and a number of point light sources arrayed on the substrate. The point light sources are blue light emitting diodes. The point light sources are aligned with the light diffusion member. | 04-25-2013 |
20130142479 | CHIP PACKAGE - A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers. | 06-06-2013 |
20130142484 | OPTICAL ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF - An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission. | 06-06-2013 |
20130148924 | LIGHT GUIDE DEVICE AND MANUFACTURING METHOD THEREOF - A light guide device includes a light guide plate, a diffusion layer, and a brightening layer. The light guide plate includes a first surface, a second surface opposite to the first surface, and diffusion pots positioned on the first surface. The diffusion layer is adhered to the second surface of the light guide plate, and includes transparent adhesive and diffusion particles scattered in the transparent adhesive. The brightening layer is adhered to the diffusion layer, and includes a micro structure formed on a surface of the brightening layer facing away from the diffusion layer. The micro structure includes a number of cutouts. A manufacturing method for the light guide device is also provided. | 06-13-2013 |