Patent application number | Description | Published |
20080210307 | CONTROL OF SLIT VALVE DOOR SEAL PRESSURE - Apparatuses and methods are provided for sealing a slit valve passage between two substrate processing chambers. A body with two openings to register with openings in the walls of the process chambers, and a passageway between them, houses a sealing member configured to extend and retract to block or open the passageway. The sealing member comprises a seal on one face that covers one opening, and a moveable lateral extension on the other face that braces against the other opening. The extension is actuated to contact the wall of the body, providing a bracing or sealing force to the seal on the other face of the sealing member. The sealing force may be adjusted by varying the gas pressure to the sealing member based on pressure conditions in the process chambers. | 09-04-2008 |
20080258091 | FLOATING SLIT VALVE FOR TRANSFER CHAMBER INTERFACE - The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve. | 10-23-2008 |
20090114153 | METHOD AND APPARATUS FOR SEALING AN OPENING OF A PROCESSING CHAMBER - A method and apparatus for sealing an opening of a processing chamber are provided. In one embodiment, the invention generally provides a closure member integrated within a wall of a process chamber for sealing an opening within the wall of the chamber. In another embodiment, the invention provides a closure member configured to seal an opening in the wall of a processing chamber from the inside of the chamber. | 05-07-2009 |
20100051111 | SLIT VALVE CONTROL - Embodiments disclosed herein generally relate to methods for sealing a processing chamber with a slit valve door. The door initially raises from a position below the opening for the processing chamber to a raised position. The door then expands until an O-ring that is on the door just touches the sealing surface. Then, the door expands again to compress the O-ring against the sealing surface. The door expands by flowing a gas into the interior volume of the door. By controlling the pressure buildup within the door, the speed with which the door expands is controlled to ensure that the door gently contacts the sealing surface and then compresses against the sealing surface. Thus, the door may be prevented from contacting the sealing surface with too great a force that may jolt or shake the processing chamber and produce undesired particles that may contaminate the process. | 03-04-2010 |
20100086380 | SCISSOR LIFT TRANSFER ROBOT - A method and apparatus for a transfer robot that may be used in a vacuum environment is described. The transfer robot includes a lift assembly comprising a first platform and a second platform coupled to the first platform by a plurality of support members, the plurality of support members comprising a first pair of support members and a second pair of support members, a first drive assembly coupled to a portion of the plurality of support members, the first drive assembly providing a motive force to the plurality of support members to move the second platform in a first linear direction relative to the first platform, and an end effector disposed on the second platform and movable in a second linear direction by a second drive assembly, the second linear direction being orthogonal to the first linear direction. | 04-08-2010 |
20110076118 | SUBSTRATE TRANSFER ROBOT WITH CHAMBER AND SUBSTRATE MONITORING CAPABILITY - A method and apparatus for a transfer robot that having at least one image sensor disposed thereon is provided. The transfer robot includes a lift assembly having a first drive assembly for moving a first platform relative to a second platform in a first linear direction, an end effector assembly disposed on the second platform and movable in a second linear direction by a second drive assembly, the second linear direction being orthogonal to the first linear direction, at least one image sensor, and a lighting device associated with the at least one image sensor. | 03-31-2011 |
20110287374 | FLOATING SLIT VALVE FOR TRANSFER CHAMBER INTERFACE - The present invention generally comprises a floating slit valve for interfacing with a chamber. A floating slit valve moves or “floats” relative to another object such as a chamber. The slit valve may be coupled between two chambers. When a chamber coupled with the slit valve is heated, the slit valve may also be heated by conduction. As the slit valve is heated, it may thermally expand. When a vacuum is drawn in a chamber, the slit valve may deform due to vacuum deflection. By disposing a low friction material spacer between the chamber and the slit valve, the slit valve may not rub against the chamber during thermal expansion/contraction and/or vacuum deflection and thus, may not generate undesirable particle contaminants. Additionally, slots drilled through the chamber for coupling the slit valve to the chamber may be sized to accommodate thermal expansion/contraction and vacuum deflection of the slit valve. | 11-24-2011 |
20120103989 | METHOD AND APPARATUS FOR SEALING AN OPENING OF A PROCESSING CHAMBER - A method and apparatus for sealing an opening of a processing chamber are provided. In one embodiment, the invention generally provides a closure member integrated within a wall of a process chamber for sealing an opening within the wall of the chamber. In another embodiment, the invention provides a closure member configured to seal an opening in the wall of a processing chamber from the inside of the chamber. | 05-03-2012 |
Patent application number | Description | Published |
20100170070 | METHOD OF MANUFACTURING ELECTROLYTIC CAPACITOR - As to each of a capacitor element employing an anode foil having a matrix made of a metal and a film, provided on the surface of the matrix, made of an oxide of a metal different from the metal of the matrix and a capacitor element employing an anode foil having a matrix made of a prescribed metal and a film of an oxide of the metal and a cathode foil having a matrix made of another metal different from the metal, formation treatment is performed on an end face of the anode foil exposing the surface of the metal forming the matrix by applying a positive voltage to an anode lead wire and applying a negative voltage to a cathode lead wire. Thus, an electrolytic capacitor resistant against corrosion or the like is obtained. | 07-08-2010 |
20110126389 | METHOD OF MANUFACTURING ELECTROLYTIC CAPACITOR - An electrolytic capacitor is manufactured which includes at least one capacitor element having an anode portion, a dielectric film covering a part of the anode portion and a cathode portion located on the dielectric film; and a piece member attached to each anode portion. The dielectric film is formed on each of a plurality of anode portions including the anode portion. A connecting portion connecting the plurality of anode portions to each other is provided. After the step of providing the connecting portion, the cathode portion is formed on the dielectric film in order to form a plurality of capacitor elements including at least one capacitor element. After the step of forming the cathode portion, the piece member is cut out from the connecting portion in order to separate the plurality of capacitor elements from each other. | 06-02-2011 |
20120212880 | ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING ELECTROLYTIC CAPACITOR - An electrolytic capacitor according to the present invention includes a wound element formed by winding an anode body consisting of a band-shaped metal foil and a dielectric coat provided on the surface of the metal foil and a cathode body consisting of a band-shaped metal foil in the longitudinal direction. The electrolytic capacitor includes a first conductive polymer layer provided on the surface of the anode body. The first conductive polymer layer is provided to be more thickly present on an end portion of the anode body in the width direction than on a central portion of the anode body in the width direction on the surface of the anode body. | 08-23-2012 |
Patent application number | Description | Published |
20090176298 | Polymer Compound For Medical Material, And Biochip Substrate Using The Polymer Compound - A main object of the invention is to provide a polymer compound for medicine which has an excellent capability of fixing a biologically active substance and has such chemical/physical stability that the compound is less dissolved or deteriorated in a washing step, in particular, which can be suitably applied to a plastic substrate surface. | 07-09-2009 |
20090246286 | Particle for Medical Use and Process for Producing the Same - A main object of the invention is to provide a particle for medical use which has an excellent capability of fixing a target biologically active substance and has such chemical and physical stability that the particle is less dissolved or deteriorated in a washing step. | 10-01-2009 |
20120070474 | POLYMER COMPOUND FOR BIOMEDICAL USE AND BIOCHIP SUBSTRATE USING SUCH A POLYMER COMPOUND - A biochip substrate capable of realizing the high detection accuracy by restricting a nonspecific adsorption or bonding of a substance to be detected, when used for a detection or analysis of protein, nucleic acids and the like. The biochip substrate is for fixing a biologically active substance on a surface of a solid substrate, and characterized in that it has a layer comprising a polymer compound obtained by copolymerizing an ethylenically unsaturated polymerizable monomer having an alkylene glycol residue, an ethylenically unsaturated polymerizable monomer having a functional group for fixing a biologically active substance and an ethylenically unsaturated polymerizable monomer having a cross-linkable functional group, on the surface of the substrate. | 03-22-2012 |
20140212658 | BENZOXAZINE RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL - Provided are a fiber-reinforced composite material capable of achieving excellent CAI, ILSS, and bending fracture toughness concurrently at high levels, and maintaining a high glass transition temperature of the resin material therein, and prepreg and a benzoxazine resin composition therefor. The composition contains, at a particular ratio, (A) a compound having in its molecule a benzoxazine ring represented by formula (1), (B) an epoxy resin, (C) a curing agent, (D) a toughness improver, and (E) polyamide 12 particles of a particular particle size, and component (D) is dissolved: | 07-31-2014 |
20150056882 | FIBER-REINFORCED COMPOSITE MATERIAL - A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: | 02-26-2015 |
20150132553 | FIBER-REINFORCED COMPOSITE MATERIAL - Fiber-reinforced composite material is provided which is capable of achieving high levels of CAI, ILSS, and interlaminar fracture toughness concurrently, in particular, capable of achieving high ILSS at high CAI, temperature, and humidity. The fiber-reinforced composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein at least polyethersulphone particles are impregnated with a cured product of epoxy resin and a compound having in its molecule a benzoxazine ring represented by formula (1): | 05-14-2015 |
20150251394 | FIBER-REINFORCED COMPOSITE MATERIAL - A fiber-reinforced composite material is provided which is capable of achieving CAI, ILSS, and interlaminar fracture toughness concurrently at high levels, in particular, capable of achieving high CAI. The composite material is composed of a laminated body including a plurality of reinforcing-fiber-containing layers and a resin layer in each interlaminar region between adjacent reinforcing-fiber-containing layers, wherein the resin layer is a layer wherein a cured product of a compound having in its molecule a benzoxazine ring of formula (1) and epoxy resin is impregnated with at least polyamide 12 powder: | 09-10-2015 |
Patent application number | Description | Published |
20130192880 | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion. | 08-01-2013 |
20130233607 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line. | 09-12-2013 |
20130248894 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, MANUFACTURING METHOD OF THE SAME, AND LIGHT-EMITTING ELEMENT PACKAGE - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate. | 09-26-2013 |
20130313005 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a resin substrate in which first second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils. | 11-28-2013 |
20150028372 | LIGHT EMITTING DEVICE PACKAGE AND PACKAGE FOR MOUNTING LIGHT EMITTING DEVICE - A package for mounting a light emitting device thereon. The package includes a substrate, a light emitting device mounting part including a wiring formed on one surface of the substrate, the wiring including two areas that are arranged facing each other and being separated a predetermined interval apart from each other in a plan view, first and second through-wirings that penetrate the substrate and are provided on the two areas, respectively, each of the first and second through-wirings including one end electrically connected to the light emitting device mounting part and another end exposed from another surface of the substrate. A part of each of the first and second through-wirings includes a maximum part having a plan-view shape that is larger than a plan-view shape of the one end of each of the first and second through-wirings. | 01-29-2015 |
20150102380 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, MANUFACTURING METHOD OF THE SAME, AND LIGHT-EMITTING ELEMENT PACKAGE - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate. | 04-16-2015 |
Patent application number | Description | Published |
20140182767 | METHOD OF PRODUCING CLEANING MEMBER - To provide a novel production method and a novel production system that are suitable for producing a cleaning member having an excellent cleaning performance and that realize efficient production. The present invention is a method of producing a cleaning member obtained from a multi-layer web comprising at least a fiber bundle and a belt-shaped nonwoven fabric, wherein the method comprises at least the step of connecting the ends of the at least two the fiber bundles by melt-bonding. | 07-03-2014 |
20140183929 | METHOD AND APPARATUS FOR MANUFACTURING CLEANING MEMBER - In a method for manufacturing a cleaning member comprising opened fiber bundle, in order to correct twisting of fiber bundle in the path for feeding the fiber bundle from a storage container to a driving roller to thereby stabilize manufacturing process, and in order to pre-open the fiber bundle in the path from a driving roller to the opening step to thereby speed-up the opening step, fiber bundle drawn out continuously from a storage container in a first direction is wound onto a non-rotational bar, and after being fed in a second direction, is fed to a first driving roller, and the fiber bundle fed from the first driving roller in a third direction is wound onto a second non-rotational bar, and after being fed in a fourth direction, is fed to a second driving roller and to the following opening step. | 07-03-2014 |
20140187406 | METHOD OF PRODUCING CLEANING MEMBER - To provide a novel method of production and system of production which are suitable for producing a cleaning member excellent in cleaning performance and further which enable efficient production. The present invention is a method of producing a cleaning member which is obtained from a multilayer web which contains at least a fiber bundle and a belt-shaped nonwoven fabric, the method including at least a step of conveying the fiber bundle and a step of conveying the belt-shaped nonwoven fabric, the tension of the fiber bundle in the step of conveying the fiber bundle being lower than the tension of the belt-shaped nonwoven fabric in a step of conveying the belt-shaped nonwoven fabric. | 07-03-2014 |
20140193233 | STACKING DEVICE AND METHOD OF PRODUCTION OF WEB MEMBER - A stacking device which stacks together web members which drop down while drawing a parabolic arc, this is provided with a horizontal movement limit part which limits movement of web members in a horizontal direction, a temporary supporting unit which can take a projecting position where it projects from the horizontal movement limit part and a retracted position where it is pulled in from the projecting position and does not stick out from the horizontal movement limit part, and a receiving table which is positioned under the temporary supporting means at the projecting position and stacks the web members. The temporary supporting unit temporarily supports a web member at the projecting position and, after that, shifts to the retracted position to make the web member drop under the temporary supporting unit, so that the stacking device stacks the web members on the receiving table. | 07-10-2014 |