Yokomaku
Atsushi Yokomaku, Chiba-Ken JP
Patent application number | Description | Published |
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20090035247 | METHOD OF STABILIZING A POLYSILOXANE EMULSION AND COMPOSITIONS CONTAINING STABILIZED EMULSIONS - A method of stabilizing an emulsion containing a polysiloxane and one or more surfactants comprising adding an effective amount of dispersion containing a DADMAC/acrylamide copolymer and one or more sulfate salts into said emulsion is disclosed. An emulsion/cosmetically acceptable emulsion comprising a polysiloxane, at least one surfactant, and a dispersion containing DADMAC/acrylamide copolymer and one or more sulfate salts is also disclosed. | 02-05-2009 |
20110059038 | METHOD OF STABILIZING A POLYSILOXANE EMULSION AND COMPOSITIONS CONTAINING STABILIZED EMULSIONS - A method of stabilizing an emulsion containing a polysiloxane and one or more surfactants comprising adding an effective amount of dispersion containing a DADMAC/acrylamide copolymer and one or more sulfate salts into said emulsion is disclosed. An emulsion/cosmetically acceptable emulsion comprising a polysiloxane, at least one surfactant, and a dispersion containing DADMAC/acrylamide copolymer and one or more sulfate salts is also disclosed. | 03-10-2011 |
Hiroomi Yokomaku, Kanagawa JP
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20120236080 | LIQUID EJECTION HEAD AND IMAGE FORMING APPARATUS INCLUDING THE LIQUID EJECTION HEAD - A liquid ejection head includes a channel plate, a diaphragm member, and a piezoelectric member. The channel plate includes a separate liquid chamber, a fluid resistance portion, and a liquid introducing portion. The diaphragm member has a thin layer and a thick layer. The thin layer forms a wall face of each of the separate liquid chamber, the resistance portion, and the introducing portion and includes a vibration area facing the separate liquid chamber. The piezoelectric member is arranged to deform the vibration area and has a portion opposing the introducing portion. The thin layer has a thin portion forming the wall face of the introducing portion. The thick layer has a thick portion formed along the longitudinal direction of the separate liquid chamber on a first face opposite a second face opposing the introducing portion. In a plan view, the thin portion is divided by the thick portion. | 09-20-2012 |
20120320118 | METHOD OF CONTROLLING LIQUID EJECTION HEAD, AND LIQUID EJECTION DEVICE - A method of controlling a liquid ejection head controls a liquid ejection head including a liquid pressurizing chamber, nozzles communicating with the liquid pressurizing chamber, and a pressure generating device that generates pressure in the liquid pressurizing chamber based on a drive waveform. The method includes generating a preliminary ejection drive waveform with a predetermined number of successive drive pulses aligned in descending order of length of drive pulse intervals of the drive pulses, with each of the drive pulse intervals set to an integral multiple of a natural vibration period of the liquid pressurizing chamber, and applying the generated preliminary ejection drive waveform to the pressure generating device to cause the liquid ejection head to perform a preliminary ejecting operation. | 12-20-2012 |
20140210914 | LIQUID EJECTION HEAD AND IMAGE FORMING APPARATUS INCLUDING THE LIQUID EJECTION HEAD - A liquid ejection head includes a channel plate, a diaphragm member, and a piezoelectric member. The channel plate includes a separate liquid chamber, a fluid resistance portion, and a liquid introducing portion. The diaphragm member has a thin layer and a thick layer. The thin layer forms a wall face of each of the separate liquid chamber, the resistance portion, and the introducing portion and includes a vibration area facing the separate liquid chamber. The piezoelectric member is arranged to deform the vibration area and has a portion opposing the introducing portion. The thin layer has a thin portion forming the wall face of the introducing portion. The thick layer has a thick portion formed along the longitudinal direction of the separate liquid chamber on a first face opposite a second face opposing the introducing portion. In a plan view, the thin portion is divided by the thick portion. | 07-31-2014 |
20140240384 | IMAGE FORMING APPARATUS AND METHOD OF DRIVING AND CONTROLLING HEAD - An image forming apparatus includes a liquid ejection head including a pressure generation unit configured to generate a pressure for pressurizing a liquid in an individual liquid chamber communicating nozzles; and a head drive control unit configured to generate a drive waveform including pulses in time series, select one or more pulses from the drive waveform according to a droplet size, and provide the selected drive pulses to the pressure generation unit. The drive waveform includes a first pulse not including a waveform component that suppresses ejection bending, and allowing a droplet to be ejected, and a second pulse including the waveform component that suppresses ejection bending, and allowing a droplet to be ejected. An amount of the droplet ejected in the second pulse is larger than in the first pulse, and a speed of the droplet ejected in the second pulse is higher than that in the first pulse. | 08-28-2014 |
Masato Yokomaku, Yokohama JP
Patent application number | Description | Published |
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20140159685 | CONTROL DEVICE AND POWER SUPPLY DEVICE - A control device includes: a control circuit that controls a power supply circuit by a feedback of an output from an output terminal, the power supply circuit having a first transistor, the first transistor including gallium nitride material and having a source and a drain connected so that one of the source and the drain is connected to a first power supply and an other of the source and the drain is connected to the output terminal; and a first terminal via which a first control signal output by the control circuit is output to a gate of the first transistor. | 06-12-2014 |
20140167721 | POWER SUPPLY DEVICE - A power supply device includes: a first transistor that switches a first current flowing between a first terminal and a second terminal of the first transistor; a second transistor that has a first terminal connected to the first terminal of the first transistor and a control terminal connected to a control terminal of the first transistor and is formed in a chip in which the first transistor is formed; a current source that supplies a second current between the first and second terminals of the second transistor; and a control part that performs a turn-on and turn-off control of the first transistor on the basis of voltages of the second terminals of the first and second transistors. | 06-19-2014 |
Takeshi Yokomaku, Osaka JP
Patent application number | Description | Published |
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20120031791 | CASE - A rolled object whose core juts from the respective end portions is housed. End face wall components which support the core so as to horizontally suspend the rolled object and side wall components which connect the end face wall components with each other and cause the end face components to be provided on the respective sides of the rolled object in horizontal directions are provided. Each of the side wall components has a vertically-provided planar wall portion and a jutting portion which is formed horizontally across the wall portion at a vertical central portion of the wall portion and juts to be able to surface-contact a circumferential surface of the rolled object. | 02-09-2012 |
Toshihiko Yokomaku, Ogaki JP
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20090229873 | MULTILAYER PRINTED WIRING BOARD AND COMPONENT MOUNTING METHOD THEREOF - A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided. | 09-17-2009 |