Patent application number | Description | Published |
20080203138 | Method of mounting an electronic component and mounting apparatus - In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps. | 08-28-2008 |
20080206587 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC DEVICE - An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet. | 08-28-2008 |
20080225433 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - A method and apparatus for assembling a carriage assembly attach suspensions to carriage arms without deformation and with higher accuracy than with the conventional art. | 09-18-2008 |
20080265002 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20080265003 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20090115577 | RFID TAG - An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other. | 05-07-2009 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090170245 | ELECTRONIC APPARATUS MANUFACTURING METHOD - An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of,, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps. | 07-02-2009 |
20090243006 | ELECTRONIC PART WITH AFFIXED MEMS - According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip. | 10-01-2009 |
20090320270 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method. | 12-31-2009 |
20100001081 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100001387 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100001388 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS MOUNTED WITH ELECTRONIC DEVICE, ARTICLE EQUIPPED WITH ELECTRONIC DEVICE AND METHOD OF PRODUCING ELECTRONIC DEVICE - An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base. | 01-07-2010 |
20100095515 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - A method of assembling a carriage assembly that is operable, during a crimping step that passes a ball, which has a diameter that is equal to or larger than an inner diameter of spacer holes of suspensions, successively through the spacer holes using a bar-shaped pressing member that is subjected to ultrasonic vibration to thereby crimp spacer hole inner circumferential portions of the spacer portions and attach the suspensions to the front end portions of the carriage arms, to prevent the pressing member that presses the ball from colliding with an inner circumferential surface and the like of the spacer holes of the spacer portions and is therefore able to substantially eliminate tilting from the standard angle of the suspensions due to deformation of the spacer portions, and an assembling apparatus that uses such method are provided. | 04-22-2010 |
20110074020 | SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE - A method for mounting a semiconductor device by mounting a semiconductor chip on a board by flip chip bonding, comprising: contacting an Au bump of the semiconductor chip with a Sn—Bi solder; and heating the Sn—Bi solder at a temperature which is not lower than the melting point thereof and which is not higher than 180° C. for 30 minutes or more. | 03-31-2011 |
20120043005 | ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD - A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material. | 02-23-2012 |