Patent application number | Description | Published |
20080225433 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - A method and apparatus for assembling a carriage assembly attach suspensions to carriage arms without deformation and with higher accuracy than with the conventional art. | 09-18-2008 |
20080265002 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20080265003 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same - A method of ultrasonic mounting can increase mounting efficiency by using high-frequency ultrasound and can also mount large semiconductor chips. The method ultrasonically bonds a semiconductor chip | 10-30-2008 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090152327 | WIRE BONDING METHOD - According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater. | 06-18-2009 |
20090243006 | ELECTRONIC PART WITH AFFIXED MEMS - According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip. | 10-01-2009 |
20090320270 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - There are provided a method of assembling a carriage assembly that can uniformly crimp edge portions of spacer holes of spacer portions and keep the spacer portions flat, thereby maintaining the angles of suspensions with high accuracy, and an assembling apparatus that uses such method. | 12-31-2009 |
20100095515 | METHOD AND APPARATUS FOR ASSEMBLING A CARRIAGE ASSEMBLY - A method of assembling a carriage assembly that is operable, during a crimping step that passes a ball, which has a diameter that is equal to or larger than an inner diameter of spacer holes of suspensions, successively through the spacer holes using a bar-shaped pressing member that is subjected to ultrasonic vibration to thereby crimp spacer hole inner circumferential portions of the spacer portions and attach the suspensions to the front end portions of the carriage arms, to prevent the pressing member that presses the ball from colliding with an inner circumferential surface and the like of the spacer holes of the spacer portions and is therefore able to substantially eliminate tilting from the standard angle of the suspensions due to deformation of the spacer portions, and an assembling apparatus that uses such method are provided. | 04-22-2010 |
20100126763 | WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SAME - A wire bonding method which includes forming a bump on a first electrode provided in a first electronic part and bonding the bump and a second electrode provided in a second electronic part by using a wire, wherein the bump and the wire are formed using materials containing Au, and an Au purity of the material forming the bump is lower than an Au purity of the material forming the wire. | 05-27-2010 |
20100258640 | RFID TAG AND MANUFACTURING METHOD THEREOF - An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material. | 10-14-2010 |
20100327435 | ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads. | 12-30-2010 |
20100328917 | MULTICHIP MODULE, PRINTED CIRCUIT BOARD UNIT, AND ELECTRONIC APPARATUS - A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate. | 12-30-2010 |
20110074020 | SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE - A method for mounting a semiconductor device by mounting a semiconductor chip on a board by flip chip bonding, comprising: contacting an Au bump of the semiconductor chip with a Sn—Bi solder; and heating the Sn—Bi solder at a temperature which is not lower than the melting point thereof and which is not higher than 180° C. for 30 minutes or more. | 03-31-2011 |
20110079896 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion. | 04-07-2011 |
20110168789 | RFID tag manufacturing method with strap and substrate - In a manufacturing method of a thin and small RFID tag, an antenna metal pattern is formed on a substrate, going once around a dielectric plate, and a recess is formed on the substrate to house an IC chip. A strap on which the IC chip is mounted is connected and fastened to the substrate in the position and orientation in which the IC chip is housed in the recess. | 07-14-2011 |
20120037687 | Capillary and ultrasonic transducer for ultrasonic bonding - A capillary is attached to an ultrasonic transducer of a wire-bonding apparatus. The capillary includes a first part configured to be attached to the ultrasonic transducer, and a second part other than the first part and extending from the first part. The first part has a shape different from a shape of the second part so that the first part has a flexure rigidity larger than the second part. | 02-16-2012 |
20120138662 | WIRE BONDING METHOD - According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater. | 06-07-2012 |
20130249087 | ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads. | 09-26-2013 |