Grolier
Jean-Pierre Grolier, Clermont-Ferrand FR
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20150092816 | METHOD FOR THE ISOBARIC TRANSFER OF A FLUID FROM A DEPOSIT AND DEVICE FOR IMPLEMENTING SUCH A METHOD - The invention relates to method for transferring under pressure a fluid extracted from the deposit by means of a sampling vessel ( | 04-02-2015 |
Nicolas Grolier, Clermont-Ferrand FR
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20090014108 | TIRE WITH SEATS OF UNEQUAL DIAMETERS AND REVERSE AXIAL OFFSET IN AN INFLATED STATE - A tire is provided that includes a crown with a mid-plane S, two sidewalls, a first bead, of diameter Φ | 01-15-2009 |
20090102274 | Vehicle Rim With Non-Matching Diameter Seats - A vehicle rim with symmetry of revolution intended for mounting a tire, including a first seat intended to receive and retain a first bead of the tire; a mounting groove; and a second seat intended to receive and retain a second bead of the tire, the second seat being of an average diameter smaller than the average diameter of the first seat, characterized in that the maximum radial depth of the mounting groove (H | 04-23-2009 |
Vincent Grolier, Muenchen DE
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20110073902 | Semiconductor Body and Method of Producing a Semiconductor Body - A semiconductor body includes an n-conductive semiconductor layer and a p-conductive semiconductor layer. The p-conductive semiconductor layer contains a p-dopant and the n-conductive semiconductor layer an n-dopant and a further dopant. | 03-31-2011 |
Vincent Grolier, Regensburg DE
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20090218591 | Method for Connecting Layers, Corresponding Component and Organic Light-Emitting Diode - A method for bonding several layers, which comprise at least one thermally bondable material, by means of a joint layer produced with the aid of thermocompression at least one of the layers comprising a semiconductor material, as well as to a correspondingly manufactured device. Also disclosed is a method for manufacturing an organic light-emitting diode and an organic light-emitting diode that is encapsulated between two cover layers with the aid of thermocompression. | 09-03-2009 |
20110053308 | Method for the Production of an Optoelectronic Component using Thin-Film Technology - On an epitaxy substrate ( | 03-03-2011 |
Vincent Grolier, München DE
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20110164644 | OPTOELECTRONIC SEMICONDUCTOR CHIP WITH GAS-FILLED MIRROR - An optoelectronic semiconductor chip includes a semiconductor body containing an active region, a mirror layer, and contact points arranged between the semiconductor body and the mirror layer and providing a spacing D between the semiconductor body and the mirror layer, whereby at least one cavity is formed between the mirror layer and the semiconductor body and the at least one cavity contains a gas. | 07-07-2011 |
20110278641 | METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP AND OPTOELECTRONIC SEMICONDUCTOR CHIP - An optoelectronic semiconductor chip includes a semiconductor layer sequence having at least one doped functional layer having at least one dopant and at least one codopant, wherein the semiconductor layer sequence includes a semiconductor material having a lattice structure, one selected from the dopant and the codopant is an electron acceptor and the other an electron donor, the codopant is bonded to the semiconductor material and/or arranged at interstitial sites, and the codopant at least partly forms no bonding complexes with the dopant. | 11-17-2011 |
20120112226 | LIGHT-EMITTING DIODE AND METHOD FOR THE PRODUCTION OF A LIGHT-EMITTING DIODE - A light emitting diode includes a semiconductor body including an active region that produces radiation, a carrier body fastened to the semiconductor body on an upper side of the semiconductor body, the carrier body including a luminescence conversion material consisting of a ceramic luminescence conversion material, a mirror layer applied to the semiconductor body on an underside of the semiconductor body remote from the upper side, and two contact layers, a first contact layer of the contact layers connected electrically conductively to an n-conducting region of the semiconductor body and a second contact layer of the contact layers connected electrically conductively to a p-conducting region of the semiconductor body. | 05-10-2012 |