Patent application number | Description | Published |
20090159822 | NOVEL ELECTROSTATICALLY ADDRESSABLE MICROVALVES - An improved microvalve is described. The microvalve includes a corresponding actuation aperture in an actuation aperture layer. A control fluid flows through the actuation aperture. The flow of the control fluid is controlled by an electric field typically applied via a charge distribution near an actuation aperture layer. In one embodiment, the electric field may adjust the opening and closing of the actuation aperture thereby controlling the flow of the control fluid. In a second embodiment, the control fluid is an electrorheological fluid where the electric field controls the viscosity of the ER fluid thereby controlling fluid flow through the actuation aperture. In both embodiments the flow of the control fluid controls stretching of a flexible membrane formed along the wall of a conduit through which a fluid to be controlled flows. The stretching of the flexible membrane controlling the flow of the main fluid to be controlled. | 06-25-2009 |
20090218260 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 09-03-2009 |
20100085585 | DIGITAL IMAGING OF MARKING MATERIALS BY THERMALLY INDUCED PATTERN-WISE TRANSFER - An imaging system including an image receiving structure including a material layer having a tunable energy transfer characteristic; and an energy source to emit an energy beam at the material having the tunable energy transfer characteristic such that marking material is pattern-wise transferred to the image receiving structure. | 04-08-2010 |
20100186221 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 07-29-2010 |
20100186222 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 07-29-2010 |
20100192365 | MICRO-ASSEMBLER - A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate. | 08-05-2010 |
20100230139 | PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY - A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together. | 09-16-2010 |
20100251914 | IMAGING MEMBER - An imaging member is disclosed having a surface layer comprising a heat-sensitive material whose surface compatibility to printing agents, such as toners and inks, can be substantially reversed in response to small changes in temperature. The imaging member is suitable for use in lithographic and printing applications, permitting reversible switching between compatibility states of printing agents, such as between hydrophilic and hydrophobic states or oleophilic and oleophobic states, and enabling rapid production of images on a recording medium. | 10-07-2010 |
20100252927 | Pattern-Print Thin-Film Transistors with Top Gate Geometry - A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode. | 10-07-2010 |
20100290501 | NANOCALORIMETER BASED ON THERMAL PROBES - A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable. | 11-18-2010 |
20100295164 | AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL - A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold. | 11-25-2010 |
20100295165 | STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS - A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive. | 11-25-2010 |
20110067589 | ANILOX METERING SYSTEM FOR ELECTROGRAPHIC PRINTING - An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells. | 03-24-2011 |
20110067590 | ANILOX METERING SYSTEM FOR ELECTROGRAPHIC PRINTING - An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells. | 03-24-2011 |
20110107928 | DIGITAL PRINTING PLATE AND SYSTEM WITH ELECTROSTATICALLY LATCHED DEFORMABLE MEMBRANES - A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state. | 05-12-2011 |
20110223778 | MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER - A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors. | 09-15-2011 |
20110227200 | ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING - A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features. | 09-22-2011 |
20110318880 | CONTACT SPRING APPLICATION TO SEMICONDUCTOR DEVICES - A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate. | 12-29-2011 |
20120040283 | IMAGING MEMBERS FOR INK-BASED DIGITAL PRINTING COMPRISING STRUCTURED ORGANIC FILMS - An imaging member for ink-based digital printing having an outermost layer including a structured organic film (SOF) having a plurality of segments and a plurality of linkers arranged as a covalent organic framework, wherein the structured organic film may be multi-segment thick. | 02-16-2012 |
20120067637 | Interposer with microspring contacts and methods of making and using same - An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer. | 03-22-2012 |
20120068331 | Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same - At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring. | 03-22-2012 |
20120088330 | AIRGAP MICRO-SPRING INTERCONNECT WITH BONDED UNDERFILL SEAL - A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold. | 04-12-2012 |
20120266464 | MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER - A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors. | 10-25-2012 |
20120297618 | PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY - A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. | 11-29-2012 |
20130154127 | Microspring Structures Adapted for Target Device Cooling - In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided. | 06-20-2013 |
20130196471 | STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS - A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive. | 08-01-2013 |
20130232782 | Method of Producing an Interposer with Microspring Contacts - An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer. | 09-12-2013 |
20140106512 | MICROCHIP CHARGE PATTERNING - A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and using an external device to develop charge in the material. | 04-17-2014 |
20140106541 | MICROCHIP CHARGE PATTERNING - A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid. | 04-17-2014 |
20140265848 | Micro-Plasma Generation Using Micro-Springs - An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate. | 09-18-2014 |
20140268596 | Flexible Metal Interconnect Structure - A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains. | 09-18-2014 |
20140272121 | Digital 3D Fabrication Using Multi-Layered Mold - A replica 3D structure is fabricated inside a multi-layered mold by patterning each mold layer to define a void/opening that matches a corresponding cross section of the structure's peripheral surface, and filling the patterned opening of each layer with a structural material (i.e., before depositing a subsequent layer of mold material). The mold material (e.g., photoresist or another dissolvable sacrificial material) is blanket deposited (e.g., by slot-die, spray coating) and then patterned using a laser or a printed mask. Each layer of modeling material (e.g., polymer, ceramic or metal, or a combination thereof) is electro-plated or otherwise deposited on the previously formed modeling material layer. High vertical resolution is achieved by utilizing relatively thin mold layers. The mold layer deposition, patterning and modeling material deposition is repeated until the replica 3D structure is entirely formed inside the multi-layered mold, and then the mold is dissolved or otherwise removed. | 09-18-2014 |
20150076961 | METHOD FOR REDUCTION OF STICTION WHILE MANIPULATING MICRO OBJECTS ON A SURFACE - A system and method reduce stiction while manipulating micro objects on a surface. The system and method employed a field generator configured to generate a driving force at a frequency and amplitude to at least partially overcome stiction between the micro objects and the surface. The field generator is further configured to generate a manipulation force to manipulate the micro objects on the surface in two dimensions. The manipulation force is spatially programmable. | 03-19-2015 |