Patent application number | Description | Published |
20100304280 | METHOD OF FORMING A TEMPLATE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE TEMPLATE - A method of manufacturing a semiconductor device using a template on which a pattern is formed beforehand is disclosed. An error between a position of the pattern formed on the template and a reference position where the pattern is to be formed is obtained. An outer shape of the template is processed in accordance with the obtained error. The error of the template is corrected by distorting the template through application of pressure to a side face of the template whose outer shape is processed. The pattern is transferred onto a transfer layer formed on a semiconductor substrate by using the template in which the error is corrected. | 12-02-2010 |
20110097827 | PATTERN FORMATION METHOD AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern. | 04-28-2011 |
20110192300 | IMPRINT METHOD AND IMPRINT APPARATUS - According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template. | 08-11-2011 |
20120074605 | FINE PROCESSING METHOD, FINE PROCESSING APPARATUS, AND RECORDING MEDIUM WITH FINE PROCESSING PROGRAM RECORDED THEREON - According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range. | 03-29-2012 |
20130217155 | PATTERN FORMING METHOD, PATTERN FORMING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a pattern forming method using a template containing a pattern that has at least one recess section or protrusion section to transfer the shape of the pattern to a resin layer on a substrate, is provided. The method includes a process for coating the resin on the substrate, a process for making the hardness of the first portion as a portion of the resin higher than the hardness of the second portion as the portion other than the first portion, and a process in which the portion other than the pattern of the template makes contact with the first portion, in a state where a gap is maintained between the template and the resin, the shape of the pattern is transferred to the second portion, and the resin is cured. Embodiments of an apparatus for pattern forming are also provided. | 08-22-2013 |
20130224963 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit. | 08-29-2013 |
20140200704 | FINE PROCESSING METHOD, FINE PROCESSING APPARATUS, AND RECORDING MEDIUM WITH FINE PROCESSING PROGRAM RECORDED THEREON - According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range. | 07-17-2014 |
20140246808 | PATTERN FORMATION METHOD AND PATTERN FORMATION DEVICE - According to one embodiment, a pattern formation method is disclosed. The method is configured to transfer a shape of a pattern to a plurality of shot regions of an object using a mold including a first pattern region and a second pattern region aligned with the first pattern region. The method can include transferring the shape of the pattern to each of the plurality of shot regions sequentially in a first direction from the first pattern region toward the second pattern region when the shape of the pattern is transferred using the first pattern region. The method can include transferring the shape of the pattern to each of the plurality of shot regions sequentially in a second direction from the second pattern region toward the first pattern region when the shape of the pattern is transferred using the second pattern region. | 09-04-2014 |
20150014876 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - Provided is an imprint apparatus that applies a resin to several locations on a substrate, brings the resin and a mold into contact, and transfers a contoured pattern formed in the mold to the resin, comprising: a controller that sets a principal axis direction according to the contoured pattern and determines the application positions of the resin based on the principal axis direction that has been set such that the distances between resin drops that have been applied so as to be separated in the principal axis direction is larger than the distances between resin drops that have been applied so as to be separated in a direction that is perpendicular to the principal axis direction; and a dispenser that applies the resin based on the application position that has been determined. | 01-15-2015 |
20150014877 | IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD - Provided is an imprint apparatus that applies a resin (drops) dispersed, at a plurality of locations on a substrate, brings the resin and a mold into contact, and transfers the contoured pattern that is formed in the mold to the resin comprising: a controller that sets a principal axis direction according to the contoured pattern and an array direction in which a plurality of resin drops are aligned, and determines application positions for the resin such that the array direction is angled with respect to the principal axis direction; and a dispenser that applies the resin based on the application positions that have been determined. | 01-15-2015 |
20150054188 | MOLD CLEANING APPARATUS AND MOLD CLEANING METHOD - According to one embodiment, a mold cleaning apparatus includes a holding unit, a medium supply unit and a deformation unit. The holding unit is configured to hold a mold. The mold has a concave pattern feature. The concave pattern feature is provided on a first surface of a base plate. The medium supply unit is configured to supply a medium to the concave pattern feature. The deformation unit is configured to bend the mold such that the first surface of the mold is convex. | 02-26-2015 |
Patent application number | Description | Published |
20100023146 | CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data. | 01-28-2010 |
20100136796 | SUBSTRATE HOLDING MEMBER, IMMERSION TYPE EXPOSURE DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A substrate holding member according to an embodiment includes an opening having a minimum internal diameter lager than a diameter of a space in which a substrate to be exposed on a substrate stage is disposed, wherein an inner peripheral surface of the opening has a shape expanding toward a lower surface at least partly. | 06-03-2010 |
20110229988 | PATTERN FORMING METHOD, PROCESSING METHOD, AND PROCESSING APPARATUS - According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent. | 09-22-2011 |
20120244719 | IMPRINT METHOD, IMPRINTING EQUIPMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In an imprint method according to one embodiment, a template on which a template pattern is formed is pushed against resist on a substrate to be transferred while the resist is cured in this state. The template is subsequently separated from the cured resist. The template is then degassed from the template pattern surface side between after the template is separated from the cured resist and till the template is pushed against resist at the next shot. | 09-27-2012 |
Patent application number | Description | Published |
20080218715 | IMMERSION EXPOSURE METHOD OF AND IMMERSION EXPOSURE APPARATUS FOR MAKING EXPOSURE IN A STATE WHERE THE SPACE BETWEEN THE PROJECTION LENS AND SUBSTRATE TO BE PROCESSED IS FILLED WITH A LIQUID - An immersion exposure method is disclosed which, while causing a relative movement of an immersion area formed so as to intervene between a substrate to be exposed on an exposure stage and a projection lens to the substrate, exposes an irradiation area of the substrate covered with the immersion area. An exposure stage is moved in a first direction, thereby exposing a first exposure area of the substrate. The exposure stage is moved in a second direction opposite to the first direction, thereby exposing a second exposure area adjoining the first exposure area. In a state where the second exposure area is held inside the immersion boundary of the immersion area, the exposure stage is moved from the movement end position of the exposure stage in a first exposure moving process to the movement start position of the exposure stage in a second exposure moving process. | 09-11-2008 |
20080225254 | PHOTOMASK, PHOTOMASK SUPERIMPOSITION CORRECTING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - In a photomask in which a device pattern, an alignment mark and a superimposition inspection mark are formed on a light transmitting base, each of the alignment mark and the superimposition inspection mark includes a main mark portion, and first and second auxiliary pattern portions. The main mark portion is constituted of one of a space pattern and a line pattern, the pattern having a linear width to be resolved on a photosensitive film formed on a semiconductor wafer, and each of the first and second auxiliary pattern portions includes an auxiliary pattern constituted of one of a repeated pattern of a space pattern and a repeated pattern of a line pattern, the repeated pattern having a linear width not to be resolved on the photosensitive film. The pitch of the repeated pattern is equal to the minimum pitch of the device pattern. | 09-18-2008 |
20090296054 | IMMERSION LITHOGRAPHY METHOD - An immersion lithography method includes preparing an exposure tool having an exposure stage, a projection lens having an immersion head movable on the stage and used to form an immersion region and an illumination light source provided on the projection lens via a mask, placing a to-be-exposed substrate on the stage, supplying a liquid by use of the immersion head and forming the immersion region disposed between a surface portion of the substrate and a lower end portion of the projection lens, and relatively moving the stage and projection lens while holding the immersion region and exposing a region of the substrate covered with the immersion region. A first distance between the projection lens and the substrate is kept unchanged and a second distance between the immersion head and substrate is changed according to an exposure sequence. | 12-03-2009 |
20150221501 | IMPRINT METHOD, TEMPLATE, AND IMPRINT APPARATUS - According to one embodiment, in an imprint method, a template in which a pattern is arranged in a central region and an outside region is contacted against a first imprint shot. Light is irradiated via a dimming member so that a partial region of a resist contacted by the outside region has hardness lower than target hardness, and thereafter, the template is separated. Furthermore, the template is contacted against a second imprint shot so that the first and second imprint shots are superposed in the partial region. Light is then irradiated so that the resist in the partial region reaches the target hardness, and thereafter, the template is separated. | 08-06-2015 |