Patent application number | Description | Published |
20080316471 | DETERMINING AZIMUTH ANGLE OF INCIDENT BEAM TO WAFER - A method, system and computer program product for determining an Azimuth angle of an incident beam to a wafer are disclosed. A method comprises: using the incident beam to make a first set of measurements of calibration targets of a first set of grating angles that are different than one another; analyzing the first set of measurements to determine an reference grating angle which corresponds to a grating line to which the incident beam has a practically zero Azimuth angle; and determining the Azimuth angle of the incident beam to the wafer using the determined reference grating angle. | 12-25-2008 |
20090009763 | FLIPPING STAGE ARRANGEMENT FOR REDUCED WAFER CONTAMINATION CROSS SECTION AND IMPROVED MEASUREMENT ACCURACY AND THROUGHPUT - A sample stage for performing measurements using an optical metrology system includes at least one sample section for retention of a sample, and components for controlling orientation of the sample section with relation to the optical metrology system. A method and a computer program product are provided. | 01-08-2009 |
20090021236 | Alignment Correction System and Method of Use - A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit. | 01-22-2009 |
20090027660 | OPTICAL SPOT GEOMETRIC PARAMETER DETERMINATION USING CALIBRATION TARGETS - A method, system and computer program product for determining a geometric parameter of an optical spot of a light beam are disclosed. A method comprises: providing a calibration target, the calibration target including a systematic variation in a parameter; measuring the calibration target with respect to the systematic variation using the light beam to obtain a plurality of measurements; and analyzing the measurements and the systematic variation to determine the geometric parameter of the optical spot. | 01-29-2009 |
20090185183 | MONITORING STAGE ALIGNMENT AND RELATED STAGE AND CALIBRATION TARGET - Methods, apparatuses and systems for monitoring a stage alignment in a processing system are disclosed. A method for monitoring a stage alignment in a processing system may include providing a calibration target on a surface of the stage; measuring an angle of incident of a light beam to the calibration target; and monitoring the stage alignment based on the determined angle of incidence. | 07-23-2009 |
20090312982 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit. | 12-17-2009 |
20130238112 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. | 09-12-2013 |
20130245993 | ALIGNMENT CORRECTION SYSTEM AND METHOD OF USE - A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool including at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. | 09-19-2013 |