Ming-Ching
Ming-Ching Chang, Hsinchu TW
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20120095582 | CHAMBER MATCH USING IMPORTANT VARIABLES FILTERED BY DYNAMIC MULTIVARIATE ANALYSIS - The present disclosure provides a method of chamber match. The method includes identifying a golden chamber designed operable to implement a semiconductor process; identifying a reference chamber designed operable for the semiconductor process; and extracting a matching index of a processing chamber relative to the golden chamber and the reference chamber using a dynamic variable analysis. | 04-19-2012 |
20130187235 | COMPOSITE DUMMY GATE WITH CONFORMAL POLYSILICON LAYER FOR FINFET DEVICE - The present disclosure involves a FinFET. The FinFET includes a fin structure formed over a substrate. A gate dielectric layer is least partially wrapped around a segment of the fin structure. The gate dielectric layer contains a high-k gate dielectric material. The FinFET includes a polysilicon layer conformally formed on the gate dielectric layer. The FinFET includes a metal gate electrode layer formed over the polysilicon layer. The present disclosure provides a method of fabricating a FinFET. The method includes providing a fin structure containing a semiconductor material. The method includes forming a gate dielectric layer over the fin structure, the gate dielectric layer being at least partially wrapped around the fin structure. The method includes forming a polysilicon layer over the gate dielectric layer, wherein the polysilicon layer is formed in a conformal manner. The method includes forming a dummy gate layer over the polysilicon layer. | 07-25-2013 |
20130203247 | METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE - An embodiment of the current disclosure includes a method of providing a substrate, forming a polysilicon layer over the substrate, forming a first photoresist layer on the polysislicon layer, creating a first pattern on the first photoresistlayer, wherein some portions of the polysilicon layer are covered by the first photoresist layer and some portions of the polysilicon layer are not covered by the first photoresist layer, implanting ions into the portions of the polysilicon layer that are not covered by the first photoresist layer, removing the first photoresist layer from the polysilicon layer, forming a second photoresist layer on the polysilicon layer, creating a second pattern on the second photoresistlayer, and implanting ions into the portions of the polysilicon layer that are not covered by the second photoresist layer, removing the second photoresist layer from the polysilicon layer, and removing portions of the polysilicon layer using an etchant. | 08-08-2013 |
20130252425 | METHOD OF FORMING A SEMICONDUCTOR DEVICE - A method includes providing a first mask pattern over a substrate, forming first spacers adjoining sidewalls of the first mask pattern, removing the first mask pattern, forming second spacers adjoining sidewalls of the first spacers, forming a filling layer over the substrate and between the second spacers, and forming a second mask pattern over the substrate. | 09-26-2013 |
Ming-Ching Chang, Hsin-Chu TW
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20140001559 | Dummy Gate Electrode of Semiconductor Device | 01-02-2014 |
20140252486 | Fin Shape For Fin Field-Effect Transistors And Method Of Forming - A fin field-effect transistor (finFET) and a method of forming are provided. A gate electrode is formed over one or more fins. Notches are formed in the ends of the gate electrode along a base of the gate electrode. Optionally, an underlying dielectric layer, such as a shallow trench isolation, may be recessed under the notch, thereby reducing gap fill issues. | 09-11-2014 |
20140349473 | Dummy Gate Electrode of Semiconductor Device - The disclosure relates to a dummy gate electrode of a semiconductor device. An embodiment comprises a substrate comprising a first surface; an insulation region covering a portion of the first surface, wherein the top of the insulation region defines a second surface; and a dummy gate electrode over the second surface, wherein the dummy gate electrode comprises a bottom and a base broader than the bottom, wherein a ratio of a width of the bottom to a width of the base is from about 0.5 to about 0.9. | 11-27-2014 |
Ming-Ching Chang, Hsinchu City TW
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20120108046 | Patterning Methodology for Uniformity Control - The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patternable layer over a substrate. The method includes forming a first layer over the patternable layer. The method includes forming a second layer over the first layer. The second layer is substantially thinner than the first layer. The method includes patterning the second layer with a photoresist material through a first etching process to form a patterned second layer. The method includes patterning the first layer with the patterned second layer through a second etching process to form a patterned first layer. The first and second layers have substantially different etching rates during the second etching process. The method includes patterning the patternable layer with the patterned first layer through a third etching process. | 05-03-2012 |
20130309834 | METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes receiving a semiconductor device, patterning a first hard mask to form a first recess in a high-resistor (Hi-R) stack, removing the first hard mask, forming a second recess in the Hi-R stack, forming a second hard mask in the second recess in the Hi-R stack. A HR can then be formed in the semiconductor substrate by the second hard mask and a gate trench etch. | 11-21-2013 |
20140284724 | Method of Semiconductor Integrated Circuit Fabrication - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes receiving a semiconductor device, patterning a first hard mask to form a first recess in a high-resistor (Hi-R) stack, removing the first hard mask, forming a second recess in the Hi-R stack, forming a second hard mask in the second recess in the Hi-R stack. A HR can then be formed in the semiconductor substrate by the second hard mask and a gate trench etch. | 09-25-2014 |
Ming-Ching Chen, Taipei TW
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20120295494 | CENTRAL CONDUCTOR OF COAXIAL CABLE CONNECTOR - A central conductor of coaxial cable connector includes a barrel, at least one first spring plate group, and at least one second spring plate group. The barrel has two ends forming connection bores, opposite side surfaces respectively forming a first slit and a second slit, and top and bottom walls respectively forming a wall opening and a bottom wall opening. The first spring plate group and the second spring plate group are arranged opposite in direction to each other and each includes spring plates that are arranged to engage each other from upper and lower sides. Each of the spring plates has an end connected to the top or bottom wall of the barrel and an opposite end extending inward of the top wall opening or the bottom wall opening. As such, clamping force is enhanced, contact area is increased, and resiliency limit is improved, so as to provide excellent engagement between conductors. | 11-22-2012 |
Ming-Ching Chen, Tu-Cheng TW
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20090061670 | Electrical card connector - An electrical card connector for receiving a card, comprises an insulative housing having a supporting surface with a front end and a rear end; a plurality of contacts assembled in the housing and oriented toward the rear end; a switch terminal arranged in the rear end. Each contact has at least a contact engaging portion extending above the supporting surface; one of the contact engaging portions engaged with the switch terminal when a card is inserted, and electrically separated from each other when the card is removed. | 03-05-2009 |
20090247008 | RECEPTACLE RF CONNECTOR HAVING INTERFERENTIAL ENGAGEMENT BETWEEN CONTACT TERMINAL AND HOUSING - A receptacle RF connector ( | 10-01-2009 |
20090269987 | Electrical connector and electrical connector assembly having terminals with elasticity - An electrical connector includes an insulative housing ( | 10-29-2009 |
20100311256 | ELECTRICAL CONNECTOR WITH IMPROVED CONTACTS - An electrical connector includes an insulative housing defining a receiving room having a bottom wall and a mating portion extending upward from an inner face of the bottom wall of the receiving room and a plurality of contacts received in the housing. The mating portion has a plurality of receiving passageways communicating with the receiving room and a plurality of nose portions are above the receiving passageways. Each contact defines an elastic portion, a soldering portion, and a fixing portion between the elastic portion and a soldering portion. The elastic portion includes a first contacting portion protruding from the nose portion in the receiving room, a second contacting portion extending from the fixing portion, and a connecting portion between two contacting portions and defining an arc portion extending in an upward-to-downward direction and under the nose portion. The arc portion defines a node extending far from the nose portion. | 12-09-2010 |
Ming-Ching Chuang, Kaohsiung County TW
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20090313919 | PANEL ASSEMBLY STRUCTURE FOR MULTIPLE PURPOSES - A panel assembly structure for multiple purposes includes a base and a number of panels connected to the base. The base is provided with a number of first connecting members protruding from the base. Each panel is provided with a second connecting member to be connected with the first connecting member. A first space is defined between the base and the panel. A second space is defined between every two of the panels. The second space is interconnected with the first space. The panels are free to be disengaged from the base. A carrying board is inserted into the first space and the second space. | 12-24-2009 |
Ming-Ching Liang, Anding Township TW
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20090215551 | WEIGHT ADJUSTING STRUCTURE OF GOLF CLUB HEAD - A weight adjusting structure of a golf club head comprises a 360-degree rotatable rotary table installed in a body of a golf club head, wherein the rotary table is combined with an incomplete annular weight block at a peripheral portion on an arbitrary side thereof, so that the rotary table and the weight block form a rotary table assembly whose weight orientation can be adjusted. The weighted rotary table assembly installed in the body of the golf club head can be used to adjust a distribution of different weights around 360 degrees, whereby a preferred location of the club head's gravity center can be set according to a golfer's swing posture and a location of the club head's gravity center the golfer is used to. | 08-27-2009 |
20110028237 | WEIGHT ADJUSTING STRUCTURE OF GOLF CLUB HEAD - A weight adjusting structure of a golf club head comprises a 360-degree rotatable rotary table installed in a body of a golf club head, wherein the rotary table is combined with an incomplete annular weight block at a peripheral portion on an arbitrary side thereof, so that the rotary table and the weight block form a rotary table assembly whose weight orientation can be adjusted. The weighted rotary table assembly installed in the body of the golf club head can be used to adjust a distribution of different weights around 360 degrees, whereby a preferred location of the club head's gravity center can be set according to a golfer's swing posture and a location of the club head's gravity center the golfer is used to. | 02-03-2011 |
Ming-Ching Liang, Anding Township Tainan County TW
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20100050409 | Method for making golf club head - A method for making a golf club head includes steps for processing upper and lower shells of the head. A metal- or non-metal-based composite material is provided which has a necessary thickness and whose area and total width are enough for making at least two unit shells, as determined by widths and surface curvatures of the upper and lower shells. A strip of excess material is reserved at a border between the unit shells. The two alternately or non-alternately arranged unit shells are integrally formed through a forming process, wherein an extension force generated while the unit shells are formed is constrained by the excess material to reduce deformation of the unit shells, so that the formed unit shells have flat cutting surfaces when the excess material is cut off, allowing the upper and lower shells thus made to have precise dimensions, improved ends of parts and close contact surfaces. | 03-04-2010 |
Ming-Ching Liang, Tainan City TW
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20130305801 | MANUFACTURING METHOD OF AN IRON-TYPE GOLF CLUB HEAD - A manufacturing method of an iron-type golf club head has acts of preparing a formed bar-shaped steel substrate, rough-hot forging the bar-shaped steel substrate, mid-hot forging the rough blank, fine-cold forging the mid-blank, cold stamping the striking surface and drilling a hosel of the iron-type golf club head. The cold forging reduces the thermal expansion and contraction of the blank, and the shape of the forged blank is more accurate therefore. As a result, the following grinding processes of the blank are reduced. Therefore, the weight of the blank is more accurate, and the manufacturing time and cost are also reduced. The blank does not have to be heated to high-temperature state prior to cold forging so that the blank can be cooled down faster, and the cost of the heating is reduced. | 11-21-2013 |
Ming-Ching Lin, Taichung TW
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20100020417 | OPTICAL LENS SYSTEM FOR TAKING IMAGE - An optical lens system for taking image comprises: a first lens element with positive refractive power, an Abbe Number of the first lens element being V | 01-28-2010 |
20100165483 | Optical Lens System for Taking Image - An optical lens system for taking image comprises, in order from the object side to the image side: a first lens element with positive refractive power having a convex object-side surface; an aperture stop; a second lens element with negative refractive power; a third lens element having a convex object-side surface; and a fourth lens element with negative refractive power having a concave object-side surface, an image-side surface of the fourth lens element being aspheric and formed with inflection points. A distance from the image-side surface of the fourth lens element to an image plane along an optical axis being BFL, a total track length of the optical lens system for taking image being TTL, and they satisfy the relation: BFL/TTL>0.12. In the optical lens system for taking image, the number of lens elements with refractive power being limited to four. | 07-01-2010 |
20100271713 | Optical Lens System for Taking Image - An optical lens system for taking image comprises, in order from the object side to the image side: a first lens element with positive refractive power having a convex object-side surface; an aperture stop; a second lens element with negative refractive power; a third lens element having a convex object-side surface; and a fourth lens element with negative refractive power having a concave object-side surface, an image-side surface of the fourth lens element being aspheric and formed with inflection points. A distance from the image-side surface of the fourth lens element to an image plane along an optical axis being BFL, a total track length of the optical lens system for taking image being TTL, and they satisfy the relation: BFL/TTL>0.12. In the optical lens system for taking image, the number of lens elements with refractive power being limited to four. | 10-28-2010 |
Ming-Ching Wu, Taipei County TW
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20100242602 | PROCESS FOR FABRICATING A CAPACITANCE TYPE TRI-AXIAL ACCELEROMETER - A process for fabricating a capacitance type tri-axial accelerometer comprises of preparing a wafer having an upper layer, an intermediate layer and a lower layer, etching the lower layer of the wafer to form an isolated proof mass having a core and four segments extending from the core, etching the upper layer of the wafer to form a suspension and four separating plates, etching away a portion of the intermediate layer located between the four segments of the proof mass and the plates of the upper layer, and disposing an electrical conducting means to pass through the intermediate layer from the suspension to the core of the proof mass. | 09-30-2010 |
20110140210 | MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME - A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device. | 06-16-2011 |
20110269296 | METHOD FOR SEPARATING SEMICONDUCTOR WAFER INTO CHIPS - A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage. | 11-03-2011 |
20120056280 | MEMS Sensor Package - A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip. | 03-08-2012 |
20120060605 | MEMS SENSOR CAPABLE OF SENSING ACCELERATION AND PRESSURE - A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element. | 03-15-2012 |
Ming-Ching Wu, New Taipei City TW
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20130213698 | HOLDER FOR SEMICONDUCTOR PACKAGE - A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package. | 08-22-2013 |
Ming-Ching Wu, Taoyuan County TW
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20150068306 | MOVABLE DEVICE HAVING DROP RESISTIVE PROTECTION - A movable device including a base, a mass, a plurality of elastic portions and at least one block structure is provided. The mass has a plurality of side surfaces. The elastic portions are connected to the side surfaces respectively and connected to the base, where the mass is adapted to move such that the elastic portions are elastically deformed. The block structure is disposed at the base and aligned to at least one of the side surfaces, wherein the block structure is adapted to block the corresponding side surface to limit a moving range of the mass. | 03-12-2015 |
20150068307 | RESONANCE DEVICE HAVING DROP RESISTIVE PROTECTION - A resonance device includes a base, a mass, a plurality of elastic portions and at least one end surface. The mass has at least one end surface. The elastic portions are connected between the mass and the base, in which the mass is adapted to resonate in a first direction such that the elastic portions are elastically deformed. The block portion is disposed at the base and extends towards the end surface to be aligned to the end surface, in which the gap between the base and the end surface in the first direction is greater than the gap between the block portion and the end surface in the first direction, and the block portion is adapted to block the end surface to limit the moving range of the mass. | 03-12-2015 |
Ming-Ching Wu, Chu-Pei City TW
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20150029606 | MICRO-ELECTROMECHANICAL SYSTEM (MEMS) CARRIER - A micro-electromechanical system (MEMS) carrier formed by a typical surface micro-machining and bulk micro-machining process on a silicon substrate, having a frame, a movable carrier element, a conductive coil, two return springs and a pair of permanent magnets. The movable carrier element is formed within the frame and movable along a path, the conductive coil is formed on or embedded in the movable carrier element. The two return springs are formed between the movable carrier element and the frame thereby connecting the movable carrier element to the frame and providing a return force to the carrier element, and the pair of permanent magnets are formed a magnetic field for co-acting with the conductive coil for generating an electromagnetic Lorenz force to drive the movable carrier element to move against the return force of the two return springs. | 01-29-2015 |
Ming-Ching Wu, Hsinchu TW
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20100212425 | 3-Axis Accelerometer With Gap-Closing Capacitive Electrodes - Disclosed is a novel three-axis capacitive-type accelerometer implemented on SOI wafer. The accelerometer consists of four springs, one proof mass, four pairs of gap-closing sensing electrodes (each pair of gap-closing sensing electrode containing one movable electrode and one stationary electrode), and several metal-vias as the electrical interconnections. The movable electrodes are on the proof mass, whereas the stationary electrodes are fixed to the substrate. The three-axis accelerometer has five merits. (1) The sensitivity of the accelerometer is improved since the proof-mass is increased by containing both device and handling silicon layers; (2) The sensitivity is also improved by the gap-closing differential capacitive sensing electrodes design; (3) The parasitic capacitance at bond pad is reduced by the existing of metal-vias between the device Si layer and handling Si layer; (4) The sensing gap thickness is precisely defined by the buried oxide of SOI wafer; (5) The stationary sensing electrodes anchored to the substrate also act as the limit stops to protect the accelerometer. | 08-26-2010 |