Patent application number | Description | Published |
20090213881 | Vertically Emitting, Optically Pumped Semiconductor Comprising an External Resonator and Frequency Doubling on a Separate Substrate - An optically pumped semiconductor apparatus having a surface-emitting semiconductor body ( | 08-27-2009 |
20090232177 | Method for Producing a Semiconductor Laser, and Semiconductor Laser - A method for producing a multiplicity of semiconductor lasers ( | 09-17-2009 |
20090246898 | Vertically Emitting, Optically Pumped Semiconductor Having and External Resonator on a Separate Substrate - A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly ( | 10-01-2009 |
20100000104 | TILT SENSOR - The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly. | 01-07-2010 |
20100230697 | OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF - An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate. | 09-16-2010 |
20110032962 | Semiconductor Laser Device - The invention relates to a semiconductor laser device comprising a laser bar ( | 02-10-2011 |
20110101390 | Monolithic, Optoelectronic Semiconductor Body and Method for the Production Thereof - An optoelectronic semiconductor body comprises a semiconductor layer sequence which is subdivided into at least two electrically isolated subsegments. The semiconductor layer sequence has an active layer in each subarea. Furthermore, at least three electrical contact pads are provided. A first line level makes contact with a first of the at least two subsegments and with the first contact pad. A second line level makes contact with the second of the at least two subsegments and with a second contact pad. A third line level connects the two subsegments to one another and makes contact with the third contact pad. Furthermore, the line levels are each arranged opposite a first main face, wherein the first main face is intended to emit electromagnetic radiation that is produced. | 05-05-2011 |
20110102914 | Lens, Laser Arrangement and Method for Producing a Laser Arrangement - An aspherical planoconvex lens ( | 05-05-2011 |
20110116752 | OPTOELECTRONIC MODULE AND OPTOELECTRONIC ARRANGEMENT - An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element. | 05-19-2011 |
20110186867 | Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement - An arrangement having at least two light-emitting semiconductor components ( | 08-04-2011 |
20130100691 | Optoelectronic Lighting Module and Automotive Headlamp - In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink. | 04-25-2013 |
20130135883 | Optoelectronic Lighting Module and Motor Vehicle Headlight - In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip. | 05-30-2013 |
20140231837 | LED Module - An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink. | 08-21-2014 |
20150070914 | Optoelectronic Lighting Device and Method for Producing an Optoelectronic Lighting Device - An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction. | 03-12-2015 |