Patent application number | Description | Published |
20080283090 | Process for treatment of substrates with water vapor or steam - A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors. In another aspect, a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors are dispensed onto a portion of the substrate surface that is less than the entire surface of the substrate in an amount effective to treat the portion of the substrate surface, and the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate may be enveloped with a water vapor and/or a optionally nitrogen gas environment during the treatment steps. | 11-20-2008 |
20100326477 | PROCESS FOR TREATMENT OF SUBSTRATES WITH WATER VAPOR OR STEAM - A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors. In another aspect, a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors are dispensed onto a portion of the substrate surface that is less than the entire surface of the substrate in an amount effective to treat the portion of the substrate surface, and the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate may be enveloped with a water vapor and/or an optionally nitrogen gas environment during the treatment steps. | 12-30-2010 |
20110180114 | LIQUID AEROSOL PARTICLE REMOVAL METHOD - Particles are removed from a surface of a substrate by a method comprising causing liquid aerosol droplets comprising water and a tensioactive compound to contact the surface with sufficient force to remove particles from the surface. | 07-28-2011 |
20110259376 | WET PROCESSING OF MICROELECTRONIC SUBSTRATES WITH CONTROLLED MIXING OF FLUIDS PROXIMAL TO SUBSTRATE SURFACES - The present invention provides methods and apparatuses for controlling the transition between first and second treatment fluids during processing of microelectronic devices using spray processor tools | 10-27-2011 |
20120145672 | PROCESS FOR SELECTIVELY REMOVING NITRIDE FROM SUBSTRATES - A method of selectively removing silicon nitride from a substrate comprises providing a substrate having silicon nitride on a surface thereof; and dispensing phosphoric acid and sulfuric acid onto the surface of the substrate as a mixed acid liquid stream at a temperature greater than about 150° C. In this method, water is added to a liquid solution of the mixed acid liquid stream as or after the liquid solution of the mixed acid liquid stream passes through a nozzle. | 06-14-2012 |
20130203262 | Process for Silicon Nitride Removal Selective to SiGex - A method for selectively removing silicon nitride is described. In particular, the method includes providing a substrate having a surface with silicon nitride exposed on at least one portion of the surface and SiGe | 08-08-2013 |
Patent application number | Description | Published |
20110304344 | Support Structure For Installation Of A Component Assembly Housed In A Rotating, Translating Carriage Chassis - A support structure for installation of a component assembly housed in a rotating, translating carriage chassis, the support structure including: a stationary rail that includes a shaft extruding perpendicular to the stationary rail; a rotating rail adapted to receive a carriage chassis rail, the rotating rail parallel to the stationary rail when the rotating rail is in a non-rotated position, the rotating rail including a shaft receptacle that receives the shaft, the rotating rail configured to rotate about the shaft and relative to the stationary rail; and a translation mechanism attached to the rotating rail, the translation mechanism enabling the carriage chassis rail to translate parallel to and along the rotating rail. | 12-15-2011 |
20130121134 | FAIL TO WIRE REMOVABLE MODULE FOR NETWORK COMMUNICATION LINK - A fail-to-wire (FTW) module that preserves a primary data path connection from an upstream computer to a downstream computer if there is any kind of failure in a breakout data path to a breakout system. The FTW module provides switches between the incoming data network data and the breakout system such that when the breakout system encounters a failure, the switches are de-activated to bypass the breakout system. The switches in the FTW module are activated by a system health signal from the breakout system. The breakout system can be serviced without interrupting the data network connections since the FTW module can be extracted from the failed breakout system with data network connections intact. The FTW module is preferably a compact modular element that fits within the breakout chassis and is easily inserted and removed from the breakout system during servicing operations. | 05-16-2013 |
20130121139 | FAIL TO WIRE REMOVABLE MODULE FOR NETWORK COMMUNICATION LINK - A fail-to-wire (FTW) module that preserves a primary data path connection from an upstream computer to a downstream computer if there is any kind of failure in a breakout data path to a breakout system. The FTW module provides switches between the incoming data network data and the breakout system such that when the breakout system encounters a failure, the switches are de-activated to bypass the breakout system. The switches in the FTW module are activated by a system health signal from the breakout system. The breakout system can be serviced without interrupting the data network connections since the FTW module can be extracted from the failed breakout system with data network connections intact. The FTW module is preferably a compact modular element that fits within the breakout chassis and is easily inserted and removed from the breakout system during servicing operations. | 05-16-2013 |