Patent application number | Description | Published |
20140084322 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to an exemplary embodiment of the present invention includes a base, a lighting element disposed on the base, the lighting element including an epitaxial layer and a substrate disposed on the epitaxial layer, a contact member disposed between the lighting element and the base, the contact member electrically connecting the lighting element and the base, and a lens disposed on the substrate. | 03-27-2014 |
20140284650 | LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity. | 09-25-2014 |
20140367718 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion. | 12-18-2014 |
20150295139 | LIGHT-EMITTING DIODE PACKAGE - The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside. | 10-15-2015 |
Patent application number | Description | Published |
20130089311 | SMALL-SIZED CAMERA MODULE FOR CORRECTING HAND-SHAKE - The purpose of the present invention provides a small-sized camera module for correcting hand-shake, in which a magnet for correcting the shaking is integrated with a magnet for adjusting the focus to implement a simple structure. According to the present invention, the small-sized camera module for correcting hand-shake comprises: a housing; a holder which is mounted on the housing to move in a horizontal direction; a lens unit which is mounted inside the holder to move vertically, and has a lens therein; a first coil member which is wound on the outer surface of the lens unit; a second coil member which is mounted on either the holder or housing, and has a hollow form; and a magnetic member which is mounted on the remaining holder or housing, wherein the magnetic member comprises; a magnet which is inserted and arranged on the second coil member, and has polarities separated in left and right direction; and a yoke which is disposed on a lateral portion of the magnet, and encloses the lateral portion of the magnet and the upper/lower portions of the second coil member. | 04-11-2013 |
20130141541 | COMPACT CAMERA ACTUATOR AND COMPACT STEREO-SCOPIC IMAGE PHOTOGRAPHING DEVICE - The purpose of the present invention is to provide a compact three-dimensional image photographing device capable of adjusting the first angle of view on an object being picked up on the image sensor by adjusting the space between two lenses by moving the two lenses horizontally, left and right. The compact three-dimensional image photographing device of the present invention comprises a case; a first holder and a second holder mounted spaced apart from each other on the left and right sides in the case so that the holders can move in the left and right directions, each of the holders having a compact camera actuator therein; a guide shaft, passing through the first and second holders and thus mounted on the case, for guiding the left and right movements of the first holder and the second holder; and left and right driving portions, mounted respectively on the first holder and the second holder, for moving the first holder and the second holder left and right. | 06-06-2013 |
20130222930 | DRIVING BODY AND DRIVING DEVICE FOR COMPACT CAMERA USING PIEZOELECTRIC ELEMENT - The present invention relates to a driving body and a driving device having a piezoelectric element mounted thereon, and more particularly, to a driving body and a driving device having a piezoelectric element mounted thereon for transferring a lens by actuating a lens holder in a vertical direction using the piezoelectric element. | 08-29-2013 |
20130229088 | HAPTIC MODULE USING PIEZOELECTRIC ELEMENT - Disclosed is a haptic module using a piezoelectric element. The haptic module comprises a base, a vibration member which is mounted on the upper portion of the base so as to be vertically movable, a piezoelectric element which couples to the vibration member, a power portion for applying power to the piezoelectric element, and a panel member which is mounted to the upper portion of the vibration member. According to the present invention, vertical movement of the vibration member effectively sends force to the panel member by means of the piezoelectric element to facilitate the vertical movement and enhance driving force, and thereby enhances the feeling of vibration or clicking of the panel member | 09-05-2013 |
20130285801 | PORTABLE TERMINAL HAVING HAPTIC MODULE - The present invention provides a portable terminal having a haptic module in which a piezoelectric element is mounted on a hinge part elastically supporting a touch pad, so that it is possible to more precisely operate a haptic feedback added to the touch pad and it is possible to locally control a haptic feedback exhibited on the touch pad. According to the present invention, the portable terminal having a haptic module comprises: a main body; a touch pad which is included in the main body to recognize a touch of a user; a vibration stage which is disposed between the main body and the touch pad and has a hinge part upwardly elastically supporting the touch pad; a piezoelectric element which is mounted on the hinge part, and when power is applied, wrap-deforms the hinge part to generate a vibration on the touch pad. | 10-31-2013 |
20140134918 | SMART TOY DRIVING SYSTEM FOR MOBILE TERMINAL - A smart toy driving system for a mobile terminal connected to the mobile terminal such that a reaction generated by an interaction between a certain character and a mobile terminal user upon the execution of an application installed in the mobile terminal is expressed in a motion of the character. The smart toy driving system includes a mobile terminal provided with an audio signal generating part which generates an audio signal having a predetermined pattern and then outputs it through a terminal part for outputting a sound; and a character which is detachably coupled to the terminal part of the mobile terminal so as to receive the audio signal, wherein the character comprises a signal converting part which converts the received audio signal into a driving signal preset according to a predetermined patterned waveform, and a mechanism part which takes a predetermined mechanical action according to the converted driving signal. | 05-15-2014 |
20140285419 | DISPLAY APPARATUS EQUIPPED WITH MOTION DETECTION SENSOR - Disclosed is a display apparatus which is driven by a motion detection sensor, and more particularly, to a display apparatus in which power, volume, channel or the like are controlled by a motion detection sensor. The display apparatus of the present invention includes a display part which displays an image; a support stand which supports the display part; a power source which supplies power to the display part; a motion detection sensor which is installed at an edge surface of the display part so as to detect an operation signal of an object in a contactless manner; and a main control part which controls the display part based on a detection signal from the motion detection sensor, wherein the motion detection sensor is installed so as to be oriented toward an outer surface of the display part, thereby detecting a motion signal at the outer surface of the display part. According to the present invention, since the frame part such as a bezel of the display part is not needed, the display screen can be expanded by a width of the bezel part. Further, since about 5 to 10% of the outer size of the display part corresponding to the width of the bezel part can be reduced, it is advantageous in the space usage. | 09-25-2014 |
Patent application number | Description | Published |
20140362071 | BACKLIGHT DRIVING APPARATUS - A backlight driving apparatus that drives a backlight unit having a plurality of LEDs is provided, which includes a rectifying unit rectifying an AC voltage and generating a driving voltage for the plurality of LEDs, a plurality of connection changing units changing connection relations between the plurality of LEDs depending on a level of the driving voltage, and a light output compensation unit generating a compensation voltage using the driving voltage and selectively supplying the compensation voltage to the plurality of LEDs. | 12-11-2014 |
20140375224 | ILLUMINATION APPARATUS INCLUDING SEMICONDUCTOR LIGHT EMITTING DIODES - An illumination apparatus capable of controlling current amounts of LEDs and enabling various electrical connections is provided. An applied driving voltage is divided, and a divided voltage is compared with a reference voltage to generate sampling signals. A logic operation is performed on the sampling signals to generate a switch control signal and a current control signal. The switch control signal controls electrical connection of LEDs to which the driving voltage is applied. Also, the current control signal may select LEDs that are to perform light emitting operations. A target voltage is set by processing the sampling signals and used to determine driving currents of the LEDs that are to perform the light emitting operations. | 12-25-2014 |
20150084541 | LED DIMMER, LED LIGHTING DEVICE COMPRISING SAME, AND METHOD FOR CONTROLLING DIMMING OF LED LIGHTING DEVICE - A light-emitting diode (LED) dimmer for an LED lighting device, including a power switch, a drive voltage supply, and a LED light-emitting unit. Operating zones of the LED lighting device are changed in accordance with the switching of the power switch, and a dimming level for a next operating zone is determined on the basis of the dimming level and time while the power switch was on during the previous operating period. | 03-26-2015 |
20150154917 | BACKLIGHT MODULE, METHOD FOR DRIVING SAME AND DISPLAY DEVICE USING SAME - A display device includes a power rectifying unit for rectifying alternating power, a power factor correction unit correcting the power factor of the alternating power and outputting a power factor corrected voltage containing a direct current voltage component having at least a predetermined size, a display module driven by the power factor corrected voltage, a backlight unit, and a driving unit supplying the main driving voltage to a backlight unit, receiving the power factor corrected voltage when the size of the rectified voltage is smaller than a preset threshold value to generate a supplementary driving voltage. | 06-04-2015 |
20150181659 | LED DRIVING DEVICE - Disclosed is an LED driving apparatus capable of removing a non-light-emitting section and extending device life span by adding an optical power compensation circuit to a driving circuit of a multi-stage current driving mode. The design is more efficient with respect to a forward voltage of an LED array driven by the multi-stage current driving circuit and the unique operational characteristics of the optical power compensation circuit. The LED driving apparatus drives a plurality of LED groups and includes a rectification unit for rectifying an AC voltage to generate a ripple voltage at an output, an optical power compensation unit to supply a pre-stored compensation voltage to the LED array when the ripple voltage is less than a minimum forward voltage in the plurality of LED groups, and a constant current driving unit connected the plurality of LED groups to sequentially drive each LED group with a constant current. | 06-25-2015 |
20150245427 | LED DRIVING APPARATUS AND DRIVING METHOD FOR CONTINUOUSLY DRIVING LED - Disclosed herein are a light emitting diode (LED) driving apparatus and driving method for continuously driving an LED. According to the present invention, an LED driving apparatus and driving method for continuously driving an LED capable of compensating for a light output of an LED lighting using an energy chargeable and dischargeable element and/or circuit are proposed. | 08-27-2015 |
20150288453 | OPTICAL COMMUNICATION DEVICE USING AC LED LIGHTING AND COMMUNICATION METHOD USING THE SAME - An optical communication device including a plurality of groups of light emitting diode (LED) groups that are turn on according to a control of a lighting and communication control module. The lighting and communication control module is configured to receive an AC input voltage, generate a rectified voltage from the AC input voltage, determine a voltage level of the rectified voltage, sequentially drive the plurality of LED groups according to the voltage level of the rectified voltage, and perform optical communication through the plurality of LED groups only when the voltage level of the rectified voltage is greater than or equal to a preset threshold voltage level. | 10-08-2015 |
20150296582 | LED LUMINESCENCE APPARATUS - An LED luminescence apparatus is provided, which includes a rectifying unit rectifying an AC voltage and generating a rectified voltage; a plurality of LEDs connected in series to an output terminal of the rectifying unit; a plurality of switches having drain terminals connected to cathodes of the plurality of LEDs, respectively; and a switch control unit sensing current through a plurality of resistors connected to source terminals of the plurality of switches, respectively, comparing the sensed current with a set reference current, and outputting a voltage corresponding to a difference between the sensed current and the set reference current to a gate terminal of each of the plurality of switches. | 10-15-2015 |
Patent application number | Description | Published |
20090208164 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board. | 08-20-2009 |
20090304324 | Optical waveguide and optical printed circuit board having the same - An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core. | 12-10-2009 |
20110007999 | Printed circuit board - A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide. | 01-13-2011 |
20110019959 | Printed circuit board for optical waveguides and method of manufacturing the same - The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides. | 01-27-2011 |
20110103737 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer. | 05-05-2011 |
20110103738 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a first through-hole formed therein and the first through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer has a second through-hole formed therein and the second through-hole corresponds to the first through-hole, and forming a second clad layer by filling a second clad substance in the second through-hole, in which the second clad layer covers the core unit. | 05-05-2011 |
20110116736 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer. | 05-19-2011 |
20110116737 | OPTICAL WIRING BOARD AND MANUFACTURING METHOD THEREOF - An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin. | 05-19-2011 |
20110168666 | MANUFACTURING METHOD FOR OPTICAL WAVEGUIDE - A method of manufacturing an optical waveguide is disclosed. The method in accordance with an embodiment of the present invention includes providing a carrier, fixing a base substrate to the carrier by using a first insulation layer such that the base substrate is directly stacked on the carrier, stacking an optical waveguide layer on at least one of the base substrate and the first insulation layer, and severing the base substrate such that the base substrate and the optical waveguide layer are separated from the carrier. Accordingly, the optical waveguide layer can be formed with a uniform thickness since wrinkles in the base substrate supporting the optical waveguide layer are prevented from forming during the manufacturing process. | 07-14-2011 |
20110317957 | Optical flexible printed circuit board with optical waveguides and method manufacturing the same - The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer. | 12-29-2011 |
20120005890 | Method of manufacturing printed circuit board for optical waveguides - A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed. | 01-12-2012 |
20130122430 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE - A method of manufacturing a printed circuit board for an optical waveguide includes forming an insulation layer having a through hole on a substrate; forming a lower clad layer on a bottom of the through hole; forming a core part on the lower clad layer; and forming an upper clad layer covering the core part on the lower clad layer and the core part. | 05-16-2013 |
Patent application number | Description | Published |
20090243457 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 10-01-2009 |
20100025700 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 02-04-2010 |
20100219428 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generate a base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light and the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 09-02-2010 |
20100330714 | MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME - There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member. | 12-30-2010 |
20110284822 | LIGHT EMITTING DIODE CHIP HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME - An exemplary embodiment of the present invention discloses an LED chip including a substrate, a GaN-based compound semiconductor stacked structure arranged on the substrate, an electrode electrically connected to the semiconductor stacked structure, and a wavelength converting layer covering a portion of the semiconductor stacked structure. The electrode passes through the wavelength converting layer. The semiconductor stacked structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. | 11-24-2011 |
20120007502 | WHITE LIGHT EMITTING DIODE PACKAGE FOR INCANDESCENT COLOR - The present invention relates to a white light emitting diode (LED) package that includes a blue LED chip to emit blue light; a yellow phosphor excited by the blue light and emit yellow light, the yellow light to produce a primary white light in combination with the blue light; a red LED chip to emit red light, the red light to adjust the primary white light into secondary white light of an incandescent color; and a package member comprising at least a partial transmissive part covering the blue LED chip, the red LED chip, and the yellow phosphor. The primary white light falls in a region of (0.413, 0.502), (0.335, 0.376), (0.37, 0.371), and (0.439, 0.48) based on a CIE color coordinate standard. | 01-12-2012 |
20120056217 | LIGHT EMITTING DIODE PACKAGE - Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 03-08-2012 |
20120193670 | LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME - A light emitting device having a wavelength converting layer. The light emitting device includes a substrate; a semiconductor stack having a first conductive-type semiconductor layer, an active layer and a second conductive-type semiconductor layer disposed on the substrate; a first wavelength converting layer covering a top of the semiconductor stack; and a second wavelength converting layer disposed on the first wavelength converting layer and having a width narrower than the first wavelength converting layer. The second wavelength converting layer is employed, thereby being capable of reducing a color variation according to a viewing angle. | 08-02-2012 |
20120273813 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - The present disclosure provides an LED package and a method for fabricating the same. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall disposed on the base and extending around the LED chip, and a fluorescent material disposed inside of the transparent wall and covering upper and side surfaces of the LED chip. | 11-01-2012 |
20130313585 | LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER - Disclosed is a light emitting device having a wavelength converting layer. The light emitting device comprises a plurality of semiconductor stacked structures; connectors for electrically connecting the plurality of semiconductor stacked structures to one another; a single wavelength converting layer for covering the plurality of semiconductor stacked structures; an electrode electrically connected to at least one of the semiconductor stacked structures; and at least one additional electrode positioned on the electrode, passing through the wavelength converting layer to be exposed to the outside, and forming a current input terminal to the light emitting device or a current output terminal from the light emitting device. Since the single wavelength converting layer covers the plurality of semiconductor stacked structures, the plurality of semiconductor stacked structures can be integrally mounted on a chip mounting member such as a package or a module. | 11-28-2013 |
20140151633 | LIGHT EMITTING DIODE CHIP HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME - An exemplary embodiment of the present invention discloses a light-emitting diode (LED) chip including a semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a first electrode disposed on the semiconductor stacked structure, a wavelength converting layer disposed on the semiconductor stacked structure, and a transparent resin disposed on the wavelength converting layer. | 06-05-2014 |
20140312366 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - An LED package allows a fluorescent material to be uniformly distributed around an LED chip on a base when a filling space inside a transparent wall surrounding the LED chip is filled with the fluorescent material. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall formed on the base and having a filling space around the LED chip, and a fluorescent material, with which the filling space is filled to cover the LED chip. | 10-23-2014 |
20140312380 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 10-23-2014 |
20150016110 | LIGHTING DEVICE - Disclosed is a lighting device having wide light-distribution characteristics. The lighting device includes a base; a protrusion disposed on the base; and a light emitting module disposed on the protrusion; wherein the light emitting module comprises a plurality of light emitting diodes inclined inward with respect to the a protruding direction of the protrusion. Accordingly, the lighting device can provide wide light-distribution characteristics. | 01-15-2015 |
20150049486 | LED ILLUMINATION MODULE - Provided is a light emitting diode (LED) illumination module. The LED illumination module includes a fluorescent substance plate mounted to be capable of being attached to and detached from an opening formed in a top surface of a heat sink. Also, the LED illumination module includes a lens that covers the opening of the heat sink and is mounted to be capable of being attached to and detached from the heat sink. | 02-19-2015 |
20150124479 | LIGHT SOURCE MODULE AND BACKLIGHT UNIT HAVING THE SAME - A light source including a circuit board, at least one light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), and a reflective portion formed on the circuit board and enclosing the light emitting device. The reflective portion formed on the circuit board reflects light emitted from the light emitting device in one direction, to reduce light loss while focusing light in a desired direction. | 05-07-2015 |
20150214453 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes. | 07-30-2015 |
Patent application number | Description | Published |
20130248818 | METHOD OF FABRICATING NONPOLAR GALLIUM NITRIDE-BASED SEMICONDUCTOR LAYER, NONPOLAR SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME - A method of fabricating a nonpolar gallium nitride-based semiconductor layer is provided. The method is a method of fabricating a nonpolar gallium nitride layer using metal organic chemical vapor deposition, and includes disposing a gallium nitride substrate with an m-plane growth surface within a chamber, raising a substrate temperature to a GaN growth temperature by heating the substrate, and growing a gallium nitride layer on the gallium nitride substrate by supplying a Ga source gas, an N source gas, and an ambient gas into the chamber at the growth temperature. The supplied ambient gas contains N | 09-26-2013 |
20140151713 | METHOD OF GROWING NITRIDE SEMICONDUCTOR LAYER, NITRIDE SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME - Exemplary embodiments of the present invention provide a method of growing a nitride semiconductor layer including growing a gallium nitride-based defect dispersion suppressing layer on a gallium nitride substrate including non-defect regions and a defect region disposed between the non-defect regions, and growing a gallium nitride semiconductor layer on the defect dispersion suppressing layer. | 06-05-2014 |
20140162437 | METHOD OF GROWING GALLIUM NITRIDE BASED SEMICONDUCTOR LAYERS AND METHOD OF FABRICATING LIGHT EMITTING DEVICE THEREWITH - Exemplary embodiments of the present invention relate to a method of growing gallium nitride-based semiconductor layers through metal-organic chemical vapor deposition, including disposing a substrate in a chamber, growing a first conductivity-type gallium nitride-based semiconductor layer on the substrate at a first chamber pressure, growing a gallium nitride-based active layer on the first conductivity-type gallium nitride-based semiconductor layer at a second chamber pressure higher than the first chamber pressure, and growing a second conductivity-type gallium nitride-based semiconductor layer on the active layer at a third chamber pressure lower than the second chamber pressure. | 06-12-2014 |
20140361247 | GALLIUM NITRIDE-BASED LIGHT EMITTING DIODE - Disclosed herein is a light emitting diode (LED) including: a gallium nitride substrate; a gallium nitride-based first contact layer disposed on the gallium nitride substrate; a gallium nitride-based second contact layer; an active layer having a multi-quantum well structure and disposed between the first and second contact layers; and a super-lattice layer having a multilayer structure and disposed between the first contact layer and the active layer. By employing the gallium nitride substrate, the crystallinity of the semiconductor layers can be improved, and in addition, by disposing the super-lattice layer between the first contact layer and the active layer, a crystal defect that may be generated in the active layer can be prevented. | 12-11-2014 |
20150091047 | METHOD OF GROWING NITRIDE SEMICONDUCTOR, METHOD OF MANUFACTURING TEMPLATE FOR SEMICONDUCTOR FABRICATION AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - Disclosed are a method of growing a nitride semiconductor, a method of manufacturing a template for semiconductor fabrication and a method of manufacturing a semiconductor light emitting device using the same. The method of manufacturing a semiconductor light emitting device includes: preparing a growth substrate having a defect aggregation region; growing a first nitride semiconductor layer over the growth substrate; growing a second nitride semiconductor layer over the first nitride semiconductor layer; growing a third nitride semiconductor layer over the second nitride semiconductor layer; growing an active layer over the third nitride semiconductor layer; and forming a second conductive type semiconductor layer over the active layer. Accordingly, semiconductor layers grown on the template can have excellent crystallinity. | 04-02-2015 |
20150115223 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device includes: a first conductive type semiconductor layer including a first lower conductive type semiconductor layer and a first upper conductive type semiconductor layer; a V-pit passing through at least one portion of the first upper conductive type semiconductor layer; a second conductive type semiconductor layer placed over the first conductive type semiconductor and filling the V-pit; and an active layer interposed between the first and second conductive type semiconductor layers with the V-pit passing through the active layer. The first upper conductive type semiconductor layer has a higher defect density than the first lower conductive type semiconductor layer and includes a V-pit generation layer comprising a starting point of the V-pit. The semiconductor device includes the V-pits having a large size and a high density to efficiently preventing damage to the semiconductor device due to electrostatic discharge. | 04-30-2015 |
20150270435 | METHOD OF FABRICATING NONPOLAR GALLIUM NITRIDE-BASED SEMICONDUCTOR LAYER, NONPOLAR SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME - A method of fabricating a nonpolar gallium nitride-based semiconductor layer is provided. The method is a method of fabricating a nonpolar gallium nitride layer using metal organic chemical vapor deposition, and includes disposing a gallium nitride substrate with an m-plane growth surface within a chamber, raising a substrate temperature to a GaN growth temperature by heating the substrate, and growing a gallium nitride layer on the gallium nitride substrate by supplying a Ga source gas, an N source gas, and an ambient gas into the chamber at the growth temperature. The supplied ambient gas contains N | 09-24-2015 |
Patent application number | Description | Published |
20120193670 | LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER AND METHOD OF FABRICATING THE SAME - A light emitting device having a wavelength converting layer. The light emitting device includes a substrate; a semiconductor stack having a first conductive-type semiconductor layer, an active layer and a second conductive-type semiconductor layer disposed on the substrate; a first wavelength converting layer covering a top of the semiconductor stack; and a second wavelength converting layer disposed on the first wavelength converting layer and having a width narrower than the first wavelength converting layer. The second wavelength converting layer is employed, thereby being capable of reducing a color variation according to a viewing angle. | 08-02-2012 |
20130313585 | LIGHT EMITTING DEVICE HAVING WAVELENGTH CONVERTING LAYER - Disclosed is a light emitting device having a wavelength converting layer. The light emitting device comprises a plurality of semiconductor stacked structures; connectors for electrically connecting the plurality of semiconductor stacked structures to one another; a single wavelength converting layer for covering the plurality of semiconductor stacked structures; an electrode electrically connected to at least one of the semiconductor stacked structures; and at least one additional electrode positioned on the electrode, passing through the wavelength converting layer to be exposed to the outside, and forming a current input terminal to the light emitting device or a current output terminal from the light emitting device. Since the single wavelength converting layer covers the plurality of semiconductor stacked structures, the plurality of semiconductor stacked structures can be integrally mounted on a chip mounting member such as a package or a module. | 11-28-2013 |
20140362603 | LIGHT SOURCE MODULE AND BACKLIGHT UNIT HAVING THE SAME - Disclosed is a light source module capable of realizing a slim structure and providing excellent luminous efficiency. The light source module includes a circuit board, a light emitting diode chip mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a wavelength conversion layer disposed on the light emitting diode chip, and a reflector covering an upper surface and at least one of side surfaces of the light emitting diode chip. | 12-11-2014 |
20150049486 | LED ILLUMINATION MODULE - Provided is a light emitting diode (LED) illumination module. The LED illumination module includes a fluorescent substance plate mounted to be capable of being attached to and detached from an opening formed in a top surface of a heat sink. Also, the LED illumination module includes a lens that covers the opening of the heat sink and is mounted to be capable of being attached to and detached from the heat sink. | 02-19-2015 |
20150085527 | LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND BACKLIGHT UNIT INCLUDING THE SAME - A light source module, a fabrication method therefore, and a slim backlight unit including the same. The light source module includes a light emitting diode (LED) chip electrically connected to a substrate through a lower surface thereof, a wavelength conversion layer formed on the LED chip and enclosing at least the light exit face of the LED chip, and a reflector formed on a region of the LED chip excluding the light exit face. | 03-26-2015 |
20150124479 | LIGHT SOURCE MODULE AND BACKLIGHT UNIT HAVING THE SAME - A light source including a circuit board, at least one light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), and a reflective portion formed on the circuit board and enclosing the light emitting device. The reflective portion formed on the circuit board reflects light emitted from the light emitting device in one direction, to reduce light loss while focusing light in a desired direction. | 05-07-2015 |