Patent application number | Description | Published |
20090183476 | GAS PURIFYING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS - A gas purifying apparatus for removing particles from a gas. The gas purifying apparatus includes a first filter layer and a second filter layer, and the diameter of a fiber forming the first filter layer is larger than that of a fiber forming the second filter layer. A semiconductor manufacturing apparatus can use such a gas purifying apparatus. | 07-23-2009 |
20100111648 | SUBSTRATE PROCESSING APPARATUS AND PARTICLE ADHESION PREVENTING METHOD - Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber. | 05-06-2010 |
20110090612 | ATMOSPHERE CLEANING DEVICE - Provided is an atmosphere cleaning device comprising a means for establishing a down-flow in the atmosphere, in which a treating object is positioned, a plurality of ionizers arranged at positions above the treating object and symmetrically in the layout, as viewed downward, across the treating object, for feeding either cation or anion transversely of the down-flow, and a means for applying such a DC voltage to the treating object as has the same polarity as that of the voltage being applied to those ionizers. The atmosphere cleaning device is characterized in that the symmetrically arranged ionizers are arranged to face each other. | 04-21-2011 |
20110155177 | METHOD AND DEVICE FOR CLEANING A SUBSTRATE AND STORAGE MEDIUM - In a cleaning method, a substrate having a pattern formed on the surface thereof can be cleaned by using a cleaning fluid, while preventing the pattern protrusions from being flattened when the cleaning fluid is removed or dried. The cleaning method includes the steps of: loading a substrate onto a loading platform inside a processing chamber; heating the substrate; and supplying a cleaning fluid onto the surface of the substrate. The substrate is heated in the substrate heating step so that the Leidenfrost phenomenon occurs and steam of the cleaning fluid is interposed between the substrate and droplets of the cleaning fluid supplied to the substrate in the cleaning fluid supply step. | 06-30-2011 |
20120031339 | DEPOSITION HEAD AND FILM FORMING APPARATUS - There is provided a deposition head capable of discharging a material gas having a uniform flow rate and equi-thermal property from each component in a large-sized substrate as well as a conventional small-sized one for forming a uniform thin film. A deposition apparatus including the deposition head is also provided. The deposition head is provided within a deposition apparatus for forming a thin film on a substrate and configured to discharge a material gas toward the substrate. The deposition head includes an outer casing, and an inner casing provided within the outer casing and into which the material gas is introduced. In the inner casing, an opening configured to discharge the material gas toward the substrate is formed, and a heater configured to heat the material gas is provided at an outer surface of the outer casing or in a space between the outer casing and the inner casing. | 02-09-2012 |
20120094014 | VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD - There is provided a vapor deposition apparatus and a vapor deposition method capable of efficiently sublimating/melting a granular organic material with high mobility. The vapor deposition apparatus for forming a thin film on a substrate by vapor deposition includes a depressurizable material supply apparatus configured to supply a material gas, and a film forming apparatus configured to form a thin film on the substrate. The material supply apparatus includes a quantity control unit configured to control a quantity of a material, and a material gas generating unit configured to vaporize the material supplied from the quantity control unit. | 04-19-2012 |
Patent application number | Description | Published |
20090206253 | SUBSTRATE INSPECTION METHOD, SUBSTRATE INSPECTION APPARATUS AND STORAGE MEDIUM - In a substrate inspection method, it is inspected whether the metal electrode is electrically connected to the conductive film by radiating electron beams onto a surface of the substrate to detect the number of secondary electrons emitted therefrom. The method includes placing the substrate onto a mounting table; inspecting the metal electrode by radiating electron beams onto an area of the substrate including the metal electrode at a first acceleration voltage and detecting secondary electrons emitted from the metal electrode; and radiating electron beams onto an area of the substrate not including the metal electrode at a second acceleration voltage. The second acceleration voltage is set such that a difference between the number of electrons entering the insulation film and the number of secondary electrons emitted from the insulation film is smaller at the second acceleration voltage than at the first acceleration voltage. | 08-20-2009 |
20120255193 | SUBSTRATE DRYING APPARATUS AND METHOD - A substrate drying apparatus which dries a substrate cleaned by a diamagnetic liquid includes a magnet unit for moving the liquid adhering to the substrate by means of a magnetic force; and a magnet transfer mechanism for moving the magnet unit along the substrate toward an edge of the substrate. A substrate drying method of drying a substrate cleaned by a diamagnetic liquid includes bringing a magnet unit close to the substrate, the magnet unit being configured to move the liquid adhering to the substrate by means of a magnetic force; and moving the magnet unit along the substrate toward the edge of the substrate. | 10-11-2012 |
20130134041 | DROPLET MOVING DEVICE, DROPLET MOVING METHOD, PLASMA SEPARATION DEVICE, AND PLASMA SEPARATION METHOD - A droplet can be moved along a surface of a moving surface forming member in a simple method. At both sides of the moving surface forming member | 05-30-2013 |
20130244226 | VIRUS DETECTION DEVICE AND VIRUS DETECTION METHOD - A virus detection device includes a diffusion unit configured to diffuse a virus in a gas as an inspection target into an aqueous solution containing a fluorescent antibody specifically adsorptive to the virus by bringing the gas into contact with the aqueous solution and configured to adsorb the fluorescent antibody to the virus in the gas; an atomization unit configured to atomize the aqueous solution and generate a mist group of the aqueous solution in which the gas is diffused; a fluorescence measuring unit configured to measure a fluorescence intensity of the mist group; and an air current generator configured to form an air current flowing toward the fluorescence measuring unit from the atomization unit. | 09-19-2013 |
Patent application number | Description | Published |
20080239283 | Particle measuring method and particle measuring apparatus - The present invention relates to a particle measuring method for irradiating light to a surface of a substrate to scatter the light so as to measure a condition of particles on the substrate based on the scattered light. The particle measuring method according to the present invention comprises the steps of: heating a certain liquid to obtain a steam; supplying the steam onto a substrate so that a content of the steam is absorbed by each particle, while a temperature of the substrate is maintained in such a manner that the steam does not condense on the substrate; cooling the substrate before the particle dries so that the content absorbed by the particle is solidified, while preventing generation of solidified substance on regions of the surface of the substrate to which no particle adheres; and irradiating light to the substrate to scatter the light and detecting the scattered light, under a condition in which the content absorbed by the particle has been solidified. | 10-02-2008 |
20090176374 | PATTERN FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND STORAGE MEDIUM - A pattern forming method includes (a) forming pairs of deposits on sidewalls of mask portions in first mask patterns by forming a thin film thereon, etching it to leave deposits, and exposing a top surface of a second-layer film between the deposits; (b) forming second mask patterns formed of mask portions corresponding to the deposits by removing the mask portion, plasma etching the second-layer film, and removing the deposits; (c) forming a thin film thereon, and etching it to leave deposits on sidewalls of mask portions facing each other and to expose a third-layer film between the deposits while leaving deposits between adjacent mask portions; and (d) forming grooves thereon by removing the second mask portion, and etching off the third-layer film. | 07-09-2009 |
20090194233 | Component for semicondutor processing apparatus and manufacturing method thereof - A component ( | 08-06-2009 |
20110244693 | COMPONENT FOR SEMICONDUCTOR PROCESSING APPARATUS AND MANUFACTURING METHOD THEREOF - A component for a semiconductor processing apparatus includes a matrix defining a shape of the component, and a protection film covering a predetermined surface of the matrix. The protection film consists essentially of an amorphous oxide of a first element selected from the group consisting of aluminum, silicon, hafnium, zirconium, and yttrium. The protection film has a porosity of less than 1% and a thickness of 1 nm to 10 μm. | 10-06-2011 |
20150114562 | SUBSTRATE PROCESSING APPARATUS - Any particle adhesion onto the surface of a substrate to be processed is prevented. There is provided a substrate processing apparatus characterized by including a transfer chamber for, via a gate to which a substrate accommodating container for accommodation of the substrate is set, performing transfer of the substrate between the same and the substrate accommodating container, a processing chamber for applying a specific process to the substrate, a load-lock chamber for linking the processing chamber with the transfer chamber, and a temperature control unit for at the stage of transferring the substrate into at least one of the transfer chamber and the load-lock chamber, so as for the temperature of the substrate just before the transfer thereof to be higher than the temperature of the interior of the chamber, into which the substrate will be transferred, controlling at least one of the temperature of the substrate and the temperature of the interior of the chamber. | 04-30-2015 |