Patent application number | Description | Published |
20080224304 | Physical quantity sensor and semiconductor device having package and cover - A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package. | 09-18-2008 |
20080236307 | Sensor apparatus - A sensor apparatus includes a sensor body made of resin, an electronic circuit housed in the sensor body and constructed with electronic devices configured to detect a physical quantity and output a sensor signal indicative of the detected physical quantity, connector terminals for electrically connecting the electronic circuit to an external apparatus. The terminals are supported by the sensor body and have first end portions located outside the sensor body and second end portions located inside the sensor body. The electronic devices are physically and electrically connected directly to the second end portions of the terminals. The electronic devices and the second end portions of the terminals are integrally molded in the sensor body. | 10-02-2008 |
20080264683 | Metal wiring plate - A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist. | 10-30-2008 |
20080287008 | Electronic device having molded resin case, and molding tool and method of manufacturing the same - An electronic device includes an electronic circuit section, a case, and a connector housing. The electronic circuit section includes a connector terminal. The case seals the electronic circuit section in such a manner that the connector terminal protrudes to an outside of the case. The connector housing is integrated with the case and has an approximately cylindrical shape to surround an outer circumference of the connector terminal. The case and the connector housing are made of resin with a molding tool by filling resin into a case cavity and a connector-housing cavity of the molding tool in a state where the electronic circuit section is held by a holding portion of the molding tool. | 11-20-2008 |
20080296796 | Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case - In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time. | 12-04-2008 |
20080314121 | Apparatus and method for detecting resin leak - A resin leak detector includes a pressure sensor element and a leak determination unit. The pressure sensor element detects a pressure in a case cavity. That is, when resin leaks into a space between an upper circuit case and a lower circuit case, the pressure in the case cavity decreases temporarily. The decrease of the pressure in the case cavity is detected by the pressure sensor element based on comparison between a detected pressure and a predetermined lower limit. The resin leak into the upper and lower circuit case is detected without cutting an outer case of an electronic device such as an acceleration sensor or the like. | 12-25-2008 |
20090038399 | Pressure sensor - A pressure sensor is provided. The pressure sensor includes a body, a sensing element, and a projection part. The body has an internal space and an introduction passage. The internal space is in communication with an outside of the body through the introduction passage. The sensing element is disposed in the internal space of the body and capable of detecting pressure of air in the internal space. The projection part is disposed in the internal space of the body or the introduction passage of the body, and inhibits liquid from entering the internal space. | 02-12-2009 |
20100223995 | Sensor apparatus and sensor apparatus attachment structure - A sensor apparatus is disclosed, which includes: a terminal; an electronic component that is connected with a first end part of the terminal; an insulating resin that seals the electronic component and the terminal, with a second end part of the terminal being exposed from the insulating resin; a case resin that is mixed with a conductive filler, and seals the insulating resin so that a first portion of the second end part is exposed from the case resin and a second portion of the second end part is covered by the case resin; and a coating material that is formed on the second portion of the second end part to electrically insulate the terminal from the case resin. | 09-09-2010 |