Patent application number | Description | Published |
20080224153 | ELECTRONIC DEVICE, METHOD OF PRODUCING THE SAME, LIGHT-EMITTING DIODE DISPLAY UNIT, AND METHOD OF PRODUCING THE SAME - An electronic device includes a base having a first wiring thereon; a flexible film having a second wiring thereon; a plurality of elements each including a first connecting portion and a second connecting portion; and an adhesive agent layer, wherein each of the elements is sandwiched between the base and the film in a state in which the first connecting portion is in contact with the first wiring, the second connecting portion is in contact with the second wiring, and a tensile force is applied to the film, and, in this state, the base and the film are bonded with the adhesive agent layer. | 09-18-2008 |
20090014748 | METHOD OF ELECTRICALLY CONNECTING ELEMENT TO WIRING, METHOD OF PRODUCING LIGHT-EMITTING ELEMENT ASSEMBLY, AND LIGHT-EMITTING ELEMENT ASSEMBLY - A method of electrically connecting an element to wiring includes the steps of forming a conductive fixing member precursor layer at least on wiring provided on a base, and arranging an element having a connecting portion on the wiring such that the connecting portion contacts the conductive fixing member precursor layer, and then heating the conductive fixing member precursor layer to form a conductive fixing member latter, thereby fixing the connecting portion of the element to the wiring, with the conductive fixing member layer therebetween, wherein the conductive fixing member precursor layer is composed of a solution-tape conductive material. | 01-15-2009 |
20090290337 | MOUNTING METHOD, MOUNTED STRUCTURE, MANUFACTUREING METHOD FOR ELECTRONIC EQUIPMENT, ELECTRONIC EQUIPMENT, MANUFACTURING METHOD FOR LIGHT-EMITTING DIODE DISPLAY, AND LIGHT-EMITTING DIODE DISPLAY - Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer | 11-26-2009 |
20100123163 | SUBSTRATE WITH CHIPS MOUNTED THEREON, METHOD OF MANUFACTURING SUBSTRATE WITH CHIPS MOUNTED THEREON, DISPLAY, AND METHOD OF MANUFACTURING DISPLAY - Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern. | 05-20-2010 |
20100148202 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor light-emitting device includes (A) a light-emitting portion obtained by laminating in sequence a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; (B) a first electrode electrically connected to the first compound semiconductor layer; (C) a transparent conductive material layer formed on the second compound semiconductor layer; (D) an insulating layer composed of a transparent insulating material and having an opening, the insulating layer being formed on the transparent conductive material layer; and (E) a second electrode that reflects light from the light-emitting portion, the second electrode being formed on the transparent conductive material layer and on the insulating layer in a continuous manner, wherein, assuming that areas of the active layer, the transparent conductive material layer, the insulating layer, and the second electrode are respectively S | 06-17-2010 |
20100186883 | METHOD OF TRANSFERRING A DEVICE AND METHOD OF MANUFACTURING A DISPLAY APPARATUS - A method of transferring a device includes: arranging a release layer and a device in the stated lamination order on a first substrate having light transmitting property via a bonding layer having light transmitting property; arranging an adhesive layer formed on a second substrate so that the adhesive layer is opposed to a surface of the first substrate on which the device is arranged; and ablating the release layer by performing light irradiation on the release layer from the first substrate side and transferring the device onto the second substrate with the bonding layer being left on the first substrate. | 07-29-2010 |
20100258543 | METHOD OF TRANSFERRING DEVICE - A method of transferring a device includes the steps of: arranging a first substrate, on which a device is provided with a release layer having a planar shape equal to or smaller than the device interposed therebetween, and a second substrate, on which an adhesive layer is provided, so as to be spaced from and opposite each other in a state where the device and the adhesive layer face each other; and irradiating a laser beam having an irradiation area larger than the base area of the release layer onto the entire surface of the release layer from the first substrate side so as to ablate the release layer, to separate the device from the first substrate, and to transfer the device on the second substrate. | 10-14-2010 |
20100259164 | MANUFACTURING METHOD OF DISPLAY DEVICE AND DISPLAY DEVICE - A manufacturing method of a display device, includes: a first step of collectively transferring light-emitting elements arranged at every specified number of light-emitting elements formed and arranged on a first substrate to a transfer area set on a second substrate; and a second step of transferring light-emitting elements remaining on the first substrate to between the plural light-emitting elements mounted on the second substrate in at least one of a state where the first substrate is moved with respect to the transfer area on the second substrate and a state where the first substrate is rotated in a plane. | 10-14-2010 |
20110266039 | METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRATE STRUCTURE THEREOF - An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer. | 11-03-2011 |
20120169786 | LIGHT EMITTING DEVICE, ILLUMINATING DEVICE, AND DISPLAY DEVICE - A light emitting device includes: one or plural light emitting elements having plural electrodes; a chip-like insulator surrounding the one or plural light emitting elements from a side surface side of the one or plural light emitting elements; and plural terminal electrodes electrically connected one-to-one with the plural electrodes, and having protrusions each protruding from a peripheral edge of the chip-like insulator. | 07-05-2012 |
20120218318 | LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS - Disclosed herein is a light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded. | 08-30-2012 |
20120223345 | LIGHT EMITTING UNIT AND DISPLAY DEVICE - A light emitting unit including plural kinds of light emitting elements with different light emitting wavelengths, wherein, among the light emitting elements, at least one kind of light emitting element includes a semiconductor layer configured by laminating a first conductive layer, an active layer and a second conductive layer and having a side surface exposed by the first conductive layer, the active layer and the second conductive layer; a first electrode electrically connected to the first conductive layer; a second electrode electrically connected to the second conductive layer; a first insulation layer contacting at least an exposed surface of the active layer in the surface of the semiconductor layer; and a metal layer contacting at least a surface, which is opposite to the exposed surface of the active layer, in the surface of the first insulation layer, and electrically separated from the first electrode and the second electrode. | 09-06-2012 |
20120295378 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method of making a semiconductor light-emitting device including (A) a light-emitting portion by laminating in sequence a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; (B) a first electrode electrically connected to the first compound semiconductor layer; (C) a transparent conductive material layer on the second compound semiconductor layer; (D) an insulating layer on a transparent conductive material layer; and (E) a second reflective electrode that on the transparent conductive material layer and on the insulating layer in a continuous manner, wherein, that the areas of the active layer, the transparent conductive material layer, the insulating layer, and the second electrode S | 11-22-2012 |
20140291709 | DISPLAY DEVICE - A display device includes a first substrate, a second substrate, and a plurality of light emitting sections. The first substrate includes a first surface and a second surface which faces the first surface. The second substrate is arranged to face the first substrate, and is configured with a first surface which faces the second surface of the first substrate, and a second surface which faces the first surface. The plurality of light emitting sections is provided on the second surface of the first substrate while being separated from the second substrate. A light transmission suppression layer on which a light transmission section to transmit light from light emitting sections is provided is formed on the second surface of the second substrate in correspondence to each light emitting section. An anti-reflection layer is formed in the light transmission section. | 10-02-2014 |