Patent application number | Description | Published |
20090128168 | MULTIFUNCTIONAL CONDUCTING POLYMER STRUCTURES - The present invention includes the use of conducting polymers as sensors in distributed sensing systems, as sensors and operating elements in multifunctional devices, and for conducting-polymer based multifunctional sensing fabrics suitable for monitoring humidity, breath, heart rate, blood (location of wounds), blood pressure, skin temperature, weight and movement, in a wearable, electronic embedded sensor system, as examples. A fabric comprising conducting polyaniline fibers that can be used to distribute energy for resistive heating as well as for sensing the fabric temperature is described as an example of a multifunctional sensing fabric. | 05-21-2009 |
20100072428 | SPINNING, DOPING, DEDOPING AND REDOPING POLYANILINE FIBER - A composition of matter suitable for spinning polyaniline fiber, a method for spinning electrically conductive polyaniline fiber, a method for exchanging dopants in polyaniline fibers, and methods for dedoping and redoping polyaniline fibers are described. | 03-25-2010 |
20100170886 | MULTIFUNCTIONAL CONDUCTING POLYMER STRUCTURES - The present invention includes the use of conducting polymers as sensors in distributed sensing systems, as sensors and operating elements in multifunctional devices, and for conducting-polymer based multifunctional sensing fabrics suitable for monitoring humidity, breath, heart rate, blood (location of wounds), blood pressure, skin temperature, weight and movement, in a wearable, electronic embedded sensor system, as examples. A fabric comprising conducting polyaniline fibers that can be used to distribute energy for resistive heating as well as for sensing the fabric temperature is described as an example of a multifunctional sensing fabric. | 07-08-2010 |
20110266503 | SPINNING, DOPING, DEDOPING AND REDOPING POLYANILINE FIBER - A composition of matter suitable for spinning polyaniline fiber, a method for spinning electrically conductive polyaniline fiber, a method for exchanging dopants in polyaniline fibers, and methods for dedoping and redoping polyaniline fibers are described. | 11-03-2011 |
Patent application number | Description | Published |
20100155204 | MULTI-STABLE MICRO ELECTROMECHANICAL SWITCHES AND METHODS OF FABRICATING SAME - A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a receiving terminal is formed on a substrate. The moveable member and the receiving terminal each include an insulating layer proximate to the substrate and a conducting layer proximate to the insulating layer opposite the substrate. In various embodiments, the conducting layers of the moveable member and/or receiving terminal include a protruding region that extends outward from the substrate to switchably couple the conducting layers of the moveable member and the receiving terminal to thereby form a switch. The switch may be actuated using, for example, electrostatic energy. | 06-24-2010 |
20100314149 | HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS - Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions. | 12-16-2010 |
20100314726 | FARADAY CAGE FOR CIRCUITRY USING SUBSTRATES - An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. | 12-16-2010 |
20100314733 | APPARATUS FOR RESTRICTING MOISTURE INGRESS - Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier. | 12-16-2010 |
20100324614 | MEDICAL DEVICE ENCAPSULATED WITHIN BONDED DIES - An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material. | 12-23-2010 |
20110034825 | Medical Assembly Suitable for Long-Term Implantation and Method for Fabricating the Same - A process for fabricating a medical assembly having a medical device at least a portion of which is formed of inorganic material is provided. The medical assembly is suitable for substantially long-term implantation in a host animal. The process includes modifying a surface of the medical device to form a hydrophilic adhesion-promoting surface. The hydrophilic adhesion-promoting surface is coated with an alginate solution comprising alginate and the alginate is reacted with alkaline earth metal cations. | 02-10-2011 |
20110270099 | HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION - An implantable medical device (IMD) is disclosed. The IMD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device. | 11-03-2011 |
20110270341 | HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION - An implantable medical device (IMD) is disclosed. The IMD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device. | 11-03-2011 |
20120029343 | INDUCTIVE COIL DEVICE ON FLEXIBLE SUBSTRATE - A device includes a flexible substrate, N coiled conductors, and a plurality of folding regions. The N coiled conductors are deposited on the flexible substrate and connected in series by conductive interconnects. N is greater than 1. Each of the folding regions is defined by a separation distance between adjacent ones of the N coiled conductors. The conductive interconnects traverse the folding regions between the N coiled conductors to connect the N coiled conductors in series. The flexible substrate is folded such that the N coiled conductors form a stack of N coiled conductors. | 02-02-2012 |
20120064670 | APPARATUS FOR RESTRICTING MOISTURE INGRESS - Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier. | 03-15-2012 |
20120101540 | WAFER-SCALE PACKAGE INCLUDING POWER SOURCE - A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module. | 04-26-2012 |
20120108954 | ERROR CORRECTION TECHNIQUES IN SURGICAL NAVIGATION - A medical system includes a sensor location module, a first module, and a second module. The sensor location module determines a location of a magnetic field sensor within a magnetic field. The first module determines an acceleration of the magnetic field sensor. The second module indicates a modified location of the magnetic field sensor in an image of a medical patient based on the acceleration and one or more previously determined locations. | 05-03-2012 |
20120197155 | Implantable Capacitive Pressure Sensor Apparatus and Methods Regarding Same - An implantable capacitive pressure sensor apparatus and method for making such an apparatus includes a first pressure sensor portion and a second pressure sensor portion. The first pressure sensor portion includes a diaphragm electrode connectable to ground (e.g., the diaphragm electrode being positioned in close proximity to the body when implanted therein such that the diaphragm electrode is deformable in response to pressure applied thereto by the body). The second pressure sensor portion includes a signal electrode (e.g., wherein the first pressure sensor portion and the second pressure sensor portion are coupled such that a gap is provided between the diaphragm electrode and the signal electrode) and an insulator material. The signal electrode is provided on and in direct contact with the insulator material to electrically isolate the signal electrode such that parasitic capacitance effects on the signal electrode are reduced. | 08-02-2012 |
20120311855 | APPARATUS FOR RESTRICTING MOISTURE INGRESS - Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier. | 12-13-2012 |
Patent application number | Description | Published |
20080198854 | SYSTEM AND METHOD FOR LOCAL PACKET TRANSPORT SERVICES WITHIN DISTRIBUTED ROUTERS - A system and method for routing packets within a router having a plurality of loosely-coupled route processors, including a first route processor, and a line card operably coupled to the plurality of distributed-route-processors. Each route processor includes an internal forwarding information base (IFIB). Each IFIB includes information that is used to route packets addressed to elements within the router. | 08-21-2008 |
20090201808 | Rate Controlling of Packets Destined for the Route Processor - Packets destined for the route processor of a packet switching device are rate controlled. Typically, line cards are configured to rate limit packets of offending packet flows destined for the route processor, such, but not limited to in response to a quantity of packets in the route processor. Filtering of packets of offending packet flows at the line cards reduces the work required of the route processor. | 08-13-2009 |
20110019670 | SYSTEM AND METHOD FOR LOCAL PACKET TRANSPORT SERVICES WITHIN DISTRIBUTED ROUTERS - A system and method for routing packets within a router having a plurality of loosely-coupled route processors, including a first route processor, and a line card operably coupled to the plurality of distributed-route-processors. Each route processor includes an internal forwarding information base (IFIB). Each IFIB includes information that is used to route packets addressed to elements within the router. | 01-27-2011 |
20140211628 | SYSTEM AND METHOD FOR LOCAL PACKET TRANSPORT SERVICES WITHIN DISTRIBUTED ROUTERS - A system and method for routing packets within a router having a plurality of loosely-coupled route processors, including a first route processor, and a line card operably coupled to the plurality of distributed-route-processors. Each route processor includes an internal forwarding information base (IFIB). Each IFIB includes information that is used to route packets addressed to elements within the router. | 07-31-2014 |