Patent application number | Description | Published |
20080224054 | Photon detection device - The present invention discloses a photon detection device that is adapted to detect at least one packet of photons. The photon detection device may include a photon-sensitive element having an output, an amplifier; and a non-linear feedback (NLF) element. The photon-sensitive element generates charges upon the engagement of at least one photon packet therewith. An increase from a first number of charges in the photon-sensitive element to a second number of charges, results in a corresponding increase of a first reset time required to reset the first number of charges to a respective second reset time required to reset the second number of charges in the photon-sensitive element, whereby the reset time is non-linear to with respect to an increase in the charges. Additional and alternative embodiments are described and claimed. | 09-18-2008 |
20080247033 | Device and Method for the Demodulation of Modulated Electric Signals - A demodulation device ( | 10-09-2008 |
20090014658 | Solid-state photodetector pixel and photodetecting method - A pixel is formed in a semiconductor substrate (S) with a plane surface for use in a photodetector. It comprises an active region for converting incident light (In) into charge carriers, photogates (PGL, PGM, PGR) for generating a lateral electric potential (Φ(x)) across the active region, and an integration gate (IG) for storing charge carriers generated in the active region and a dump site (Ddiff). The pixel further comprises separation-enhancing means (SL) for additionally enhancing charge separation in the active region and charge transport from the active region to the integration gate (IG). The separation-enhancing means (SL) are for instance a shield layer designed such that for a given lateral electric potential (Φ(x)), the incident light (In) does not impinge on the section from which the charge carriers would not be transported to the integration gate (IG). | 01-15-2009 |
20090020687 | Reference Pixel Array with Varying Sensitivities for TOF Sensor - The sensitivity of a reference pixel array RPA to the reference modulated light MLR is varied for different reference pixels RP of the reference pixel array RPA. In one embodiment the different sensitivities of the reference pixels RP in the RPA is achieved by designing the pixels to have different light sensitivities with respect to each other. In another embodiment, the different sensitivities are achieved by changing optical coupling between the separate reference pixels RP of the reference pixel array RPA to the reference modulated light MLR such as by changing how the different reference pixels RP couple to the aperture LGA of the light guide LG. | 01-22-2009 |
20090021617 | On-chip time-based digital conversion of pixel outputs - An integrated sensor chip comprises at least one pixel. The at least one pixel comprises: one or several integration regions for receiving and storing photogenerated charges; a modulation region that moves the photogenerated charges to be stored in the at least two integration regions; and sense nodes, in which each of the sense nodes is associated with one of the integration regions, into which the photogenerated charges are moved from the integration regions during a readout stage. The chip comprises: at least one function generator for generating a time-varying function that is applied to the integration regions during the readout cycle to move the photogenerated changes to the sense nodes; a counter generates a count during the generation of the time-varying function; and registers, in which each of the registers is associated with one of the sense nodes during read out, for storing digital values; wherein the registers store the count in response to the associated sense node receiving photogenerated charges from the associated integration regions. | 01-22-2009 |
20100053405 | Demodulation Pixel with Daisy Chain Charge Storage Sites and Method of Operation Therefor - A demodulation pixel architecture allows for demodulating an incoming modulated electromagnetic wave, normally visible or infrared light. It is based on a charge coupled device (CCD) line connected to a drift field structure. The drift field is exposed to the incoming light. It collects the generated charge and forces it to move to the pick-up point. At this pick-up point, the CCD element samples the charge for a given time and then shifts the charge packets further on in the daisy chain. After a certain amount of shifts, the multiple charge packets are stored in so-called integration gates, in a preferred embodiment. The number of integration gates gives the number of simultaneously available taps. When the cycle is repeated several times, the charge is accumulated in the integration gates and thus the signal-to-noise ratio increases. The architecture is flexible in the number of taps. A dump node can be attached to the CCD line for dumping charge with the same speed as the samples are taken. Different implementations are described herein, which allow for smaller design or faster speed. The pixel structure can be exploited for e.g. 3D time-of-flight imaging. Both heterodyne and homodyne measurements are possible. Due to the highly-efficient charge transport enabled by static drift fields in the photo-sensitive region and small-sized gates in the CCD chain, high frequency bandwidth from just a few Hertz (Hz) up to greater GHz is supported. Thus, the pixel allows for highly-accurate optical distance measurements. Another possible application of this pixel architecture is fluorescence lifetime imaging microscopy (FLIM), where short laser pulses for triggering the fluorescence have to be suppressed. | 03-04-2010 |
20100193666 | Image Sensor with Large-Area, High-Sensitivity and High-Speed Pixels - The pixel for use in an image sensor comprises a low-doped semiconductor substrate (A). On the substrate (A), an arrangement of a plurality of floating areas, e.g., floating gates (FG | 08-05-2010 |
20100308209 | System for Charge-Domain Electron Subtraction in Demodulation Pixels and Method Therefor - A method and system enable the subtraction of charge carrier packages in the low-noise charge domain, which is particularly interesting for the operation of demodulation pixels when high background light signals are present. The method comprises the following steps: demodulation of an optical signal and integration of the photo-generated charge carriers; charge transfer to an external capacitance. The second step means a recombination of electrons and holes in the charge domain and an influencing of the opposite charge carriers on the second plate of the capacitance. This approach allows for low-noise subtraction of charge packages in the charge domain and, at the same time, for creating pixels with much higher fill factors because the capacitances can be optimized for storing just the differential parts, without the DC component. | 12-09-2010 |
20110089471 | Demodulation Pixel Incorporating Majority Carrier Current, Buried Channel and High-Low Junction - A demodulation pixel improves the charge transport speed and sensitivity by exploiting two effects of charge transport in silicon in order to achieve the before-mentioned optimization. The first one is a transport method based on the CCD gate principle. However, this is not limited to CCD technology, but can be realized also in CMOS technology. The charge transport in a surface or even a buried channel close to the surface is highly efficient in terms of speed, sensitivity and low trapping noise. In addition, by activating a majority carrier current flowing through the substrate, another drift field is generated below the depleted CCD channel. This drift field is located deeply in the substrate, acting as an efficient separator for deeply photo-generated electron-hole pairs. Thus, another large amount of minority carriers is transported to the diffusion nodes at high speed and detected. | 04-21-2011 |
20110101241 | Solid-State Photodetector Pixel and Photodetecting Method - A pixel is formed in a semiconductor substrate (S) with a plane surface for use in a photodetector. It comprises an active region for converting incident light (In) into charge carriers, photogates (PGL, PGM, PGR) for generating a lateral electric potential (Φ(x)) across the active region, and an integration gate (IG) for storing charge carriers generated in the active region and a dump site (Ddiff). The pixel further comprises separation-enhancing means (SL) for additionally enhancing charge separation in the active region and charge transport from the active region to the integration gate (IG). The separation-enhancing means (SL) are for instance a shield layer designed such that for a given lateral electric potential (Φ(x)), the incident light (In) does not impinge on the section from which the charge carriers would not be transported to the integration gate (IG). | 05-05-2011 |
20110114821 | 3D CCD-Style Imaging Sensor with Rolling Readout - The presented readout structure provides charge transport based readout of a photosensitive device with a minimum number of transport gates. The structure uses the given charge storage buckets of the photosensitive device, separated by a minimum sized barrier-gate, to transport the charge out of the pixel field. This new readout schema allows for a fast readout speed based on a 2 phase transport chain and increases the pixel's optical fill factor by significantly reducing the transport gate size compared to state-of-the-art pixels using a 3 or 4 phase CCD readout chain. This readout structure can be exploited for standard photo-detecting elements such as e.g. pinned photo-diodes or any enhanced pixel structure that has additional intelligence incorporated as well. Typical applications are 2D- or 3D-imaging. The process used for manufacturing a sensor with such a readout scheme requires preferably charge transport mechanisms like charge-coupled gate devices as well as the possibility of integrating circuitries of high density. The exploitation of such a combination of process-related features results in a new sensor readout technique that allows for optimizing the pixel's dynamic range and optical fill factor. | 05-19-2011 |
20110273561 | Multistage Demodulation Pixel and Method - A demodulation structure for a n-tap pixel, mainly for 3D time-of-flight (TOF) applications uses a 2-stage switch structure for demodulating a modulated electromagnetic wave. An almost arbitrary number of storage sites per pixel can be implemented enabling an almost arbitrary number of samplings captured during one exposure. It also provides the option to demodulate and integrate different phasing samples according to the different modulation frequencies within the same exposure. | 11-10-2011 |
20130070132 | Time of Flight Sensor with Subframe Compression and Method - A demodulation image sensor, such as used in time of flight (TOF) cameras, extracts all storage- and post-processing-related steps from the pixels to another array of storage and processing elements (proxels) on the chip. The pixel array has the task of photo-detection, first processing and intermediate storage to create subframes, while the array of storage and processing elements provides accumulation into frames. Particularly, sampled values of several subframes are summed in a compressed manner. Possible compression is to use exponential function. | 03-21-2013 |
20130248938 | PN-Structured Gate Demodulation Pixel - A novel photo-sensitive element for electronic imaging purposes and, in this context, is particularly suited for time-of-flight 3D imaging sensor pixels. The element enables charge-domain photo-detection and processing based on a single gate architecture. Certain regions for n and p-doping implants of the gates are defined. This kind of single gate architecture enables low noise photon detection and high-speed charge transport methods at the same time. A strong benefit compared to known pixel structures is that no special processing steps are required such as overlapping gate structures or very high-ohmic poly-silicon deposition. In this sense, the element relaxes the processing methods so that this device may be integrated by the use of standard CMOS technology for example. Regarding time-of-flight pixel technology, a major challenge is the generation of lateral electric fields. The element allows the generation of fringing fields and large lateral electric fields. | 09-26-2013 |
20140203389 | Solid-State Photodetector Pixel and Photodetecting Method - A pixel is formed in a semiconductor substrate (S) with a plane surface for use in a photodetector. It comprises an active region for converting incident light (In) into charge carriers, photogates (PGL, PGM, PGR) for generating a lateral electric potential (Φ(x)) across the active region, and an integration gate (IG) for storing charge carriers generated in the active region and a dump site (Ddiff). The pixel further comprises separation-enhancing means (SL) for additionally enhancing charge separation in the active region and charge transport from the active region to the integration gate (IG). The separation-enhancing means (SL) are for instance a shield layer designed such that for a given lateral electric potential (Φ(x)), the incident light (In) does not impinge on the section from which the charge carriers would not be transported to the integration gate (IG). | 07-24-2014 |