Hochstenbach
Hendrik Hochstenbach, Nijmegen NL
Patent application number | Description | Published |
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20100187688 | REDUCED BOTTOM ROUGHNESS OF STRESS BUFFERING ELEMENT OF A SEMICONDUCTOR COMPONENT - The present invention relates to a stress buffering package ( | 07-29-2010 |
Hendrik P. Hochstenbach, Nijmegen NL
Patent application number | Description | Published |
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20100224987 | STRESS BUFFERING PACKAGE FOR A SEMICONDUCTOR COMPONENT - The present invention relates to a stress buffering package for a semiconductor component, wherein a stress buffering means comprises individual stress buffering elements that do not influence the stress buffering effect from each other. Furthermore the invention relates a method for manufacturing a stress buffering package for a semiconductor component. | 09-09-2010 |
Hendrik Pieter Hochstenbach, Nijmegen NL
Patent application number | Description | Published |
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20100193945 | REINFORCED STRUCTURE FOR A STACK OF LAYERS IN A SEMICONDUCTOR COMPONENT - The present application relates to a reinforcing structure ( | 08-05-2010 |
20110192885 | WIREBONDING PROCESS - Consistent with an example embodiment, a wirebonding process comprises forming a bond pad with a roughened upper surface, lowering a copper wirebond ball onto the roughened bond bad, and applying a force to the wirebond ball against the roughened surface, A heat treatment is applied to form the bond between the wirebond ball and the roughened surface, wherein the bond is formed without use of ultrasonic energy. | 08-11-2011 |
20110275176 | Method of Assembly and Assembly Thus Made - An assembly ( | 11-10-2011 |
Jan Renier Marie Hochstenbach, Baexem NL
Patent application number | Description | Published |
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20090200915 | METHOD LIGHT EMITTING DEVICE WITH A EU(III)-ACTIVATED PHOSPHOR AND SECOND PHOSPHOR - This invention relates to a light emitting device based on a Xe or Xe/Ne excimer discharge, e.g. a full colour display screen or a xenon excimer lamp, comprising a phosphor blend of a red-emitting Eu(III)-activated phosphor and an UVlight emitting phosphor. Full colour plasma display panels (PDPs) according to the present invention comprising a phosphor blend of a red-emitting Eu(III)-activated phosphor and an UV-light emitting phosphor for the red pixels show an improved colour point and a shorter decay time compared to the use of the respective single red emitting Eu(III) activated phosphor. Xenon excimer lamps for illumination purposes (e.g. for LCD backlighting or X-Ray image illumination) comprising a phosphor blend of a redemitting Eu(III) activated phosphor and an UV-light emitting phosphor show an improved colour rendering. The invention is also related to a phosphor blend of a red-emitting Eu(III)-activated phosphor and an UV-light emitting phosphor. | 08-13-2009 |
Jan Renier Marie Hochstenbach, Eindhoven NL
Patent application number | Description | Published |
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20130242536 | METHOD OF MANUFACTURING A PART OF A COLOR RING AND A PART OF A COLOR RING | 09-19-2013 |
Pieter Hochstenbach, Nijmegen NL
Patent application number | Description | Published |
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20110156237 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 06-30-2011 |
20130273731 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 10-17-2013 |