Patent application number | Description | Published |
20080224035 | Pattern displacement measuring method and pattern measuring device - An evaluation method and apparatus is provided for evaluating a displacement between patterns of a pattern image by using design data representative of a plurality of patterns superimposed ideally. A first distance is measured for an upper layer pattern between a line segment of the design data and an edge of the charged particle radiation image, a second distance is measured for a lower layer pattern between a line segment of the design data and an edge of the charged particle radiation image; and an superimposition displacement is detected between the upper layer pattern and lower layer pattern in accordance with the first distance and second distance. | 09-18-2008 |
20090032707 | PATTERN MEASUREMENT METHOD AND PATTERN MEASUREMENT SYSTEM - Easily and correctly measuring a dimension of a pattern of a photomask or of an OPC pattern of the photomask. | 02-05-2009 |
20090039263 | PATTERN MEASUREMENT APPARATUS - Mutual compatibility is established between the measurement with a high magnification and the measurement in a wide region. A pattern measurement apparatus is proposed which adds identification information to each of fragments that constitute a pattern within an image obtained by the SEM, and which stores the identification information in a predetermined storage format. Here, the identification information is added to each fragment for distinguishing between one fragment and another fragment. According to the above-described configuration, it turns out that the identification information is added to each fragment on the SEM image which has possessed no specific identification information originally. As a result, it becomes possible to implement the SEM-image management based on the identification information. | 02-12-2009 |
20090052765 | PATTERN SHAPE EVALUATION METHOD, PATTERN SHAPE EVALUATION DEVICE, PATTERN SHAPE EVALUATING DATA GENERATION DEVICE AND SEMICONDUCTOR SHAPE EVALUATION SYSTEM USING THE SAME - A pattern shape evaluation method and semiconductor inspection system having a unit for extracting contour data of a pattern from an image obtained by photographing a semiconductor pattern, a unit for generating pattern direction data from design data of the semiconductor pattern, and a unit for detecting a defect of a pattern, through comparison between pattern direction data obtained from the contour data and pattern direction data generated from the design data corresponding to a pattern position of the contour data. | 02-26-2009 |
20090152463 | METHOD AND APPARATUS OF PATTERN INSPECTION AND SEMICONDUCTOR INSPECTION SYSTEM USING THE SAME - A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers. | 06-18-2009 |
20090202137 | METHOD AND APPARATUS FOR IMAGE GENERATION - The present invention provides a technique to generate an accurate connected image even in a monotonous pattern using design data as constrained conditions. A reference position is roughly determined through matching between the design data and image data, matching between neighboring images is performed using the amount of mismatch from the design data as a searching range and a connected image is generated at high speed and accurately. The image generation method of the present invention is an image generation method for inspecting an electronic device pattern using a scanning electron microscope and is constructed of a design data file that stores design data describing layout information of an electronic device pattern by inputting the data, a plurality of divided pieces of image data obtained by imaging the electronic device pattern at different imaging positions, and image connecting means for connecting the plurality of divided pieces of image data into one image using the plurality of divided pieces of image data and the design data of a file of the design data (see FIG. | 08-13-2009 |
20090202139 | PATTERN GENERATING APPARATUS AND PATTERN SHAPE EVALUATING APPARATUS - Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern. | 08-13-2009 |
20090232385 | PATTERN MEASURING METHOD AND PATTERN MEASURING DEVICE - An object of the present invention is to provide a sample measuring method and a sample measuring device suitable for evaluation of inclination of a pattern edge. To achieve the object, a method and a device for forming a plurality of contours of a pattern edge and evaluating the dimension between the contours are proposed below. Forming a plurality of contours allows evaluation of the degree of inclination of an edge portion of a pattern. Further, displaying evaluation values indicative of the degree of the inclination of the edge portion in an in-plane distribution form makes identifying the cause of taper formation easier. | 09-17-2009 |
20090238443 | PATTERN MEASUREMENT METHODS AND PATTERN MEASUREMENT EQUIPMENT - An object of the present invention is to provide methods and equipment capable of providing highly accurate matching using a template including multiple patterns even when the shapes of some patterns of the template are different from corresponding ones of a SEM image, and when the template and the SEM image have a magnification error. Proposed, as a technique for achieving the object, is a method for performing matching by selectively using some of multiple patterns provided in a predetermined region of design data, and equipment for implementing the method. Moreover, proposed, as another technique for achieving the object, is a method for performing first matching by using multiple patterns provided in a predetermined region of design data and thereafter performing second matching by using some of the multiple patterns provided in the predetermined region, and equipment for implementing the method. | 09-24-2009 |
20100140472 | PATTERN DISPLACEMENT MEASURING METHOD AND PATTERN MEASURING DEVICE - An evaluation method and apparatus is provided for evaluating a displacement between patterns of a pattern image by using design data representative of a plurality of patterns superimposed ideally. A first distance is measured for an upper layer pattern between a line segment of the design data and an edge of the charged particle radiation image, a second distance is measured for a lower layer pattern between a line segment of the design data and an edge of the charged particle radiation image; and an superimposition displacement is detected between the upper layer pattern and lower layer pattern in accordance with the first distance and second distance. | 06-10-2010 |
20100202654 | PATTERN MEASUREMENT APPARATUS - Mutual compatibility is established between the measurement with a high magnification and the measurement in a wide region. A pattern measurement apparatus is proposed which adds identification information to each of fragments that constitute a pattern within an image obtained by the SEM, and which stores the identification information in a predetermined storage format. Here, the identification information is added to each fragment for distinguishing between one fragment and another fragment. According to the above-described configuration, it turns out that the identification information is added to each fragment on the SEM image which has possessed no specific identification information originally. As a result, it becomes possible to implement the SEM-image management based on the identification information. | 08-12-2010 |
20110074817 | COMPOSITE PICTURE FORMING METHOD AND PICTURE FORMING APPARATUS - A composite picture forming method and picture forming apparatus forms pattern attribute information contained in an overlapping domain for the overlapping domain between a plurality of pictures to select the pictures to be targeted for a composition in accordance with the pattern attribute information and combine the selected pictures, and the composition of the pictures is also performed in plural stages by using the pattern attribute information in the overlapping domain. | 03-31-2011 |
20110139982 | METHOD FOR MEASURING SAMPLE AND MEASUREMENT DEVICE - An object of the present invention is to provide a method that can properly carry out the evaluation of a displacement and an overlapping area between first and second patterns formed through double patterning and a device therefor. | 06-16-2011 |
20110142326 | PATTERN INSPECTION METHOD, PATTERN INSPECTION APPARATUS AND PATTERN PROCESSING APPARATUS - In a defect judgment operation using tolerance to allow a high-speed operation, the amount of deformation is obtained from an image pickup pattern image, and tolerance including the deformation is generated by deforming a reference pattern image as the basis of the tolerance according to the deformation, and only a disconnection or a contact is judged as an abnormality even if deformation exists in an image pickup pattern. | 06-16-2011 |
20110181688 | METHOD AND DEVICE FOR SYNTHESIZING PANORAMA IMAGE USING SCANNING CHARGED-PARTICLE MICROSCOPE - Provided is a panorama image synthesis technique using a scanning charged-particle microscope and capable of obtaining a panorama image synthesis that is robust against contamination and the imaging shift and distortion of an image in a wide-field imaging region (EP) for semiconductor fine patterns. The panorama image synthesis technique in the wide-field imaging region (EP) using the scanning charged-particle microscope is characterized in that the layout of each adjustment point, each local imaging region, and an imaging sequence comprising the imaging order of the each adjustment point are optimized and created as an imaging recipe. | 07-28-2011 |
20120057774 | PATTERN GENERATING APPARATUS AND PATTERN SHAPE EVALUATING APPARATUS - Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern. | 03-08-2012 |
20120092482 | METHOD AND DEVICE FOR CREATING COMPOSITE IMAGE - A composite image creating method and device are provided which, when images separately captured a plurality of times are panoramically synthesized, can prevent deformation of a pattern due to multiple irradiation of the electron beam. One image is generated by overlapping joining areas of rims of two adjacent images when a plurality of images are joined to generate one image. Of two adjacent images, the joining area of an image of an earlier image capturing order is left, and the joining area of an image of a later image capturing order is removed. The joining area of the image of an earlier image capturing order is obtained with irradiation of electron beam a less number of times than the joining area of the image of a later image capturing order, and therefore deformation of a pattern due to irradiation of the electron beam is little. | 04-19-2012 |
20120098953 | SCANNING ELECTRON MICROSCOPE DEVICE AND PATTERN DIMENSION MEASURING METHOD USING SAME - In a panoramic image construction technology of dividing a wide-range imaging area (EP) of semiconductor patterns into a plurality of imaging areas (SEP), and joining a group of images, which are obtained by imaging the SEPs using an SEM, through image processing, a fact that although a pattern serving as a key to joining is not contained in an overlap area between some of the SEPs, all the images can be joined in some cases is noted so that: although the number of patterns serving as keys to joining is small, SEPs whose images are all joined can be determined; or even if such SEPs cannot be determined, SEPs satisfying user's request items as many as possible can be determined. The cases are extracted by optimizing an SEP arrangement, whereby the number of cases in which SEPs whose images are all joined can be determined is increased. | 04-26-2012 |
20120099781 | METHOD AND APPARATUS OF PATTERN INSPECTION AND SEMICONDUCTOR INSPECTION SYSTEM USING THE SAME - A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers. | 04-26-2012 |
20120106826 | PATTERN SHAPE EVALUATION METHOD AND PATTERN SHAPE EVALUATION APPARATUS - An image of the joint portion of circuit patterns manufactured using a design pattern for double patterning is read out. Target boundary lines and evaluation regions are set on the image. In the evaluation regions, image processing is performed along the directions of the target boundary lines. Furthermore, binarization processing is performed. A decision is made based on an image obtained in this way as to whether the patterns have defects. | 05-03-2012 |
20120121160 | METHOD OF CREATING TEMPLATE FOR MATCHING, AS WELL AS DEVICE FOR CREATING TEMPLATE - Disclosed is a method wherein a template for template matching is created with high accuracy and high efficiency. With respect to each individual pattern constituting a basic circuit, pattern information regarding a plurality of layers in a semiconductor device is stored in a library. On the basis of the designation of the position and the layer, pattern information regarding the designated position and layer is extracted from the pattern information stored in the library. A template is created on the basis of the extracted pattern information. | 05-17-2012 |
20120181426 | Scanning Electron Microscope and a Method for Imaging a Specimen Using the Same - (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed. | 07-19-2012 |
20120290990 | Pattern Measuring Condition Setting Device - When setting a measurement position, on the basis of a defect coordinate, on a sample, which is arranged with a complex pattern or a plurality of patterns and which has a pattern in which the influence of the optical proximity effect needs to be evaluated, the measurement position is set so as to improve work efficiency. Provided is a device for setting a first measurement position and a second measurement position, wherein: a reference line comprising a plurality of line segments is superimposed on a two-dimensional region set by a pattern layout data; the first measurement position is set on the inside of a contour which indicates a pattern in which a defect coordinate on the layout data exists, and between the intersecting points of the reference line and said contour; and a second measurement position is set outside of said contour, and either on said contour and another portion of said contour or between the intersecting points of said contour and another portion of said contour. | 11-15-2012 |
20120300054 | Method of Extracting Contour Lines of Image Data Obtained By Means of Charged Particle Beam Device, and Contour Line Extraction Device - The present invention is intended to provide a contour extraction method and a contour extraction device with an objective of either suppression of unnecessary contouring processings or selective contouring of necessary portions. To attain the objective, provided are a contour extraction method, and a device, with which contours of pattern edges on an image formed based on charged particles emitted from a sample are extracted and, when contouring of a pattern located in an overlapping region provided in connecting images of plural image-capturing regions to form a synthesized image is performed, either areas of the pattern in the plurality of image-capturing regions, or a pre-set measurement portion is found, and selective contour extraction of the pattern with respect to an image of an image-capturing region is carried out either on a side where the area is large, or on a side where a measurement portion regarding the pattern is located. | 11-29-2012 |
20130011080 | Image Processing Apparatus, Image Processing Method, and Image Processing Program - It is an object of the present invention is to provide an image processing technique that can detect the rotation of an observation image of a specimen with high accuracy. An image processing apparatus according to the present invention indirectly corrects a rotation gap between measurement image data and reference image data through wide-angle image data including a measurement part of a specimen (FIG. | 01-10-2013 |
20130117723 | PATTERN SHAPE EVALUATION METHOD, PATTERN SHAPE EVALUATION DEVICE, PATTERN SHAPE EVALUATING DATA GENERATION DEVICE AND SEMICONDUCTOR SHAPE EVALUATION SYSTEM USING THE SAME - A pattern shape evaluation method and semiconductor inspection system having a unit for extracting contour data of a pattern from an image obtained by photographing a semiconductor pattern, a unit for generating pattern direction data from design data of the semiconductor pattern, and a unit for detecting a defect of a pattern, through comparison between pattern direction data obtained from the contour data and pattern direction data generated from the design data corresponding to a pattern position of the contour data. | 05-09-2013 |
20130136335 | PATTERN GENERATING APPARATUS AND PATTERN SHAPE EVALUATING APPARATUS - Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern. | 05-30-2013 |
20130150998 | MANAGING APPARATUS OF SEMICONDUCTOR MANUFACTURING APPARATUS AND COMPUTER PROGRAM - An object of the present invention is to provide a managing apparatus of a semiconductor manufacturing apparatus and a computer program capable of performing an accurate process monitoring based on the obtained pattern image and the like. To accomplish the above object, according to one aspect of the present invention, there are proposed a managing apparatus of a semiconductor manufacturing apparatus including a library which stores an association between shape information of a pattern of a plurality of positions and an exposure condition of an exposing device and a calculation device which compares the shape information of the plurality of positions extracted from image information with the shape information stored in the library, and extracts the exposure condition based on a logical product of a range of a plurality of exposure conditions corresponding to the shape information of the plurality of patterns extracted from the image information, and a computer program which executes the above processes. | 06-13-2013 |
20130279793 | IMAGE PROCESSING APPARATUS AND COMPUTER PROGRAM - An object of the present invention is to provide an image processing apparatus and a computer program which detects a defect such as a scum at high speed and with high precision. In order to accomplish the above-described object, the present invention proposes an image processing apparatus and a computer program which acquires image data, and detects edge branch points from this image data. Here, at each of the edge branch points, an edge associated therewith branches off in at least three or more directions. According to this configuration, it becomes possible to detect a defect such as a scum without utilizing the reference-pattern image. As a consequence, it becomes possible to detect the scum at high speed and with high precision. | 10-24-2013 |
20130315468 | PATTERN GENERATING APPARATUS AND PATTERN SHAPE EVALUATING APPARATUS - Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern. | 11-28-2013 |
20130326439 | IMAGE PROCESSING DEVICE AND COMPUTER PROGRAM FOR PERFORMING IMAGE PROCESSING - It is an object of the present invention to provide an image processing device for allowing an actual-image-closer pattern to be formed based on the design data, or its simulation image. In order to accomplish the above-described object, the proposal is made concerning an image processing device which includes an image processing unit which sets the operation condition of a charged-particle beam device on the basis of the design data on a semiconductor element. Here, the image processing device accesses a library for storing device-condition information on the charged-particle beam device, pattern types, and a plurality of combinations of pattern information on each pattern-region basis. Moreover, the image processing device forms a composite image of each pattern region, using the pattern information on each pattern-region basis, and based on the device-condition information and the selection of a pattern type from the pattern types. | 12-05-2013 |
20140145078 | SCANNING ELECTRON MICROSCOPE AND A METHOD FOR IMAGING A SPECIMEN USING THE SAME - (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed. | 05-29-2014 |