Patent application number | Description | Published |
20100265228 | SELF-LUMINESCENT DISPLAY DEVICE AND ELECTRONIC APPARATUS - A self-luminescent display device includes a pixel unit in which a plurality of pixels including a self-luminescent pixel is arranged, an external light sensor which measures an external light intensity, a temperature sensor which measures an environmental temperature, an image correcting unit which corrects image data input to the image correcting unit on the basis of statistical data of the image data, a light adjusting unit which produces a light adjusting signal on the basis of a measurement signal of the external light sensor, a temperature control unit which produces a temperature correcting signal on the basis of a measurement signal of the temperature sensor, and a display control unit which produces a brightness correcting signal for correcting light emitting brightness of the pixels in the pixel unit on the basis of the light adjusting signal and the temperature correcting signal. The light emitting brightness of the pixels in the pixel unit is adjusted on the basis of the image data corrected by the image correcting unit and the brightness correcting signal. | 10-21-2010 |
20140256429 | IMAGE DISPLAY SYSTEM AND HEAD-MOUNTED DISPLAY DEVICE - An image display system includes an image transmitter, a first display device that displays a first image, and a second display device that displays a second image, the second display device includes a display device side receiving unit that receives the second image, a display unit that displays the second image, a visual direction acquiring unit that acquires a current visual direction of the user, and a display device side transmitting unit that transmits the current visual direction, and the image transmitter includes a transmitter side receiving unit that receives the current visual direction, an extracting unit that extracts the first image as an image of a partial area in a whole image and the second image as an image of an area in response to the current visual direction in the whole image, and a transmitter side transmitting unit that transmits the first and second images. | 09-11-2014 |
Patent application number | Description | Published |
20090200073 | PRINTED WIRING BOARD WITH CAPACITOR - A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body. | 08-13-2009 |
20090205202 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 08-20-2009 |
20090205859 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 08-20-2009 |
20100043942 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 02-25-2010 |
20110289773 | METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT - A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor. | 12-01-2011 |