Patent application number | Description | Published |
20090295496 | BALUN - A balun having a first balanced terminal, a second balanced terminal and an unbalanced terminal, includes a filter unit and a first transmission line. The filter unit is connected to the first balanced terminal, the second balanced terminal and the unbalanced terminal, and includes a low-pass filter and a high-pass filter. The first transmission line is connected between the filter unit and the first balanced terminal. | 12-03-2009 |
20120081869 | PRINTED CIRCUIT BOARD FOR REDUCING CROSSTALK - There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced. | 04-05-2012 |
20120161914 | TRANSFORMER - There is provided a transformer having a minimized thickness. The transformer includes: insulating layers; and coil units including primary and secondary coils disposed on the insulating layers to have a common center. | 06-28-2012 |
20130186679 | MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively. | 07-25-2013 |
20140034357 | PRINTED CIRCUIT BOARD - A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via. | 02-06-2014 |
20140077896 | VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOARD HAVING THE SAME - The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided. | 03-20-2014 |
20140104798 | HYBRID LAMINATION SUBSTRATE, MANUFACTURING METHOD THEREOF AND PACKAGE SUBSTRATE - Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed. | 04-17-2014 |
20140124258 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding. | 05-08-2014 |
20140176278 | INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein. | 06-26-2014 |
20150102891 | CHIP ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND PACKAGING UNIT THEREOF - A chip electronic component may include: a magnetic body having first and second main surfaces opposing each other in a thickness direction, first and second side surfaces opposing each other in a width direction, and first and second end surfaces opposing each other in a length direction, a thickness of the magnetic body being greater than a width thereof; internal coil pattern parts disposed in the magnetic body; and external electrodes disposed on at least one surface of the magnetic body. The internal coil pattern parts may be disposed to be perpendicular with respect to the first and second main surfaces of the magnetic body. | 04-16-2015 |
Patent application number | Description | Published |
20090197369 | Multilayer substrate manufacturing method - A method for producing a multilayer substrate includes stacking a first substrate, the first substrate having a circuit pattern; stacking a connector, the connector coupling onto said first substrate, the connector having a ring structure, the ring structure having a plurality of holes separated a predetermined distance from one another; and stacking a second substrate, the second substrate coupling onto said first substrate by inserting said connector, the second substrate having a circuit pattern, the circuit pattern being electrically connected to a circuit pattern formed on said first substrate, the circuit pattern being electrically connected using the plurality of holes formed on said connector. The method of producing a multilayer substrate can shield the EMI generated by a high-speed switching element. | 08-06-2009 |
20090268418 | PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT - Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof. | 10-29-2009 |
20090268419 | PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT - Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof. | 10-29-2009 |
20120289173 | INTERFACE OF MULTI CHIP MODULE - Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication. | 11-15-2012 |
20130081868 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby to improve signal transmitting characteristics and allow high-density wiring and thin thickness. | 04-04-2013 |
20150288283 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a voltage supply circuit suitable for outputting a high voltage, a transfer circuit coupled between the voltage supply circuit and a peripheral circuit and suitable for transferring the high voltage to the peripheral circuit and a transfer control circuit suitable for outputting a transfer control signal to the transfer circuit to control the transfer of the high voltage to the peripheral circuit, wherein the transfer control circuit outputs the transfer control signal having a first positive voltage level to a gate of a transistor included in the transfer circuit when the voltage supply circuit outputs the high voltage to the transfer circuit. | 10-08-2015 |
20150348634 | SEMICONDUCTOR MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND OPERATING METHOD THEREOF - A semiconductor memory device includes a plurality of memory cells coupled between a source line and a bit line, a voltage generation circuit suitable for applying an erase voltage to the source line during an erase operation, and a read and to circuit coupled to the bit line through a selection transistor and suitable for applying an operating voltage to a first node of the selection transistor during the erase operation. | 12-03-2015 |