Chung-Hao
Chung-Hao Chang, Chung-Li City TW
Chung-Hao Chang, Yuanlin Township TW
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20100321521 | Method of automatic white-balance calibration - Provided is a method of automatic white-balance calibration. The method firstly uses a predefined gain. Each color value for pixels of an inputted image is calculated. A number of the placements representing the pixels within each gray region of a color space are then obtained. Next, a new gain is obtained by linearly combining those placements. Further, in order to overcome a possible chromatic aberration on account of the overlapping regions in the color space, the method introduces a specific deletion ratio to delete a portion of placements positioned in the overlapping regions. Therefore the method provides a proper image. Furthermore, users may decide a level of the chromatic aberration by adjusting the predefined gain. | 12-23-2010 |
Chung-Hao Chang, Hsinchu City TW
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20140278213 | Overlay Sampling Methodology - One embodiment relates to a method to achieve enhanced overlay control while maintaining manufacturing throughput for a fabrication process. Locations of a plurality of alignment structures on a wafer comprising a plurality of reticle fields are determined with a layout tool to define a layout-based wafer map. The topography of the wafer is then measured as a function of wafer position by a surface measuring tool. The layout-based wafer map is then projected onto the measured wafer topography to define a modeled wafer map. A subset of alignment structure locations are measured with an alignment tool in an in-line fabrication flow so as not to delay subsequent fabrication steps. Disagreement between the measured alignment structure locations and modeled alignment structure locations is then minimized mathematically to enhance overlay control while maintaining manufacturing throughput. | 09-18-2014 |
Chung-Hao Chen, Hsin-Chu TW
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20140176112 | LOW VOLTAGE BANDGAP REFERENCE CIRCUIT - A low voltage bandgap reference circuit includes a positive temperature coefficient circuit unit, a negative temperature coefficient circuit unit and a load unit, wherein the positive temperature coefficient circuit unit comprises a first differential operational amplifier, a first, second and third transistor, a first resistor, a first and second diode, and the negative temperature coefficient circuit unit includes a second differential operational amplifier, a fourth, fifth and sixth transistor, a second resistor and a third diode. The low voltage bandgap reference circuit provides a current having a positive temperature coefficient characteristics and a current having a negative temperature coefficient characteristics to flow through the load unit, whereby generate a stable reference voltage thereon, which the stable reference voltage is less affected by the temperature. Therefore, it avoids the problems of the low voltage bandgap reference circuit can not be activated at low voltage. | 06-26-2014 |
Chung-Hao Chen, Taoyuan County TW
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20130265759 | LIGHT EMITTING MODULE - A light emitting module includes a circuit board, a reflective layer, at least one light emitting chip and at least one metal wire. The circuit board has at least one connecting pad. The reflective layer is disposed on the circuit board and has at least one first opening exposing the connecting pad and at least one second opening exposing the circuit board. The light emitting chip is located in the second opening. The metal wire has a first end portion connecting to the connecting pad and a second end portion extending from the first end portion and crossing above the reflective layer and electrically connecting to the light emitting chip in the second opening. Consequently, the reflective layer can extend close to the light emitting chip and maximize the covered area of the reflective layer, and thus increase the light emitting efficiency of the light emitting module. | 10-10-2013 |
Chung-Hao Huang, Taoyuan County TW
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20150146916 | Method of reducing computational demand for image tracking - A method of reducing computational demand for image tracking includes first receiving a plurality of images of a load hoisted with hanging wire in a preset transitional space, setting at least one monitoring point each at the load and the hanging wire, respectively, providing a tracking frame at the outer periphery of each monitoring point, allowing each tracking frame to track on its corresponding monitoring point that each monitoring point is kept on a relative location within each corresponding tracking frame, and producing the same displacement as that of the monitoring point, and lastly computing the displacement of each tracking frame thus obtaining the displacement of each monitoring point in correspondence to the tracking frame to calculate various displacement of the hanging wire and the load, respectively. With this image tracking method, the processing quantity of whole image data is effectively decreased and computational demand of equipments is reduced. | 05-28-2015 |
Chung-Hao Kuo, Taipei City TW
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20130170124 | FOLDABLE ELECTRONIC DEVICE - A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other. | 07-04-2013 |
20150130666 | ASSEMBLED WEARABLE ELECTRONIC DEVICE - An assembled wearable electronic device includes a first body, a second body and an engaging assembly. The first body has a primary system for providing the independent operation of the first body and producing a related first data. The second body has a secondary system and a fixing assembly. The secondary system is for providing the independent operation of the second body and producing a related second data. The engaging assembly is disposed at one of the first and second bodies. When the engaging assembly is located at a first position, the first and second bodies contact each other to be combined through the engaging assembly. When the engaging assembly moves to a second position, the first and second bodies are configured to be separated from each other. When the first and second bodies are connected to each other, the second data is read by the primary system. | 05-14-2015 |
Chung-Hao Tsai, Huatantownship TW
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20150042438 | TUNABLE THREE DIMENSIONAL INDUCTOR - A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process. | 02-12-2015 |
Chung-Hao Tsai, Huatan Township TW
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20140152509 | Embedding Low-K Materials in Antennas - A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module. | 06-05-2014 |
20140183754 | Through-Vias and Methods of Forming the Same - An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring. | 07-03-2014 |
20140253262 | RF CHOKE DEVICE FOR INTEGRATED CIRCUITS - Among other things, one or more techniques and systems for selectively filtering RF signals within one or more RF frequency band are provided. In particular, an RF choke, such as a 3D RF choke or a semi-lumped RF choke, configured to selectively filter such RF signals is provided. The RF choke comprises a metal connection line configured as an inductive element for the RF choke. In an example, one or more metal lines, such as a metal open stub, are formed as capacitive elements for the RF choke. In another example, one or more through vias are formed as capacitive elements for the RF choke. In this way, the RF choke allows DC power signals to pass through the metal connection line, while impeding RF signals within the one or more RF frequency bands from passing through the metal connection line. | 09-11-2014 |
20150021758 | MECHANISMS FOR FORMING BUMP STRUCTURES OVER WIDE METAL PAD - Embodiments of mechanisms for forming a semiconductor die are provided. The semiconductor die includes a semiconductor substrate and a protection layer formed over the semiconductor substrate. The semiconductor die also includes a conductive layer conformally formed over the protection layer, and a recess is formed in the conductive layer. The recess surrounds a region of the conductive layer. The semiconductor die further includes a solder bump formed over the region of the conductive layer surrounded by the recess. | 01-22-2015 |
20150130681 | 3D ANTENNA FOR INTEGRATED CIRCUITS - An antenna comprises a first layer having a first redistribution layer, a feeding line, a ground connection element, and one or more antenna inputs. The antenna also comprises one or more intermediate layers over the first layer. The antenna further comprises a second layer having a second redistribution layer over the one or more intermediate layers. The antenna additionally comprises one or more through vias arranged to communicatively couple the second redistribution layer and the first redistribution layer. The antenna also comprises a short element. The antenna further comprises one or more radiator antennas within the one or more through vias, the one or more radiator antennas being in communication with the one or more antenna inputs by way of the feeding line. | 05-14-2015 |
Chung-Hao Tsai, Taipei City TW
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20140022030 | SIGNAL TRANSMISSION CIRCUIT AND SIGNAL TRANSMISSION CELL THEREOF - An exemplary embodiment of the present disclosure illustrates a signal transmission cell having a first through third conductors, a capacitor and an inductor. The first and third conductors form a first transmission circuit, and the second and the third conductors form a second transmission circuit. Signals which are respectively conveyed on the first transmission circuit and the second transmission circuit have the same magnitude, but have the opposite phases to each other, so as to form a pair of differential transmission lines. A first end of the inductor is electrically connected to the third conductor, and a second end of the inductor is electrically connected to a ground voltage. A first end of the capacitor is electrically connected to the first end of the inductor, and a second end of the capacitor is electrically connected to the second end the inductor. | 01-23-2014 |
Chung-Hao Tsai, Taipei TW
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20110032048 | FILTERING DEVICE AND DIFFERENTIAL SIGNAL TRANSMISSION CIRCUIT CAPABLE OF SUPPRESSING COMMON-MODE NOISES UPON TRANSMISSION OF A DEIFFERENTIAL SIGNAL - A filtering device is capable of suppressing common mode noises upon transmission of a differential signal, and includes a differential transmission line, a grounding layer, a dielectric unit and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other. The grounding layer is spaced apart from the differential transmission line. The dielectric unit is disposed between the differential transmission line and the grounding layer. The conductive structure is embedded in the dielectric unit, is coupled electrically to the conductive traces and the grounding layer, and cooperates with the differential transmission line, the grounding layer and the dielectric unit to form a stacked structure that has an effective negative permittivity, thereby suppressing the common mode noises coupled to the conductive traces. A differential signal transmission circuit is also disclosed. | 02-10-2011 |
20120025925 | COMMON MODE NOISE SUPPRESSION CIRCUIT - A common mode noise suppression circuit applicable to differential signal transmission performs common mode noise suppression with respect to differential signals transmitted by a transmission line. An inductance-capacitance resonant structure is formed based on electromagnetic coupling combining a ground structure to suppress common mode noise of differential mode signals at broadband meanwhile keeping low loss of the differential mode signals at broadband via differential transmission lines. By this, the common mode noise suppression circuit performs broadband suppression with related to the common mode noise within frequency scope of several GHzs without affecting the differential mode signals and improves manufacturing process miniaturization to decrease cost. | 02-02-2012 |
20120057323 | DEFECTED GROUND STRUCTURE WITH SHIELDING EFFECT - A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer. | 03-08-2012 |
20120194290 | ELECTROMAGNETIC NOISE SUPPRESSION CIRCUIT - An electromagnetic noise suppression circuit is provided. The suppression circuit comprises a first substrate, a first grounding plane and at least one transmission line. The transmission line is configured on a top surface of the first substrate and the first grounding plane is configured on the bottom surface of the first substrate. The first grounding plane comprises a first distributed coupling structure. The first distributed coupling structure and the transmission line can be equivalent to an inductor-capacitor resonant circuit. The electromagnetic noise within a designated frequency band can be suppressed by the distributed coupling structure of the electromagnetic noise suppression circuit to avoid interfering the signal transmitted by the transmission line and the electromagnetic radiation induced by the electromagnetic noise. | 08-02-2012 |
20130002378 | DIGITAL ELECTRONIC DEVICE - This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines. | 01-03-2013 |
20130069736 | BALUNS WITH IMAGINARY COMMOND-MODE IMPEDANCE - Baluns with imaginary common-mode impedance are disclosed. A disclosed balun comprises an unbalanced port with an unbalanced terminal and a ground terminal, a balanced port with two balanced terminals opposite to each other in phase, and a transmission cell. The transmission cell has a differential transmission line, a virtually-ground patch, a ground conductor, and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other, and is electrically connected between the unbalanced port and the balanced port to transmit a differential signal. The virtually-ground patch is spaced apart from the differential transmission line. The conductive structure electrically connects the virtually-ground patch to the ground conductor. | 03-21-2013 |
20140014405 | DEVICE SUPPRESSING COMMON-MODE RADIATION - The present invention provides a device for suppressing common-mode radiation comprising: at least one resonator embedded into a plate, wherein the at least one resonator defines a plane having a normal direction parallel and perpendicular, respectively, to a longitudinal direction and a thickness direction of the plate. The embedment of the resonator into the plate enables a magnetic field, which is generated by a cable conductor when the device for suppressing common-mode radiation wraps the cable conductor therein, to perpendicularly pass through the plane so that the magnetic field and the resonator resonate together to generate a strong diamagnetism and thereby to suppress the common-mode radiation. | 01-16-2014 |
Chung-Hao Wang, Taipei TW
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20130117585 | POWER SUPPLY DEVICE FOR SUPPLYING POWER VIA INTERNET NETWORK - A power supply device for supplying power via internet network comprises a power supply unit and a power consumption unit. The power supply unit comprises a power source unit and a first processing unit. The power source unit provides a first voltage with a first power and a second voltage with a second power. The first processing unit detects a connection status of the power supply unit for controlling the power source unit to provide the first voltage, and controlling the power source unit to provide the second voltage according to a control signal. The power consumption unit comprises a connecting unit and a second processing unit. The connecting unit is for connecting the power source unit and the first processing unit. The second processing unit receives the first voltage via the connecting unit and provides the control signal according to the first voltage. | 05-09-2013 |
Chung-Hao Wu, Taipei TW
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20090195982 | ELECTRONIC APPARATUS AND FAN MODULE THEREOF - The invention discloses an electronic apparatus and a fan module thereof. The fan module includes a base, an impeller, a liquid container, an atomizing device and a cover. The impeller is provided in the base. The liquid container is placed at the center of the impeller, and the liquid container contains a liquid. The atomizing device is disposed on the liquid container, and the atomizing device can atomize the liquid to form a mist to spray in order to absorb the heat in the electronic apparatus. The cover covers the base and forms an air outlet with the base. Furthermore, the cover has an air inlet. When the impeller rotates, the blade of the impeller drives airflow mixed the heated mist to enter into the base through the air inlet of the cover, and to exit from the base through the air outlet. | 08-06-2009 |
20120162513 | DUAL-CONNECTION MULTIMEDIA APPARATUS - The invention relates to a multimedia apparatus and more particularly to a multimedia apparatus capable of providing karaoke service through Internet servers or other external devices. The invention provides operating interfaces that are compatible to individual hardware, internet server, and mode of instruction input. The invention identifies multimedia files in external storages and further offers an offline karaoke service. | 06-28-2012 |