Patent application number | Description | Published |
20090036855 | Particulate water-absorbing agent with water-absorbing resin as main component, method for production of the same, and absorbing article - Reversed phase suspension polymerization is allowed while controlling content of minor components in monomer, particularly controlling a content of acetic acid and propionic acid being not higher than 500 ppm, controlling a content of acrylic acid dimer being not higher than 1000 ppm, in acrylic acid. Cross-linked polymer obtained by the polymerization is subjected to a surface crosslinking treatment without substantially using an organic solvent, and under heating at high temperature (150° C. or higher and 250° C. or lower). Thereafter, agglomeration is carried out without substantially using an organic solvent. Accordingly, a particulate water-absorbing agent including a water-absorbing resin having superior property, and being suited for practical applications at high concentrations in absorbing cores such as a diaper and the like without generation of any odor of the organic solvent can be obtained because no volatile organic compound is included. | 02-05-2009 |
20090298685 | WATER ABSORBING AGENT, WATER ABSORBENT CORE USING THE AGENT, AND MANUFACTURING METHOD FOR WATER ABSORBING AGENT - A water absorbing agent of the present invention has an internal crosslinking structure obtained by polymerization of a water-soluble unsaturated monomer. The agent satisfies conditions (a) to (d): (a) the agent contains water-insoluble inorganic particles at an amount of from 10 ppm to 1,900 ppm inclusive; (b) the agent contains 5 mass % or less particles which have such a size that they can pass through a sieve having a mesh opening size of 150 μm; (c) the agent has an absorbency against a pressure of 4.83 kPa (AAP) of 18 g/g or more; and (d) the water-insoluble inorganic particles reside on a surface of the water absorbing resin or near the surface. | 12-03-2009 |
20120184670 | PARTICULATE WATER ABSORBENT AND PROCESS FOR PRODUCTION THEREOF - A particulate water absorbing agent of the present invention is a water absorbing agent containing a water absorbing resin as a main component, the particulate water absorbing agent containing a polyvalent metal cation and satisfying: (1) the polyvalent metal cation is contained in an amount between 0.001 wt % and 5 wt % relative to the amount of the water absorbing agent; (2) an absorbency without pressure (CRC) is not less than 28 (g/g) and an absorbency against pressure (AAP 4.83 kPa) is not less than 10 (g/g); (3) the absorbency against pressure and the absorbency without pressure satisfy 77≦AAP (4.83 kPa)+1.8×CRC≦100; and (4) a moisture content of the water absorbing agent is between 5 wt % and 20 wt %. This provides a water absorbing agent which has blocking resistance after moisture absorption, is excellent in stability to shock and suppresses Re-Wet when used in a diaper. | 07-19-2012 |
20120305842 | WATER ABSORBING AGENT, WATER ABSORBENT CORE USING THE AGENT, AND MANUFACTURING METHOD FOR WATER ABSORBING AGENT - A water absorbing agent of the present invention has an internal crosslinking structure obtained by polymerization of a water-soluble unsaturated monomer. The agent satisfies conditions (a) to (d): (a) the agent contains water-insoluble inorganic particles at an amount of from 10 ppm to 1,900 ppm inclusive; (b) the agent contains 5 mass % or less particles which have such a size that they can pass through a sieve having a mesh opening size of 150 μm; (c) the agent has an absorbency against a pressure of 4.83 kPa (AAP) of 18 g/g or more; and (d) the water-insoluble inorganic particles reside on a surface of the water absorbing resin or near the surface. | 12-06-2012 |
Patent application number | Description | Published |
20080268626 | Semiconductor device having a plurality of kinds of wells and manufacturing method thereof - A semiconductor device has a configuration in which more than three kinds of wells are formed with small level differences. One kind of well from among the more than three kinds of wells has a surface level higher than other kinds of wells from among the more than three kinds of wells. The one kind of well is formed adjacent to and self-aligned to at least one kind of well from among the other kinds of wells. The other kinds of wells are different in one of a conductivity type, an impurity concentration and a junction depth, and include at least two kinds of wells having the same surface level. | 10-30-2008 |
20090050978 | SEMICONDUCTOR DEVICE - A disclosed semiconductor device includes a driver transistor including a source and a drain of a second conductive type provided with an interval therebetween in a semiconductor substrate of a first conductive type, a gate electrode extending in a predetermined direction and provided on the semiconductor substrate via a gate insulating film between the source and the drain, plural insular back gate diffusion layers of the first conductive type provided in the source so as to be in contact with the semiconductor substrate, wherein the back gate diffusion layers are spaced apart and arranged in the predetermined direction in the source, and a contact hole extending in the predetermined direction on the source and at least one of the back gate diffusion layers. | 02-26-2009 |
20090064791 | STRESS-DISTRIBUTION DETECTING SEMICONDUCTOR PACKAGE GROUP AND DETECTION METHOD OF STRESS DISTRIBUTION IN SEMICONDUCTOR PACKAGE USING THE SAME - A disclosed stress-distribution detecting semiconductor package group includes multiple stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of the same size using an identical resin encapsulation structure. Each stress detecting semiconductor chip includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element. The piezoelectric elements of the stress detecting semiconductor chips are respectively disposed on the corresponding stress detecting semiconductor chips to be located at different positions from one another when superimposed on a single imaginary semiconductor chip plane having the same plane size as that of the stress detecting semiconductor chips. | 03-12-2009 |
20090068811 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device is disclosed that comprises a high breakdown voltage MOSFET. The MOSFET includes a source region of a second conductivity type and a drain region of the second conductivity type formed apart from each other in a well region of a first conductivity type, a channel region formed between the source region and the drain region, a gate insulation film formed on the channel region, a LOCOS oxide film having a greater film thickness than the gate insulation film and formed adjacent to the gate insulation film, and a gate electrode formed across the gate insulation film and the LOCOS oxide film. | 03-12-2009 |
20090309146 | SEMICONDUCTOR DEVICE - A disclosed semiconductor device includes a MOS transistor that causes no problems concerning the formation of a thick gate insulating film and that is applicable to high withstand voltage devices. A drain region has a double diffusion structure including an N-drain region | 12-17-2009 |
20100193887 | Stress-Distribution Detecting Semiconductor Package Group And Detection Method Of Stress Distribution In Semiconductor Package Using The Same - A disclosed stress-distribution detecting semiconductor package group includes multiple stress-distribution detecting semiconductor packages each formed by resin-encapsulating a stress detecting semiconductor chip of the same size using an identical resin encapsulation structure. Each stress detecting semiconductor chip includes a piezoelectric element for stress detection and at least two electrode pads electrically connected to the piezoelectric element to measure an electrical property of the piezoelectric element. The piezoelectric elements of the stress detecting semiconductor chips are respectively disposed on the corresponding stress detecting semiconductor chips to be located at different positions from one another when superimposed on a single imaginary semiconductor chip plane having the same plane size as that of the stress detecting semiconductor chips. | 08-05-2010 |
20110185326 | NET LIST GENERATION METHOD AND CIRCUIT SIMULATION METHOD - Disclosed is a net list generation method of generating a net list based on layout data; stress map data indicating stress distribution on a silicon chip, the stress being generated due to packaging of the silicon chip; and standard curve data indicating a relationship between the stress and characteristic variation of a device. The method includes the steps of reading data items from the layout data; reading a value of stress at the position of the device from the stress map data; reading the characteristic variation of the device, the characteristic variation corresponding to the value of the stress, from the standard curve data corresponding to the device; and correcting characteristics of the device based on the characteristic variation. | 07-28-2011 |
20120061828 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device that is resin-sealed in a wafer level after a rewiring layer forming process and a metal post forming process forming a metal post are performed on a semiconductor substrate of the semiconductor device includes devices formed on the semiconductor substrate. Further all of the devices are disposed in respective positions other than positions overlapping a peripheral border of the metal post when viewed from a top of the semiconductor substrate. | 03-15-2012 |
20120235751 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip in which an internal circuit is formed, with the internal circuit having an output signal that fluctuates due to variation of fluctuation in electrical characteristics of multiple circuit elements constituting the internal circuit; a chip tab on which the semiconductor chip is mounted, with the semiconductor chip completely overlapping the chip tab and the circuit elements in the semiconductor chip arranged on the chip tab, and encapsulation resin within which the semiconductor chip and the chip tab are sealed. A horizontal surface area of the chip tab is smaller than that of the semiconductor chip, and a distance between a periphery of the chip tab and a periphery of the semiconductor chip is sufficient to cause stress exerted on the semiconductor chip by the encapsulation resin to be uniform across the horizontal surface area of the chip tab. | 09-20-2012 |
Patent application number | Description | Published |
20130272334 | SEMICONDUCTOR LASER MODULE AND METHOD FOR MANUFACTURING SAME - A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section. | 10-17-2013 |
20140211819 | SEMICONDUCTOR LASER APPARATUS AND METHOD FOR MANUFACTURING SAME - The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element. | 07-31-2014 |
20150087094 | METHOD OF MANUFACTURING A SEMICONDUCTOR LASER MODULE - A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section. | 03-26-2015 |
Patent application number | Description | Published |
20090000264 | Process and Apparatus for Producing Yarn and Gland Packing - A yarn production process for enabling a yarn formed by filling the interior of a tubular member configured by knitting or braiding a fibrous material with expanded graphite as a base material, to be produced in a state of a high productivity in order to enable the yarn to be actually used in an economical manner. The process of producing a yarn formed by filling the interior of a tubular member configured by knitting or braiding a fibrous material with expanded graphite, the process has: a fine cutting step of successively cutting an expanded graphite sheet which is continuously supplied in a state where the sheet has a predetermined width, to a small width along the width direction of the sheet; and a supplying and filling step of guiding and supplying a strip-like expanded graphite material which is produced by the fine cutting step, into the tubular member to be filled into the tubular member. | 01-01-2009 |
20090108534 | Yarn and Gland Packing - A yarn mainly configured by expanded graphite is improved to be so highly flexible that the expanded graphite does not protrude in a usual bending process, in order to prevent partial missing of the expanded graphite from occurring when the yarn is twisted or braided to produce a gland packing. A yarn | 04-30-2009 |
20100237570 | GASKET - A gasket having a concentrically waved metal sheet, i.e., a core member, which has a sheet of sealing-property layered and bonded on each of its opposite surfaces. The gasket has an enhanced adaptability of the sheet material and enables the thinner sheet to be used and at the same time makes it possible to ensure a stable sealing-property for a long period of time with a low to a high fastening-load applied. The metal sheet has valley portions, which were conventionally vacant gaps, and are filled with powdered sealing member to be embedded from the beginning. Therefore, the sheet at the valley portions of the metal sheet that conventionally could not be compressed with a low fastening-load applied can be compressed and even with the low fastening-load applied can secure a fastening surface-pressure over the entire surface. Further, since it is possible to suppress the deformation of the sheet in quantity, which was conventionally large, a sheet made of not only the high-fluidity material but also the low-fluidity material can be used as well as the thinner sheet. | 09-23-2010 |
20100264607 | GASKET - A gasket having a concentrically waved metal sheet, i.e., a core member, which has a PTFE sheet or an inorganic sheet of sealing-property layered and bonded on each of its opposite surfaces. The gasket makes it possible to ensure a stable sealing-property for a long period of time with a low to a high fastening-load applied. The metal sheet has valley portions, which were conventionally vacant gaps, and are filled with powdered sealing member to be embedded from the beginning. Therefore, the PTFE sheet or the inorganic sheet at the valley portions of the metal sheet that conventionally could not be compressed with a low fastening-load applied is compressed and even with the low fastening-load applied can secure a fastening surface-pressure over the entire surface. Further, since it is possible to suppress the deformation of the sheet in quantity, which was conventionally large, the PTFE sheet or the inorganic sheet each of low-fluidity are arranged so as not to be broken with a high fastening-load applied and the thinner PTFE sheet or the thinner inorganic sheet can be used. | 10-21-2010 |
20110162338 | YARN - A yarn which is configured by using expanded graphite and PTEE is provided while improving the yarn so that the expanded graphite functioning as a core member is not exposed and it can be simply produced. | 07-07-2011 |
Patent application number | Description | Published |
20100016634 | METHOD FOR STABILIZING CARBODIIMIDE DERIVATIVE AND STABILIZED COMPOSITION THEREOF - Disclosed is a method for stabilizing a carbodiimide derivative (1) which is a condensing agent useful for production of general synthetic chemical products. Also disclosed is a stabilized composition of the carbodiimide derivative. The method is characterized in that the carbodiimide derivative (1) is handled in an atmosphere wherein the concentration of molecular oxygen in the gas phase within a container is set at not more than 3% by volume and/or in the co-presence of at least one compound selected from the group consisting of antioxidants, N-oxyl compounds, sulfur compounds, amines and Lewis acids. | 01-21-2010 |
20110136191 | Processes for producing coenzyme Q10 - The present invention relates to a process for producing reduced coenzyme Q | 06-09-2011 |
20110263906 | METHOD OF PRODUCING REDUCED COENZYME Q10 CRYSTALS WITH EXCELLENT HANDLING PROPERTIES - The present invention provides a method of producing reduced coenzyme Q | 10-27-2011 |
20120201802 | METHOD FOR PRODUCING REDUCED COENZYME Q10, METHOD FOR STABILIZING SAME, AND COMPOSITION COMPRISING SAME - The present invention aims to provide a component having not only an ability to reduce oxidized coenzyme Q10 and an ability to stabilize reduced coenzyme Q10, but also nutrient, flavor, broad utility and the like, and a utilization method thereof. The present invention relates to a safe and convenient method of producing reduced coenzyme Q10, including reducing oxidized coenzyme Q10 by using, as a component derived from a naturally-occurring substance, which is safe for the body, any one or more components selected from the group consisting of an acerola extract, a tea extract, a rosemary extract, a pine bark extract and a | 08-09-2012 |
20120207731 | METHOD FOR PRODUCING REDUCED COENZYME Q10, METHOD FOR STABILIZING SAME, AND COMPOSITION COMPRISING SAME - An object of the present invention is to provide a substance characterized by ability to reduce oxidized coenzyme Q10 and ability to stabilize reduced coenzyme Q10, which contains nutrients, has a favorable taste, and is excellent in general versatility, and a method for using the same. The present invention relates to a method for producing reduced coenzyme Q10 comprising reducing oxidized coenzyme Q10 with a particular amino acid. The present invention also relates to a method for stabilizing reduced coenzyme Q10 in the presence of a particular amino acid and a composition stabilized by the method. | 08-16-2012 |
20130142767 | COMPOSITION CONTAINING REDUCED COENZYME Q10, AND MANUFACTURING AND STABILISING METHODS THEREFOR - The present invention relates to a method of producing reduced coenzyme Q10, including reducing oxidized coenzyme Q10 using a reducing agent in terpenes that can highly dissolve oxidized coenzyme Q10 and reduced coenzyme Q10 in the co-existence of at least one kind of additive selected from the group consisting of alcohols, water, a surfactant and diacylglycerol. In addition, the present invention relates to a composition comprising terpenes, a reducing agent, reduced coenzyme Q10 and at least one kind selected from the group consisting of alcohols, water, a surfactant and diacylglycerol, and a method of stabilizing reduced coenzyme Q10 comprising preparing the composition. | 06-06-2013 |
20140120073 | REDUCED COENZYME Q10 CRYSTAL HAVING EXCELLENT STABILITY - With respect to reduced coenzyme Q10, there has been no report about the presence of crystal polymorphism, and it has been considered that a conventionally obtained crystal form is only one form. The present invention relates to a reduced coenzyme Q10 crystal having an endothermic peak indicating melting at 54±2° C. during temperature rise at a rate of 5° C./min by differential scanning calorimetry (DSC), and/or to a reduced coenzyme Q10 crystal showing characteristic peaks at diffraction angles (2θ±0.2°) of 11.5°, 18.2°, 19.3°, 22.3°, 23.0° and 33.3° by powder X-ray (Cu—Kα) diffraction. The crystal form is a novel reduced coenzyme Q10 crystal which has a higher melting point and a lower solubility in a solvent, and is more excellent in stability than the conventionally known reduced coenzyme Q10 crystal. | 05-01-2014 |