Hsu, Chung-Ho City
I-Ta Hsu, Chung-Ho City TW
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20080314559 | HEAT EXCHANGE STRUCTURE AND HEAT DISSIPATING APPARATUS HAVING THE SAME - A heat exchange structure is connected to a dual water cooling system and a heat dissipating apparatus has the heat exchange structure. The heat exchange structure includes a box as a main body, and the box includes a first cavity and a second cavity. The first cavity and the second cavity are interconnected with separate water cooling systems, wherein the first cavity includes a first chamber, and the first cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to the first chamber. The second cavity includes a second chamber, and the second cavity has a water inlet pipeline and a water outlet pipeline, both interconnected to a second chamber. A heat conducting plate is disposed at a position that connects the first cavity and the second cavity for providing a heat conducting path of the first cavity and the second cavity. | 12-25-2008 |
20090194260 | Cooling apparatus for graphic cards - A cooling apparatus for graphic cards is used for two graphic cards that are disposed in parallel. There is a receiving space between the two graphic cards. The cooling apparatus for graphic cards includes a first base, a first cooler, a plurality of first heat pipes, a second base, a second cooler, and a plurality of second heat pipes. The first base is located on the first heat-emitting element of the first graphic card. One end of the first cooling pipe extends through the first base, and the second end of the first cooling pipe extends through the first cooler. The second base is located on the second heat-emitting element of the second graphic card. Thereby, the cooling apparatus for graphic cards can be applied to a plurality of graphic cards. The heat is simultaneously exhausted for both cards and the space is reduced. | 08-06-2009 |
Kuo-Ching "steven" Hsu, Chung-Ho City TW
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20090050356 | Capacitors with Insulating Layer Having Embedded Dielectric Rods - A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods. | 02-26-2009 |
Steven Hsu, Chung-Ho City TW
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20080246147 | Novel substrate design for semiconductor device - A novel design and method of fabricating a semiconductor device. In a preferred embodiment, the present invention is a flip chip package including a BT substrate. On the side of the substrate facing the die, thin traces are formed of an enhanced conductive material. Conductive bumps such as eutectic solder balls are then mounted on the traces, and the die mounted to the bumps. The die then packaged and mounted to a printed circuit board using, for example, a ball grid array. | 10-09-2008 |
20090011543 | Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Die Separation Using Dry Etching - An improved Wafer-Level Chip-Scale Packaging (WLCSP) process is described that includes forming a plurality of conductive pillars on a first surface of a semiconductor wafer. One or more grooves are dry etched into the first surface of the semiconductor wafer, where the grooves define at least one boundary between each of a plurality of die within the semiconductor wafer. A layer of encapsulating material is deposited over the first surface. A recess is then cut in each of the grooves through the encapsulating material, where the cutting leaves a piece of semiconductor material on the second surface of the semiconductor wafer. The second surface is then ground to remove the piece of semiconductor material, where the removal of this material separates the plurality of die. | 01-08-2009 |
Wu-Hsien Hsu, Chung-Ho City TW
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20100261532 | Bidirectional communication certification mechanism - The present invention is to provide a bidirectional communication certification mechanism, which comprises the steps of receiving a call-in message transmitted from a phone of a user, capturing a phone number and a temporary password transmitted from the phone, saving the phone number and temporary password into a number database, receiving and reading a game account, a game password, the phone number and the temporary password included in a login request message transmitted from a terminal device of the user, comparing the same with user data stored in a user database, and allowing the terminal device to finish a login procedure when the phone number and temporary password are existed in the user database. Since the phone number and the temporary password are preset by the user, it will ensure the terminal device to safely login a game server and efficiently lower down the stolen risk of the game account. | 10-14-2010 |
Yar-Sun Hsu, Chung-Ho City TW
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20080198843 | Method and apparatus for switching data in communication system - A method and apparatus for switching data in communication system which comprises of mainly a conversion circuit to receive source data possessing real coding dimension and covert it to converted data possessing tolerable coding dimension; judgment bit is set in the converted data to designate the data as source data or not. Later on, shift circuit is used to shift the converted data in certain amount so as to generate a shifted data; meanwhile, the lowest bit and highest bit of shifted data are used to start acquiring real coding dimension to be used respectively as a first data and a second data, or by changing the pattern of acquiring the first data, then the highest bit minus the real coding dimension bit as the starting bit of the first data, and acquiring the real coding dimension from the side of the lowest bit. Finally, a comparison and selection circuit is used to compare the corresponding judgment bit in the first and the second data and to output an output data, wherein output data is source data with the above-mentioned amount of shift. | 08-21-2008 |
20080198938 | Method and apparatus for switching data in communication system - A method and apparatus for switching data in communication system which comprises of mainly a conversion circuit to receive the source data possessing in a real coding dimension and covert it to converted the data possessing in a tolerable coding dimension; the judgment bits are set in the converted data to designate the data as source data or not. Later on, shifter circuit is used to shift the converted data in certain amount and generates a shifted data; meanwhile, the right side and left side of shifted data are used to start acquiring the real coding dimension to be used respectively as a first data and a second data. Finally, a comparison and selection circuit is used to compare the corresponding judgment bits in the first and the second data and to output an output data, wherein output data is source data with the above-mentioned amount of shift. | 08-21-2008 |