Shigehisa
Shigehisa Aoki, Saga JP
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20160135946 | PATCH-TYPE ARTIFICIAL SKIN PREPARATION - The present invention addresses the problem of providing an artificial skin preparation which requires no suturing or the like when treating a wound area with a dried collagen vitrigel membrane material as an artificial skin, and also is less likely to cause contamination or the like with an exudate, and is free from the risk of secondary damage by replacement thereof. The artificial skin preparation for solving the problem includes at least an adhesive film, an adhesion-preventing sheet, and a dried collagen vitrigel membrane material in this order, and is characterized in that the adhesion-preventing sheet has a sufficient size for preventing the adhesion of the collagen vitrigel membrane to an adhesive layer of the adhesive film and is attached to the adhesive layer of the adhesive film at a position corresponding to the position of the dried collagen vitrigel membrane material, and the dried collagen vitrigel membrane material is made easily detachable from the adhesion-preventing sheet when the adhesive film is peeled off while fixing and holding the dried collagen vitrigel membrane material on the surface of the adhesion-preventing sheet during attachment. | 05-19-2016 |
Shigehisa Inoue, Yokkaichi JP
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20150380419 | METHOD OF SELECTIVELY DEPOSITING FLOATING GATE MATERIAL IN A MEMORY DEVICE - Undesirable metal contamination from a selective metal deposition process can be minimized or eliminated by employing a first material layer on a bevel and a back side of a substrate, while providing a second material layer only on a front side of the substrate. The first material layer and the second material layer are selected such that a selective deposition process of a metal material provides a metal material portion only on the second material layer, while no deposition occurs on the first material layer or isolated islands of the metal material are formed on the first material layer. Any residual metal material can be removed from the bevel and the back side by a wet etch to reduce or prevent metal contamination from the deposited metal material. | 12-31-2015 |
20160118275 | SUBSTRATE LIQUID PROCESSING APPARATUS - Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to supply a processing liquid to the substrate held by the substrate holding unit; a nozzle arm configured to hold the processing liquid nozzle; and an arm cleaning tank configured to immerse the entire surface of the nozzle arm in a cleaning liquid so as to clean the nozzle arm. | 04-28-2016 |
Shigehisa Inoue, Tokyo JP
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20150079756 | Semiconductor Device and Fabrication Method Thereof - The semiconductor device fabrication method of the present invention includes: laminating a plurality of amorphous silicon films on a semiconductor substrate, forming through-holes that pass through the plurality of amorphous silicon films, and subjecting the plurality of amorphous silicon films | 03-19-2015 |
Shigehisa Inoue, Kumamoto JP
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20140373877 | LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD - Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential. | 12-25-2014 |
20150114560 | SUBSTRATE PROCESSING APPARATUS AND LIQUID SUPPLY APPARATUS - A substrate processing includes a holding mechanism, a plurality of nozzles, and an adjusting unit. The holding mechanism rotatably holds a substrate. The nozzles are disposed to be arranged in a diametric direction of the substrate held by the holding mechanism and supply a chemical liquid to the substrate. The adjusting unit supplies a chemical liquid of a first temperature and a chemical liquid of a second temperature to each of the plurality of nozzles in a predetermined ratio, in which the second temperature is higher than the first temperature. The adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to a nozzle disposed at an outer circumference side of the substrate than to a nozzle disposed at a center side of the substrate. In addition, the adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to the nozzle disposed at the outer circumference side of the substrate than to the nozzle disposed at the center side of the substrate. Each of the nozzles supplies a chemical liquid in which the supplied chemical liquid of the first temperature and the supplied chemical liquid of the second temperature are mixed with each other. | 04-30-2015 |
20150114561 | LIQUID PROCESSING APPARATUS - A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit. | 04-30-2015 |
Shigehisa Kawatsuru, Yokosuka-Shi JP
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20130076262 | Lighting Device, Lighting Equipment, and Lighting Control System - According to an embodiment, a lighting device includes a first to fourth light sources, a control unit, and an operation unit. The first to fourth light sources have a different combination of a relatively high/low correlated color temperature and a relatively high/low general color rendering index from each other. The control unit controls at least two of a light flux, the correlated color temperature, and the general color rendering index of each of the light sources. The operation unit designates at least one of the correlated color temperature and the general color rendering index of each of the light sources, and executes spectral distribution with the designated correlated color temperature, or general color rendering index. | 03-28-2013 |
20130247352 | Method for Designing Indoor Lighting - A method for designing indoor lighting includes disposing a first luminaire on a ceiling surface that forms an indoor space, the first luminaire having a luminous intensity distribution characteristic that a luminous flux over a range of luminous intensity distribution angles no smaller than 90 degrees but no greater than 120 degrees with respect to a vertically downward direction, which represents 0 degrees, is 20% of a luminous flux of the luminaire or greater and a luminous flux over a range of luminous intensity distribution angles no smaller than 60 degrees but smaller than 90 degrees is 20% of the luminous flux of the luminaire or smaller; and disposing a second luminaire in the indoor space, the second luminaire illuminating a wall surface present in a region corresponding to the luminous intensity distribution angles of light from the first luminaire no less than 60 degrees but smaller than 90 degrees. | 09-26-2013 |
20130250554 | LUMINAIRE - According to one embodiment, a luminaire is provided which can enhance the feeling of brightness of a space and can reduce glare. The luminaire includes an equipment mounted on a ceiling surface. The equipment includes a light source and a light control unit. When an amount of light emitted outside from the equipment is an equipment luminous flux, and a direction right under the equipment has a luminous intensity distribution angle of 0°, the light control unit controls to cause a luminous flux falling within a range of a luminous intensity distribution angle of 90° to 120° to be 20% or more of the equipment luminous flux and to cause a luminous flux falling within a range of a luminous intensity distribution angle of 60° to 90° to be 20% or less of the equipment luminous flux. | 09-26-2013 |
20130250586 | Lighting Device - A lighting device according to an embodiment includes a light source module, a thermal radiation member, and a fixing member. The light source module is a module mounted with a light-emitting element such as an LED (Light Emitting Diode) on the inside and including the light-emitting element as a light source. In the thermal radiation member, the light source module is set. The thermal radiation member radiates heat generated from the light source module. A fixing member is screwed on a sidewall of the thermal radiation member in a state in which the fixing member surrounds the light source module and the thermal radiation member. | 09-26-2013 |
Shigehisa Kawatsuru, Kanagawa JP
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20140042911 | LIGHTING CONTROL SYSTEM AND LIGHTING CONTROL METHOD - According to one embodiment, a lighting control system includes a plurality of luminaire, a sensor device, a luminance sensor, and a lighting control unit. The luminaires are set in a lighting space. The sensor device detects presence of a person in the lighting space. The luminance sensor detects indirect luminance in a predetermined position in the lighting space by the luminaire. The lighting control unit subjects the luminaire to lighting control such that the indirect luminance detected by the luminance sensor does not fall below a predetermined value in a position where the sensor device detects presence of the person. | 02-13-2014 |
Shigehisa Kawatsuru, Yokosuka JP
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20140042914 | LIGHTING CONTROL SYSTEM AND LIGHTING CONTROL METHOD - According to one embodiment, a lighting control unit turns on luminaires corresponding to a presence area among four detection areas adjacent to one another in a predetermined direction and a crossing direction. If there is one presence area among the four detection areas, the lighting control unit relatively reduces the brightness of the luminaires corresponding to remaining three absence areas. If there are two presence areas among the four detection areas, the lighting control unit relatively reduces the brightness of the luminaires on a side adjacent to the presence areas among the luminaires corresponding to the remaining two absence areas and turns off the remaining other luminaires. If there are three presence areas among the four detection areas, the lighting control unit turns off the luminaires corresponding to the remaining one absence area. | 02-13-2014 |
20140042915 | LIGHTING CONTROL SYSTEM AND LIGHTING CONTROL METHOD - Plural luminaires are installed in a lighting space surrounded by a wall part. A sensor equipment detects existence or nonexistence of a person in the lighting space. If existence of a person in the lighting space is detected, the sensor equipment detects a direction of the person. The sensor equipment detects a distance between the wall part positioned in front of the direction of the person and the person. A lighting control unit selectively switches between a first control for performing lighting control of the luminaires to illuminate the wall part positioned in front of the direction of the person if the detected distance is a specified distance or less, and a second control for performing lighting control of the luminaires to reduce brightness at a place as the place becomes farther from a position of the person if the detected distance is larger than the specified distance. | 02-13-2014 |
20140300277 | LIGHTING CONTROL SYSTEM AND LIGHTING CONTROL METHOD - Plural luminaires are installed in a lighting space surrounded by a wall part. A sensor equipment detects existence or nonexistence of a person in the lighting space. If existence of a person in the lighting space is detected, the sensor equipment detects a direction of the person. The sensor equipment detects a distance between the wall part positioned in front of the direction of the person and the person. A lighting control unit selectively switches between a first control for performing lighting control of the luminaires to illuminate the wall part positioned in front of the direction of the person if the detected distance is a specified distance or less, and a second control for performing lighting control of the luminaires to reduce brightness at a place as the place becomes farther from a position of the person if the detected distance is larger than the specified distance. | 10-09-2014 |
Shigehisa Kawatsuru, Kanagawa-Ken JP
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20130070460 | LIGHTING APPARATUS - A lighting apparatus according to an exemplary embodiment includes a light source including a light emitting element, a reflection portion main body that is formed of an incombustible resin and is provided at an emission side of the light source, and a reflection layer that is formed of resin substantially not containing halogen or phosphorus and is provided on a surface of the reflection portion main body. | 03-21-2013 |
Shigehisa Kurogo, Chigasaki JP
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20100127787 | VOLTAGE CONTROL TYPE TEMPERATURE COMPENSATION PIEZOELECTRIC OSCILLATOR - A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit. | 05-27-2010 |
Shigehisa Motowaki, Mito JP
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20090197375 | Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them - A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body. | 08-06-2009 |
20100187678 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a structure of a semiconductor device, a Si chip and a metal leadframe are jointed by metallic bond via a porous joint layer made of high conductive metal, having a three-dimensional network structure and using Ag as a bonding material, and a film containing Zn oxide or Al oxide is formed on a surface of a semiconductor assembly contacting to a polymer resin. In this manner, by the joint with the joint layer having the porous structure mainly made of Ag, thermal stress load of the Si chip can be reduced, and fatigue life of the joint layer itself can be improved. Besides, since adhesion of the polymer resin to the film can be enhanced by the anchor effect, occurrence of cracks in a bonding portion can be prevented, so that a highly-reliable Pb-free semiconductor device can be provided. | 07-29-2010 |
20110223720 | FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE - A fabrication method for a resin encapsulated semiconductor device includes the steps of: (1) die-bonding a semiconductor device to a first electrical connection metallic terminal of a wiring substrate; (2) electrically connecting an electrode of the semiconductor device and a second electrical connection metallic terminal of the wiring substrate via an electrical connector; (3) surface treating such an assembly by applying a solution to a surface of the assembly and baking the applied solution; and (4) transfer-molding an insulating encapsulating resin onto the surface-treated assembly. | 09-15-2011 |
20110290863 | SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTOR CHIP - An object of the present invention is to provide a composition of a sintering Ag paste which can metallically bond to a nonprecious metal member with high strength as well as to a precious metal member, in a sintering Ag paste which metallically bonds to a metal at a low temperature, and to provide a bonding method to obtain a joint part having high strength. The sintering Ag paste is a material containing a solution of an organic silver complex that is easily decomposed by heat regardless of an atmosphere. Furthermore, the bonding method includes: metallizing a face of a nonprecious metal with Ag in a non-oxidizing atmosphere in a step prior to sintering Ag particles; and then sintering the Ag particles in an oxidizing atmosphere. | 12-01-2011 |
20120141818 | METAL-RESIN COMPOSITE, METHOD FOR PRODUCING THE SAME, BUSBAR, MODULE CASE, AND RESINOUS CONNECTOR PART - Provided are a metal-resin composite having excellent adhesive strength, a method for producing the same, a busbar, a module case, and a resinous connector part. The metal-resin composite comprises a metallic member | 06-07-2012 |
20130071971 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a structure of a semiconductor device, a Si chip and a metal leadframe are jointed by metallic bond via a porous joint layer made of high conductive metal, having a three-dimensional network structure and using Ag as a bonding material, and a film containing Zn oxide or Al oxide is formed on a surface of a semiconductor assembly contacting to a polymer resin. In this manner, by the joint with the joint layer having the porous structure mainly made of Ag, thermal stress load of the Si chip can be reduced, and fatigue life of the joint layer itself can be improved. Besides, since adhesion of the polymer resin to the film can be enhanced by the anchor effect, occurrence of cracks in a bonding portion can be prevented, so that a highly-reliable Pb-free semiconductor device can be provided. | 03-21-2013 |
20130161807 | METHOD FOR JOINTING METAL MEMBER AND RESIN AND JOINTED BODY THEREOF - Reliability is improved by improving adhesiveness, crack resistance, and moisture resistance of a metal member-resin jointed body by enhancing adhesiveness between the metal member and the resin. | 06-27-2013 |
Shigehisa Motowaki, Hitachi JP
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20110024156 | ENAMELED INSULATED WIRE AND MANUFANTURING METHOD THEREOF - There is provided an enameled insulated wire, which includes: a metal conductor; an intermediate layer around the metal conductor, the intermediate layer containing metal oxide particles, the metal oxide particles including at least one oxide selected from a group consisting of zinc oxides, tin oxides, compound oxides of zinc and the metal constituent of the metal conductor, and compound oxides of tin and the metal constituent of the metal conductor, diameter of the metal oxide particles being predominantly from 1 to 50 nm; and an insulation coating around the intermediate layer. | 02-03-2011 |
Shigehisa Nakayama, Shinshiro-Shi JP
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20110170912 | TONER CARTRIDGE AND ITS RECYCLING METHOD (as amended) - The present invention provides a toner cartridge and its recycling method in which a clearance due to stack of the housing and the lid can reliably be sealed so that toner leakage can be prevented. A toner cartridge which is set in an image forming apparatus to feed toner to the image forming apparatus includes a housing having a toner containing portion for containing toner therein, and a lid for covering the toner containing portion of the housing. A stack portion where the housing and the lid are stacked on each other is sealed by a sealing member having first and second adhesive materials provided on both-side surfaces of a base material with the first adhesive material stuck on an outer peripheral surface of the stack portion and with a release paper stuck on the second adhesive material. | 07-14-2011 |
Shigehisa Omatsu, Chiba CN
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20150225992 | MONEY STORAGE DEVICE AND MONEY STORAGE DEVICE MANAGING SYSTEM - To further strengthen the security function of a money storage device, a money storage device which stores collected money is configured to: receive a locked state releasing instruction signal that instructs releasing of a locked state, from a money storage device managing server which manages the money storage device, via a communication network and a repeater by using wireless communication; and release the locked state in response to the reception of the locked state releasing instruction signal. | 08-13-2015 |
Shigehisa Oonakahara, Kyoto JP
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20120025260 | SEMICONDUCTOR DEVICE - A semiconductor device includes a lead frame, a first semiconductor element mounted on the lead frame, a frame-like member formed on the lead frame, surrounding the first semiconductor element, and a protective resin filling a space surrounded by the frame-like member. The lead frame has an external terminal protruding outside the frame-like member. The external terminal has a barrier portion which is located at an end portion thereof protruding from the frame-like member and rises from a top surface of the external terminal. | 02-02-2012 |
20120025361 | SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame. | 02-02-2012 |
Shigehisa Sakahara, Osaka JP
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20110170864 | INTERFACE DEVICE, DEMULTIPLEXING METHOD, AND MULTIPLEXING METHOD - An interface device for demultiplexing, from a first frame in a transport network, a plurality of second frames multiplexed into the first frame is provided. The interface device includes an extractor configured to extract a plurality of data groups to constitute the first frame, and a second frame generator configured to create the second frames based on the plurality of data groups extracted by the extractor. | 07-14-2011 |
Shigehisa Sakamoto, Fujisawa-Shi JP
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20100091608 | HORIZONTAL MIXER - An easily cleanable horizontal mixer. The horizontal mixer ( | 04-15-2010 |
20140245703 | BREAD CONVEYING APPARATUS AND BREAD SLICING APPARATUS - A bread packaging apparatus for packaging bread in a bag, includes a first urging unit that comes into contact with a loaf of bread and conveys the loaf of bread along a conveying path; and a control unit for controlling a speed of the first urging unit. The control unit controls the speed of the first urging unit such that the speed when the first urging unit comes into contact with the loaf of bread is different from the speed when the first urging unit conveys the loaf of bread. | 09-04-2014 |
Shigehisa Suzuki, Niigata JP
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20100208307 | PROCESSOR, IMAGE FORMING SYSTEM AND COMPUTER READABLE MEDIUM - A processor is provided, the processor including: an obtaining unit that obtains abnormality information related to an abnormality from an image forming device in which the abnormality occurs; an abnormality information storing unit that stores the abnormality information obtained by the obtaining unit as history information; a failure position information storing unit that stores failure position information for each phenomenon related to the abnormality; an extracting unit that extracts the failure position information corresponding to the latest abnormality information and abnormality information similar to the latest abnormality information among the abnormality information stored in the abnormality information storing unit from the failure position information storing unit; and an output unit that outputs an extracted result extracted by the extracting unit as specific deciding information of a cause related to the occurring abnormality. | 08-19-2010 |
Shigehisa Tanaka, Koganei JP
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20080247433 | NITRIDE SEMICONDUCTOR LASERS AND ITS MANUFACTURING METHOD - A nitride semiconductor laser which features low resistance and high reliability. A buried layer is formed by selective growth and the shape of a p-type cladding layer is inverted trapezoidal so that the resistance of the p-type cladding layer and that of a p-type contact layer are decreased. For long-term reliability of the laser, the buried layer is a high-resistance semi-insulating layer which suppresses increase in leak current. | 10-09-2008 |
20090141763 | SEMICONDUCTOR LASER - There is disclosed a Be-containing II-VI group semiconductor laser that has a laminated structure formed on an InP substrate to continuously emit at room temperature without crystal degradation. A basic structure of the semiconductor laser is formed over the InP substrate by use of a lattice-matched II-VI group semiconductor including Be. An active layer and cladding layers are formed to be a double heterostructure with a type I band lineup, in order to increase the efficiency for injecting carriers into the active layer. The active layer and the cladding layers are also formed to enhance the light confinement to the active layer, in which the Mg composition of the p-type cladding layer is set to Mg<0.2. | 06-04-2009 |
20100150194 | NITRIDE SEMICONDUCTOR OPTICAL ELEMENT AND MANUFACTURING METHOD THEREOF - In an InGaN-based nitride semiconductor optical device having a long wavelength (440 nm or more) equal to or more than that of blue, the increase of a wavelength is realized while suppressing In (Indium) segregation and deterioration of crystallinity. In the manufacture of an InGaN-based nitride semiconductor optical device having an InGaN-based quantum well active layer including an InGaN well layer and an InGaN barrier layer, a step of growing the InGaN barrier layer includes: a first step of adding hydrogen at 1% or more to a gas atmosphere composed of nitrogen and ammonia and growing a GaN layer in the gas atmosphere; and a second step of growing the InGaN barrier layer in a gas atmosphere composed of nitrogen and ammonia. | 06-17-2010 |
20100328753 | Optical module, integrated semiconductor optical device and manufacturing method thereof - An integrated semiconductor optical device and an optical module capable of the high-speed and large-capacity optical transmission are provided. In an integrated semiconductor optical device in which a plurality of optical devices buried with semi-insulating semiconductor materials are integrated on the same semiconductor substrate and an optical module using the integrated semiconductor optical device, configurations (material and electrical characteristics) of the buried layers are made different for each of the optical devices. | 12-30-2010 |
20110096383 | LIGHT BEAM SCANNING IMAGE PROJECTION APPARATUS - The object of the invention included in the present application is to automatically prevent the deterioration of the image even when the image quality of the projected image is deteriorated due to the replacement of the light source or the like. The following light beam scanning image projection apparatus is one means for achieving the object. In the light beam scanning image projection apparatus including a plurality of light sources which emit the light beams of respectively different wavelengths, a driving section which modulates the intensity of each light beam in accordance with the image signal, the light axis alignment means which aligns the light axes of each light beam, and scanning means which scans the light beams, the light axis alignment means includes: a plurality of optical elements; and an adjusting section which adjusts at least one of a position and a gradient of at least one of the optical elements, and the light beam scanning image projection apparatus further includes: detecting means which detects a shift between a spot center of each light beam and a center reference point; and position correction means which controls the adjusting section based on a detection result in the detecting means to adjust at least one of the position and the gradient of at least one of the optical elements of the light axis alignment means, thereby aligning the light axes of each light beam. | 04-28-2011 |
Shigehisa Todoko, Minato-Ku JP
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20110100808 | CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME - Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule. | 05-05-2011 |
Shigehisa Todoko, Tokyo JP
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20100326823 | CYLINDRICAL SPUTTERING TARGET - To provide a cylindrical sputtering target, whereby cracking during sputtering can be remarkably reduced. | 12-30-2010 |
20110240467 | CYLINDRICAL SPUTTERING TARGET, AND METHOD FOR MANUFACTURING SAME - Provided is a cylindrical sputtering target which attains a high production yield in a film-forming process even when a film is formed by sputtering with a long cylindrical sputtering target constituted by a plurality of cylindrical target materials. | 10-06-2011 |
20160141159 | CYLINDRICAL SPUTTERING TARGET AND PROCESS FOR PRODUCING THE SAME - Provided is a cylindrical ceramic sputtering target, which significantly reduces the occurrence of a crack, a chip, extraordinary discharge and a nodule. | 05-19-2016 |
Shigehisa Uchiyama, Chiba City JP
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20110086429 | METHODS AND DEVICES FOR DETECTING OZONE AND CARBONYL-CONTAINING COMPOUNDS - Methods and devices are provided for detecting the presence of both ozone and carbonyl-containing compounds in air samples. Method and device for detecting the presence of ozone and carbonyl-containing compounds in an air sample, the method comprising: (a) contacting an air sample with an ozone-reactive adsorbent wherein if ozone is present in the air sample, the ozone reacts with the ozone-reactive adsorbent to form an aldehyde product; (b) contacting the air sample from Step (a) further with a carbonyl-reactive adsorbent wherein if a carbonyl-containing compound is present in the air sample, the carbonyl-containing compound reacts with the carbonyl-reactive adsorbent to form a first hydrazone product; (c) eluting with a solvent from the carbonyl-reactive adsorbent into the ozone-reactive adsorbent, wherein any aldehyde product of step (a) forms a second hydrazone product; and (d) analyzing eluate from Step (c) for presence of hydrazone products formed in Step (b) and Step (c). | 04-14-2011 |
Shigehisa Ueda, Tokyo JP
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20130010566 | KNEADING APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION - The kneading apparatus | 01-10-2013 |
20130015607 | COMPACT PRODUCTION APPARATUS AND METHOD FOR PRODUCING COMPACTAANM Ueda; ShigehisaAACI TokyoAACO JPAAGP Ueda; Shigehisa Tokyo JPAANM Noda; KazuoAACI TokyoAACO JPAAGP Noda; Kazuo Tokyo JP - A compact production apparatus includes a main body having at least one molding die in which a cavity is formed, a first flow passage member for supplying powder into the cavity, an upper compaction member having an upper punch surface, a lower compaction member having a lower punch surface which is allowed to compress the powder in the cavity in cooperation with the upper punch surface to thereby obtain a compact of the powder, and a second flow passage member from which the compact separated from the cavity is to be discharged. Further, at least 80% or more of a total surface area of an upper surface of the main body, an inner circumferential surface defining the cavity, an inner circumferential surface of the first flow passage member, an inner circumferential surface of the second flow passage member, the upper punch surface of the upper compaction member and the lower punch surface of the lower compaction member is made of a nonmetallic material. | 01-17-2013 |
Shigehisa Ueda, Shinagawa-Ku JP
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20120291631 | DEGASSING APPARATUS - A degassing apparatus | 11-22-2012 |
20120318002 | COOLING APPARATUS AND COOLING METHOD - A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of −40 to 0° C. to the resin composition. | 12-20-2012 |
20120318896 | PULVERIZING APPARATUS AND PULVERIZING METHOD - A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers. | 12-20-2012 |
Shigehisa Wada, Otsu-Shi JP
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20110009503 | FRACTIONATION APPARATUS - The present invention discloses a fractionation device used for proteins and/or peptides, which has any of the following features: | 01-13-2011 |
Shigehisa Wada, Shiga JP
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20090191105 | Fractionation Apparatus - The present invention discloses a fractionation device used for proteins and/or peptides, which has any of the following features: | 07-30-2009 |
20090275874 | Absorbent and Column for Extracorporeal Circulation - The present invention provides an absorbent which can remove cells present in blood including activated leukocytes such as granulocytes and monocytes, and cancer cells as well as can remove cytokines which facilitate the activation of the remaining cells, and further has no concern for pressure loss and has high configuration stability. That is, the present invention provides an absorbent which absorbs the granulocytes and the monocytes in blood, an absorbent for cancer therapy which absorbs an immunosuppressive protein and an absorbent having a bilayer structure of a net and a nonwoven fabric, having a zeta potential of −20 mV or more, as well as a blood circulation column containing any of the absorbents filled therein. | 11-05-2009 |
Shigehisa Watanabe, Shizuoka-Shi JP
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20140037934 | COMPOSITE MATERIAL FOR HEAT DISSIPATING PLATE AND METHOD OF PRODUCTION OF SAME - There is provided a composite material for a heat dissipating plate which achieves both a high thermal conductivity and a low coefficient of thermal expansion and has a performance satisfactory as a heat dissipating plate and a method of production of a composite material which can produce the composite material at a low cost. For this reason, powder metallurgy is used to produce the composite material for a heat dissipating plate. The composite material for a heat dissipating plate which is fabricated by this method of production contains an aluminum alloy and silicon carbide. The particles of silicon carbide are in contact with each other. | 02-06-2014 |
Shigehisa Watanabe, Yamanashi JP
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20140367710 | LED MODULE - The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation. The LED module includes: a circuit board; a plurality of LED dies that are mounted on one surface of a circuit board as bare chips and constitute a series circuit; an FET die that is mounted on the one surface of a circuit board as bare chips and controls a current flowing through the plurality of LED dies; and a constant current circuit that is mounted on the one surface of a circuit board and is series-connected to the series circuit. The constant current circuit includes the FET die. | 12-18-2014 |
Shigehisa Watanabe, Fujikawaguchiko-Machi, Yamanashi JP
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20150382420 | LED DRIVE CIRCUIT - The purpose of the present invention is to provide an LED drive circuit that is capable of ameliorating insufficient lighting and improving power utilization efficiency. This LED drive circuit is an LED drive circuit wherein the number of LEDs that are turned on varies in accordance with the voltage of a commercial alternating-current power supply, the LED drive circuit being characterized by having an LED row in which multiple LEDs are connected in series, a current detection resistor for detecting a current that flows in the LED row, a bypass circuit that is connected to an intermediate connection part of the LED row, and a current-limiting circuit that is connected to an end of the LED row, wherein the bypass circuit includes a first current-limiting component, the current-limiting circuit includes a second current-limiting component, the first current-limiting component is controlled on the basis of a voltage across the ends of the current detection resistor or a voltage that is obtained by dividing the voltage across the ends of the current detection resistor, and the second current-limiting component is controlled by the divided voltage that is obtained by dividing the current detection resistor. | 12-31-2015 |
Shigehisa Yamamoto, Tokyo JP
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20160003889 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR APPARATUS, AND ENERGIZATION TEST APPARATUS - The present invention provides a method for manufacturing silicon carbide semiconductor apparatus including a testing step of testing a PN diode for the presence or absence of stacking faults in a relatively short time and an energization test apparatus. The present invention sets the temperature of a bipolar semiconductor element at 150° C. or higher and 230° C. or lower, causes a forward current having a current density of 120 [A/cm | 01-07-2016 |
Shigehisa Yamamoto, Otake-Shi JP
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20100193972 | SPHERICAL SINTERED FERRITE PARTICLES, RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION COMPRISING THEM AND SEMICONDUCTOR DEVICES PRODUCED BY USING THE SAME - A resin composition for semiconductor encapsulation having good moldability, of which the cured product has effective electromagnetic wave shieldability, is provided. A resin composition for semiconductor encapsulation, containing spherical sintered ferrite particles having the following properties (a) to (c) : (a) the soluble ion content of the particles is at most 5 ppm; (b) the mean particle size of the particles is from 10 to 50 μm; (c) the crystal structure of the particles by X-ray diffractiometry is a spinel structure. | 08-05-2010 |