Jui-Yi
Jui-Yi Chiu, Zhubei City TW
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20150116562 | COMPACT SPACER IN MULTI-LENS ARRAY MODULE - An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor. | 04-30-2015 |
Jui-Yi Chu, Taichung City TW
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20130049015 | LEDS AND METHODS FOR MANUFACTURING THE SAME - A light emitting diode (LED) is disclosed. The LED includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, and a patterned structure. The first semiconductor layer having first and second regions is positioned on the substrate, wherein the first region is thicker than the second region. The active layer is positioned on the first region of the first semiconductor layer. The second semiconductor layer is positioned on the active layer, wherein the first and second semiconductor layers have opposite conductivities. The patterned structure is formed on a sidewall of the first region of the first semiconductor layer or on a sidewall of the second semiconductor layer. | 02-28-2013 |
20130062657 | LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light-emitting diode structure is disclosed. A substrate has a first semiconductor layer, a light-emitting layer and a second semiconductor layer formed thereon. The first and second semiconductor layers are of opposite conductivity types. A first contact electrode is disposed between the first semiconductor layer and the substrate, and has a protruding portion extending into the second semiconductor layer. A barrier layer is conformally formed on the first contact electrode and exposes a top surface of the protruding portion. A current blocking member is disposed on the barrier layer and around at least a sidewall of the protruding portion. A second contact electrode is disposed between the first semiconductor layer and the first contact electrode, and in direct contact with the first semiconductor layer, wherein the second contact electrode is electrically insulated from the first contact electrode by the barrier layer. | 03-14-2013 |
20130256722 | LIGHT EMITTED DIODE - The present invention relates to a light emitted diode (LED). The LED includes a metal mirror, a bonding substrate, a distributed bragg reflector (DBR), a buffer layer, and a LED epitaxial structure. The bonding substrate is arranged under the metal mirror. The DBR is arranged on the metal mirror. The buffer layer is arranged on the DBR. The LED epitaxial structure is arranged on the buffer layer. | 10-03-2013 |
20140197423 | SUBSTRATE STRUCTURE FOR MANUFACTURING LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - The invention provides a substrate structure for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure comprises a substrate having a first surface and a second surface opposite to the first surface; and a plurality of grooving structure formed on the first surface of the substrate. In which, the light-emitting diode is formed on the first surface of the substrate. | 07-17-2014 |
20150076537 | LIGHT-EMITTING DIODE - The present disclosure provides a light-emitting diode, including: a silicon substrate having a first surface and a second surface opposite to the first surface; a buffer layer disposed over the first surface of the substrate, wherein the buffer layer includes alternating SiC and In | 03-19-2015 |
Jui-Yi Lin, Taipei TW
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20090190313 | THERMAL MODULE - A thermal module includes a heat sink disposed on a contact surface of the heat source, a mounting bracket having first and second ends, a fastening member, a pressing member, and at least one clip. The mounting bracket surrounds the heat source. The first end has at least one latch portion. The second end has at least one mounting slot and at least one first opening in communication with the mounting slot. The fastening member is slidably mounted in the mounting slot. The clip spans the heat sink and has two ends respectively engaged with the latch portion and a portion of the fastening member respectively. The pressing member includes a pressing tightly engaged with the clip and urges the heat sink when an operation portion of the pressing member is rotated from the first predetermined position to the second predetermined position. | 07-30-2009 |
Jui-Yi Liu, Taipei City TW
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20120170735 | COMMUNICATION APPARATUS FOR RAPIDLY ADJUSTING ANALOG ECHO CANCELLATION CIRCUIT AND RELATED ECHO CANCELLATION METHOD - A communication apparatus is disclosed including: an analog-front-end circuit for receiving and processing an analog input signal; an analog-to-digital converter (ADC) coupled with the analog-front-end circuit for converting processed signal from the analog-front-end circuit into a digital input signal; and a control unit coupled with the ADC for adjusting at least one resistance and/or at least one capacitance in an analog echo cancellation circuit according to the digital input signal before the analog-front-end circuit receives a training sequence that is the first training sequence transmitted from a second communication apparatus after the second communication apparatus begins communicating with the communication apparatus. | 07-05-2012 |
Jui-Yi Wu, Hsinchu TW
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20120257175 | CONTROL METHOD FOR STEREOLITHOGRAPHY STRUCTURE - Disclosed is a control method for stereolithography structure, including the steps of: providing a stereolithography structure including a main circuit system, an interface system, and a USB transmission interface. The main circuit system controls the interface system and the interface system includes a printing driving platform for allowing an user to operate the stereolithography structure; providing a computer system including a data transmission platform for generating printing data by performing a slicing operation according to operational instructions and converting slicing process data of a 3-D object into 2-D slicing printing format image data; and transmitting and receiving the 2-D slicing printing format image data through the USB transmission interface, and deciphering data and re-formatting data, in order to finish pre-planning procedure of driving operation, thereby transmitting data to the printing driving platform to drive the printing driving platform to finish object forming operation by ink spraying operations. | 10-11-2012 |