Patent application number | Description | Published |
20090200068 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor device comprises a first and a second group of input and output terminals and common terminals. The substrate further comprises conductive pads that use for inputting and outputting data from and to the semiconductor device, non-conductive pads that no use for inputting and outputting data from and to the semiconductor device, and common pads formed so as to correspond to the common terminals. The second group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the first group of input and output terminals are connected to the conductive pads, while the first group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the second group of input and output terminals are connected to the conductive pads. | 08-13-2009 |
20100130819 | ENDOSCOPE APPARATUS AND ITS CONTROL METHOD - An imaging mode is automatically switched based on the kind of a subject. The spatial frequency of an endoscopic image obtained by imaging the subject is detected. Further, judgment is made, based on the distribution of the spatial frequency, as to whether the endoscopic image was obtained by performing close-up imaging on the subject. The condition of imaging is switched based on the result of judgment as to whether the image was obtained by close-up imaging or distant-view imaging. | 05-27-2010 |
20100141747 | ENDOSCOPE APPARATUS AND CONTROL METHOD THEREOF - A narrow-band observation image and a spectral estimation image are automatically switched based on the type of a subject. In an endoscopic image obtained by a scope, judgment is made as to whether the endoscopic image was obtained by close-up imaging or by distant-view imaging. When it is judged that the endoscopic image was obtained by distant-view imaging, white light is output from a light source unit and a spectral estimation image is output. When it is judged that the endoscopic image was obtained by close-up imaging, narrow-band light is output from the light source unit and a narrow-band observation image that has been obtained when the narrow-band light was output is output. | 06-10-2010 |
Patent application number | Description | Published |
20080250619 | Vertical type semiconductor device producing apparatus - A semiconductor device is produced by providing a reaction chamber with a substrate and sequentially repeating steps of: supplying a first kind of gas into the reaction chamber, exhausting the first kind of gas from the reaction chamber, supplying a second kind of gas into the reaction chamber, and exhausting the second kind of gas from the reaction chamber to process the substrate disposed in the reaction chamber. The first kind of gas is pre-reserved in an intermediate portion of a supply path through which the first kind of gas flows, and is supplied into the reaction chamber with exhaust of the reaction chamber being substantially stopped. | 10-16-2008 |
20080251014 | Substrate Processing Apparatus and Reaction Container - A substrate processing apparatus comprises a reaction chamber which is to accommodate stacked substrates, a gas introducing portion, and a buffer chamber, wherein the gas introducing portion is provided along a stacking direction of the substrates, and introduces substrate processing gas into the buffer chamber, the buffer chamber includes a plurality of gas-supply openings provided along the stacking direction of the substrates, and the processing gas introduced from the gas introducing portion is supplied from the gas-supply openings to the reaction chamber. | 10-16-2008 |
20080251015 | Substrate Processing Apparatus and Reaction Container - A substrate processing apparatus comprises a reaction chamber which is to accommodate stacked substrates, a gas introducing portion, and a buffer chamber, wherein the gas introducing portion is provided along a stacking direction of the substrates, and introduces substrate processing gas into the buffer chamber, the buffer chamber includes a plurality of gas-supply openings provided along the stacking direction of the substrates, and the processing gas introduced from the gas introducing portion is supplied from the gas-supply openings to the reaction chamber. | 10-16-2008 |
20090178694 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus cleaning method that includes: containing a cleaning gas in a reaction tube without generating a gas flow of the cleaning gas in the reaction tube by supplying the cleaning gas into the reaction tube and by completely stopping exhaustion of the cleaning gas from the reaction tube or by exhausting the cleaning gas at an exhausting rate which substantially does not affect uniform diffusion of the cleaning gas in the reaction tube from at a point of time of a period from a predetermined point of time before the cleaning gas is supplied into the reaction tube to a point of time when several seconds are elapsed after starting of supply of the cleaning gas into the reaction tube; and thereafter exhausting the cleaning gas from the reaction tube. | 07-16-2009 |
20110130001 | Substrate Processing Apparatus - A substrate processing apparatus cleaning method that includes: containing a cleaning gas in a reaction tube without generating a gas flow of the cleaning gas in the reaction tube by supplying the cleaning gas into the reaction tube and by completely stopping exhaustion of the cleaning gas from the reaction tube or by exhausting the cleaning gas at an exhausting rate which substantially does not affect uniform diffusion of the cleaning gas in the reaction tube from at a point of time of a period from a predetermined point of time before the cleaning gas is supplied into the reaction tube to a point of time when several seconds are elapsed after starting of supply of the cleaning gas into the reaction tube; and thereafter exhausting the cleaning gas from the reaction tube. | 06-02-2011 |
20110176967 | VERTICAL TYPE SEMICONDUCTOR DEVICE PRODUCING APPARATUS - A vertical type semiconductor device producing apparatus comprises a vertical type reaction chamber which is to accommodate a plurality of stacked substrates; an exhaust path which exhausts the reaction chamber, a vacuum exhaust device which exhausts the reaction chamber through the exhaust path; an exhaust valve which opens and closes the exhaust path; a first supply path which supplies a first kind of gas, which contributes to film formation, to the reaction chamber; a second supply path which supplies a second kind of gas, which contributes to the film formation, to the reaction chamber; a first and a second gas supply valves which respectively open and close the first and second supply paths; and a controller which controls the exhaust valve and the first and second gas supply valves such that when the first kind of gas is supplied to the reaction chamber, the first kind of gas is supplied to the reaction chamber from the first supply path in a state in which exhaust of the reaction chamber is being stopped to expose the plurality of substrates in the reaction chamber to the first kind of gas, and when the second kind of gas is supplied to the reaction chamber, the second kind of gas is supplied to the reaction chamber through the second supply path in a state in which the reaction chamber is being exhausted by the vacuum exhaust device to expose the plurality of substrates in the reaction chamber to the second kind of gas. | 07-21-2011 |
20120240348 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus cleaning method that includes: containing a cleaning gas in a reaction tube without generating a gas flow of the cleaning gas in the reaction tube by supplying the cleaning gas into the reaction tube and by completely stopping exhaustion of the cleaning gas from the reaction tube or by exhausting the cleaning gas at an exhausting rate which substantially does not affect uniform diffusion of the cleaning gas in the reaction tube from at a point of time of a period from a predetermined point of time before the cleaning gas is supplied into the reaction tube to a point of time when several seconds are elapsed after starting of supply of the cleaning gas into the reaction tube; and thereafter exhausting the cleaning gas from the reaction tube. | 09-27-2012 |
20130133696 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus cleaning method that includes: containing a cleaning gas in a reaction tube without generating a gas flow of the cleaning gas in the reaction tube by supplying the cleaning gas into the reaction tube and by completely stopping exhaustion of the cleaning gas from the reaction tube or by exhausting the cleaning gas at an exhausting rate which substantially does not affect uniform diffusion of the cleaning gas in the reaction tube from at a point of time of a period from a predetermined point of time before the cleaning gas is supplied into the reaction tube to a point of time when several seconds are elapsed after starting of supply of the cleaning gas into the reaction tube; and thereafter exhausting the cleaning gas from the reaction tube. | 05-30-2013 |
Patent application number | Description | Published |
20090039506 | SEMICONDUCTOR DEVICE INCLUDING A SEMICONDUCTOR CHIP WHICH IS MOUNTED SPANING A PLURALITY OF WIRING BOARDS AND MANUFACTURING METHOD THEREOF - The semiconductor device is made up of two wiring boards, a semiconductor chip, and a sealing part. The two wiring boards are spaced apart, and a semiconductor chip is mounted so as to span the two wiring boards. The semiconductor chip includes a predetermined circuit and a plurality of electrode pads on one side thereof. The wiring board includes a plurality of connection pads on a semiconductor chip-mounting face, and a plurality of lands on the opposite side thereof. The land is electrically connected to a corresponding connection pad. An external terminal is formed on each of the lands. Further, the electrode pad formed in the semiconductor chip is electrically connected to the corresponding connection pad of the wiring board. Moreover, the semiconductor chip, the semiconductor chip mounting face of the wiring board, and the side faces of the wiring board are covered with the sealing part. | 02-12-2009 |
20090045497 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines. | 02-19-2009 |
20090096097 | Semiconductor device and manufacturing method of the same - Semiconductor device | 04-16-2009 |
20120032353 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines. | 02-09-2012 |