Tomori
Naoki Tomori, Chiba JP
Patent application number | Description | Published |
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20090189300 | Sealing Film and a Semiconductor Device Using the Same - The present invention provides a sealing film excellent in filling properties and adhesiveness as a sealing film which comprises a resin layer containing the following (A), (B) and (C) and having a flow within the range of 150 to 1800 μm at 80° C.: (A) a resin component containing (a1) a high-molecular-weight component comprising crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermoplastic component comprising an epoxy resin as main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant, as well as a method for manufacturing the same and a semiconductor device using the same. The present invention also provides a sealing film excellent in adhesiveness and shape retention as a sealing film which comprises a resin layer containing the above (A), (B) and (C) and having a resin layer having a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, as well as a semiconductor device using the same. | 07-30-2009 |
Naoki Tomori, Ichihara-Shi JP
Patent application number | Description | Published |
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20130093105 | SEALING FILM AND A SEMICONDUCTOR DEVICE USING THE SAME - A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 μm at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of −50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 μm, and (C) a colorant. | 04-18-2013 |
Zoltán Tomori, Kosice SK
Patent application number | Description | Published |
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20140024976 | RESUSCITATION DEVICE AND METHOD FOR RESUSCITATION - A method for providing a resuscitating treatment of a human being, which has the following actions sensing human muscle activity, human breathing activity, human neural activity or human cerebral activity, determining whether the human being is in a state of developing apnoea by a processing unit based on the sensing, provoking an induced aspiration reflex by a resuscitating stimulation of a respiratory area of a human brain stem by providing a stimulus with a stimulation device to a location distant from the respiratory area of the human brain stem upon the processing unit determining the state of developing apnoea, the location being a nasal filter of the human being or a nasopharyngeal area of the human being. | 01-23-2014 |