Tohyama, Tokyo
Isao Tohyama, Tokyo JP
Patent application number | Description | Published |
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20090139480 | Starter for Small-Sized Engine - A starter for a small-sized engine, capable of reliably starting the engine by a rope reel and stably supporting a drive cam. The starter has, received in a starter case, a cylindrical drive cam having a starter clutch mechanism, the rope reel for a recoil starter, and a starter motor, where the drive cam can be selectively operably connected to the rope reel or a starter motor. The rope reel is directly operably connected to the drive cam through a one-way clutch mechanism. Support plates are formed projected from the inner surface of the starter case toward the outer peripheral surface of the drive cam. Opposite ends of the drive cam are rotatably supportedly fitted into bearing holes formed in the support plates. | 06-04-2009 |
Koutaro Tohyama, Tokyo JP
Patent application number | Description | Published |
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20090297268 | Method for Removing Asphalt Pavement, System for Removing Asphalt Pavement, Electromagnetic Induction Coil Unit, Apparatus for Removing Asphalt Pavement, and Method for Peeling off Asphalt Pavement - It is intended to allow an asphalt pavement to be peeled off efficiently with a relatively small amount of electric power without generating large vibration and noise, and handled in the form of a block. An electromagnetic induction coil | 12-03-2009 |
Shigehiro Tohyama, Tokyo JP
Patent application number | Description | Published |
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20120184728 | Compound Amycolose Derivative, Method for Producing the Same, and Use of the Same - A compound having a structure expressed by the following General Formula (1) or a salt thereof | 07-19-2012 |
Shigeru Tohyama, Tokyo JP
Patent application number | Description | Published |
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20090242768 | THERMAL-TYPE INFRARED SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME - The thermal-type infrared solid-state imaging device comprises a infrared detector having at least a substrate provided with an integrated circuit for reading out a signal, a diaphragm for detecting a temperature change by absorbing infrared rays, and a support section for supporting the diaphragm above a surface of one side of the substrate with space in between, and includes an eaves section connected to a connection area provided in the vicinity of outer circumference of the diaphragm and covering at least components other than the diaphragm across a space and transmitting the heat generated by absorbing incident infrared rays to the diaphragm, wherein the eaves section has the thickness of a first region covering the components other than the diaphragm across a space thicker than the thicknesses of a second region contacting the connection area of the diaphragm and a third region rising upward in mid air from the diaphragm. | 10-01-2009 |
20110198720 | THERMAL-TYPE INFRARED SOLID-STATE IMAGING ELEMENT - A thermal-type infrared solid-state imaging element is provided with a pixel having a diaphragm ( | 08-18-2011 |
20120241626 | THERMAL-TYPE INFRARED SOLID-STATE IMAGE SENSING DEVICE AND METHOD OF MANUFACTURING THE SAME - In the reference element employed in the thermal-type infrared solid-state image sensing device according to the present invention, a slit used for construction of a light receiving element is opened in insulating films between which a thermoelectric conversion element is tucked to such an extent that the slit pierces into the sacrifice layer; a film made of electrically conductive material covering the light receiving section and the slit is provided and a protective film is provided thereon, and the film made of electrically conductive material and the protective film enter the interior of the slit along a side wall of the slit, whereby a void is left in the interior of the slit. As a result, residual stresses of the insulating films are kept equal in the light receiving element and the reference element, and thereby, the light blocking effect and the heat transfer effect are improved. | 09-27-2012 |
20130248686 | SOLID-STATE IMAGE SENSING DEVICE AND METHOD OF MANUFACTURING THE SAME - A solid-state image sensing device has a plurality of detection units periodically arranged as a two-dimensional array on a substrate. Each of the detection units includes a visible light detector and an infrared light detector arranged on the same optical axis in a vertical direction so that the visible light detector and the infrared light detector overlap with each other. Each of the detection units also includes a signal readout circuit provided in the substrate so as to output signals of the visible light detector and the infrared light detector as time-series signals. | 09-26-2013 |
Shuji Tohyama, Tokyo JP
Patent application number | Description | Published |
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20080223142 | SENSOR AND MANUFACTURING METHOD OF SENSOR - The following abstract will replace all prior versions of the abstract in the application: | 09-18-2008 |
20080236290 | SENSOR AND MANUFACTURING METHOD OF SENSOR | 10-02-2008 |
20100206085 | SENSOR - In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged. | 08-19-2010 |
20140360277 | SENSOR - A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board. | 12-11-2014 |
Tadahisa Tohyama, Tokyo JP
Patent application number | Description | Published |
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20090140648 | DISPLAY PANEL AND MANUFACTURING METHOD OF DISPLAY PANEL - A manufacturing method of a display panel including a light emitting element including a first electrode, a carrier transporting layer constituted of at least one layer and a second electrode so as to layer the first electrode, the carrier transporting layer and the second electrode, and the manufacturing method includes forming the first electrode in a predetermined region on a substrate, forming an opening from which only a predetermined region of the first electrode is exposed by patterning an insulation film by carrying out an etching after forming the insulation film on the substrate including the first electrode and forming the carrier transporting layer at least on the first electrode which is exposed from the opening. | 06-04-2009 |
20090243482 | DISPLAY DEVICE - A display device comprising: a light-emitting element formed on a substrate; a driver element formed on the substrate, that controls a current flowing in the light-emitting element; a switching element that switches the driver element; and a light-blocking film formed so as to correspond to only the switching element. | 10-01-2009 |