Kazushige
Hori Kazushige, Osaka JP
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20150188058 | CARBAZOLE COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME - A carbazole compound represented by Formulae 1A or 1B: | 07-02-2015 |
Takaishi Kazushige, Tokyo JP
Patent application number | Description | Published |
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20090186488 | SINGLE WAFER ETCHING APPARATUS - A single wafer etching apparatus is an apparatus that supplies etching liquid to an upper face of a thin discoid wafer obtained by slicing a semiconductor ingot while rotating the wafer to etch the upper face and an edge face of the wafer. The apparatus includes: a first nozzle for supplying etching liquid to the upper face of the wafer; and a second nozzle for supplying etching liquid to the edge face of the wafer that is opposed to the edge face of the wafer. The second nozzle is fixed at a predetermined position in a range of −10 mm to 20 mm from an end of an outer periphery of the wafer toward an inner side of the wafer in the radial direction. The apparatus includes a lower face blowing mechanism by which etching liquid flowing along the edge face of the wafer is blown off by gas jet toward an outer side in the radial direction of the wafer. | 07-23-2009 |
Toriyama Kazushige, Yamato-Shi JP
Patent application number | Description | Published |
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20130256849 | HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES - A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss. | 10-03-2013 |
Toriyama Kazushige, Kanagawa JP
Patent application number | Description | Published |
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20130256850 | ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES - A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss. | 10-03-2013 |