Jui
Chakraborty Jui, West Bengal IN
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20090181161 | PROCESS FOR THE PREPARATION OF PROTEIN MEDIATED CALCIUM HYDROXYAPATITE (HAP) COATING ON METAL SUBSTRATE - This invention provides a process for the preparation of protein mediated calcium hydroxyapatite (HAp) coating on metal substrates particularly on stainless steel (316 L) by biomimetic route, capable of rapid and effective osteointegration with the host tissue following controlled interfacial reactions. For the purpose, calcium deficient, carbonated hydroxyapatite (HAp) coating was developed on metal substrates particularly on stainless steel (316L) alloy through biomimetic route after a surface treatment step using aqueous solution (4-10 wt %) of BSA at room temperature. The coating was characterised with respect to phase composition, crystallinity, morphology and thickness. The protein mediated calcium phosphate ceramic coating is porous (pore dia—100-200 μm) having uniform pore distribution and coverage. There is multifold enhancement in thickness and crystallinity (data provided) of the as-prepared coating. The process in the present invention is designed to mimic the structural and characteristic properties of the biological apatite to expedite osteointegration kinetics and to further improve biocompatibility of the metallic implant. | 07-16-2009 |
Chia-Wei Jui, Yangmei City TW
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20150097259 | CONDUCTIVE VIA STRUCTURE, PACKAGE STRUCTURE, AND PACKAGE OF PHOTOSENSITIVE DEVICE - Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability. | 04-09-2015 |
Chia-Wei Jui, Taoyuan City TW
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20160043239 | PACKAGE STRUCTURE - Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability. | 02-11-2016 |
Nathan Jui, Cambridge, MA US
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20160031824 | BENZIMIDAZOLE DERIVATIVES AND USES THEREOF - The present invention provides novel compounds of Formula (I), and pharmaceutically acceptable salts, solvates, hydrates, polymorphs, co-crystals, tautomers, stereoisomers, isotopically labeled derivatives, prodrugs, and pharmaceutical compositions thereof. The present invention also provides methods and kits using the inventive compounds and pharmaceutical compositions for treating and/or preventing diseases associated with protein aggregation, such as amyloidoses (e.g., Parkinson's disease and Alzheimer's disease), treating and/or preventing neurodegenerative diseases, treating and/or preventing diseases associated with Tar DNA binding protein 43 kDa, reducing or preventing protein aggregation, and/or modulating E3 ubiquitin ligase in a subject in need thereof. | 02-04-2016 |
Sheng-Tzu P. Jui, Dallas, TX US
Patent application number | Description | Published |
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20100268639 | Characterizing Creditworthiness Credit Score Migration - Data comprising a request to generate a migration score is received (for example, by a first computer system). The migration score characterizes a likelihood of a change in a level of creditworthiness of a consumer subsequent to generation of a current credit score. Thereafter, future credit score migration for the individual is estimated (for example, by the first computer system) using a predictive model trained using historical creditworthiness data derived from a plurality of individuals. The historical creditworthiness data includes, for each individual, a historical credit score and empirical performance data subsequent to a scoring date for the historical credit score. Thereafter, the estimated future credit score migration is associated (for example, by the first computer system) with a migration score. Provision of the migration score can then be initiated. Related apparatus, systems, techniques and articles are also described. | 10-21-2010 |