Patent application number | Description | Published |
20080300126 | LOW-MELTING LEAD-FREE SOLDER GLASS AND USES THEREOF - The low melting solder glass contains, in wt. % on an oxide basis, >1-2, SiO | 12-04-2008 |
20090217706 | METHOD FOR PRODUCING COVER GLASS FOR RADIATION-SENSITIVE SENSORS AND DEVICE FOR CARRYING OUT SAID METHOD - The invention relates to a method for producing a low-radiation cover glass with low intrinsic α-radiation for radiation-sensitive sensors, in particular for use with semiconductor technology, without the production of intermediate moulds, by the direct shaping of plate glass with appropriate dimensions. The invention also relates to a device for carrying out said method. | 09-03-2009 |
20100209685 | LOW-RADIATION COVER GLASS AND USE THEREOF - The invention relates to a low-radiation cover glass for radiation-sensitive sensors, with low intrinsic α-radiation, in particular for use with semiconductor technology. The glass includes a glass composition, selected from the following: aluminosilicate glass, aluminoborosilicate glass, borosilicate glass, in particular borosilicate glass that is devoid of alkali, with a TiO2 content of >0.1-10% by weight, in particular 1-8% by weight. | 08-19-2010 |
20110098172 | BORON-FREE GLASS - The invention discloses boron-free neutral glasses having the composition (in % by weight, based on oxide) 65-72 SiO | 04-28-2011 |
20110312482 | CRYSTALLIZING GLASS SOLDER AND USE THEREOF - A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO | 12-22-2011 |
20120057337 | CONVERSION MATERIAL, PARTICULARLY FOR A WHITE OR COLORED LIGHT SOUCE COMPRISING A SEMICONDUCTOR LIGHT SOURCE, A METHOD FOR THE PRODUCTION THEREOF, AS WELL AS A LIGHT SOURCE COMPRISING SAID CONVERSION MATERIAL - The invention relates to a conversion material, in particular for a white or colored light source comprising a semiconductor light source as primary light source, comprising a matrix glass that, as bulk material, for a thickness d of about 1 mm, has a pure transmission τ | 03-08-2012 |
20120065049 | Crystallizing glass solders and uses thereof - A crystallizing glass solder for high-temperature applications, containing, in % by weight on an oxide basis: 45% to 60% of BaO, 25% to 40% of SiO | 03-15-2012 |
20130186140 | LITHIUM ALUMINOSILICATE GLASS WITH HIGH MODULUS OF ELASTICITY, AND METHOD FOR PRODUCING SAME - A lithium aluminosilicate glass and a method for producing such lithium aluminosilicate glass are provided. The glass has a composition, in mol %, of: SiO | 07-25-2013 |
20130276880 | TRANSPARENT LAYER COMPOSITE ASSEMBLIES - Transparent layer composite assemblies are provided that are suitable for use in solar modules and light emitting diodes, as well as methods for producing such layer composite assemblies and to the uses thereof. The layer composite assemblies have substrate materials that make it possible to increase the luminous efficiency of light emitting diodes and the efficiency of solar modules. | 10-24-2013 |
20140005027 | BORON-FREE UNIVERSAL GLASS | 01-02-2014 |
20140179507 | Crystallizing glass solders and uses thereof - A crystallizing glass solder for high-temperature applications, which is free of PbO and contains, in % by weight on an oxide basis: 45% to 60% of BaO; 25% to 40% of SiO | 06-26-2014 |
Patent application number | Description | Published |
20100208905 | DEVICE AND A METHOD FOR DETERMINING A COMPONENT SIGNAL WITH HIGH ACCURACY - A device for determining a component signal for a WFS system includes a provider for providing WFS parameters, a WFS parameter interpolator, and an audio signal processor. The provider provides WFS parameters for a component signal while using a source position and while using the loudspeaker position at a parameter sampling frequency smaller than the audio sampling frequency. The WFS parameter interpolator interpolates the WFS parameters so as to produce interpolated WFS parameters which are present at a parameter interpolation frequency that is higher than the parameter sampling frequency, the interpolated WFS parameters having interpolated fractions which have a higher level of accuracy than is specified by the audio sampling frequency. The audio signal processor is configured to apply the interpolated fractional values to the audio signal such that the component signal is obtained in a state of having been processed at the higher level of accuracy. | 08-19-2010 |
20110144783 | APPARATUS AND METHOD FOR CONTROLLING A WAVE FIELD SYNTHESIS RENDERER MEANS WITH AUDIO OBJECTS - An apparatus for controlling a wave field synthesis renderer with audio objects includes a provider for providing a scene description, wherein the scene description defines a temporal sequence of audio objects in an audio scene and further includes information on the source position of a virtual source as well as on a start or an end of the virtual source. Furthermore, the audio object includes at least a reference to an audio file associated with the virtual source. The audio objects are processed by a processor, in order to generate a single output data stream for each renderer module, wherein both information on the position of the virtual source and the audio file itself are included in mutual association in this output data stream. With this, high portability on the one hand and high quality due to secure data consistency on the other hand are achieved. | 06-16-2011 |
20110272884 | TRANSPORT OF AN OBJECT ACROSS A SURFACE - A basic idea of the present application is that in case of determining a position of the object on the surface, it is possible to also use transport mechanisms for the transport of the object on the surface which leads to less reproducible transport movements as the regulation may be executed directly on the basis of the observed movement as compared to the desired movement. Embodiments using compressed air, magnetism and/or bending waves are described. | 11-10-2011 |
20130243203 | DEVICE AND A METHOD FOR DETERMINING A COMPONENT SIGNAL WITH HIGH ACCURACY - A device for determining a component signal for a WFS system includes a provider for providing WFS parameters, a WFS parameter interpolator, and an audio signal processor. The provider provides WFS parameters for a component signal while using a source position and while using the loudspeaker position at a parameter sampling frequency smaller than the audio sampling frequency. The WFS parameter interpolator interpolates the WFS parameters so as to produce interpolated WFS parameters which are present at a parameter interpolation frequency that is higher than the parameter sampling frequency, the interpolated WFS parameters having interpolated fractions which have a higher level of accuracy than is specified by the audio sampling frequency. The audio signal processor is configured to apply the interpolated fractional values to the audio signal such that the component signal is obtained in a state of having been processed at the higher level of accuracy. | 09-19-2013 |
20140257557 | TRANSPORT OF AN OBJECT ACROSS A SURFACE - A basic idea of the present application is that in case of determining a position of the object on the surface, it is possible to also use transport mechanisms for the transport of the object on the surface which leads to less reproducible transport movements as the regulation may be executed directly on the basis of the observed movement as compared to the desired movement. Embodiments using compressed air, magnetism and/or bending waves are described. | 09-11-2014 |
Patent application number | Description | Published |
20090176901 | Process for the production of a moulding composed of foamed polytetrafluoroethylene - A process for the production of a moulding composed of foamed polytetrafluoroethylene by means of an extruder, includes introducing a foaming agent, which brings about foaming, into the polytetrafluoro-ethylene, where the extruder used includes a commercially available extruder, to which a thermoplastically processable, fusible polytetrafluoroethylene is fed, the polytetrafluoroethylene is fed to the extruder together with a foaming agent which has chemical action and which has a decomposition temperature of at least 320° C., and after its discharge from the extruder, the moulding is drawn off in the direction of production without any further measures relating to the foaming procedure. | 07-09-2009 |
20090206502 | High processing temperature foaming polymer composition - A foaming composition comprising a melt processible fluoropolymer, and a chemical foaming agent, where the chemical foaming agent is ammonium polyphosphate. | 08-20-2009 |
20100252947 | HIGH PROCESSING TEMPERATURE FOAMING POLYMER COMPOSITION - A foaming composition comprising a melt processible fluoropolymer, and a chemical foaming agent, where the chemical foaming agent is ammonium polyphosphate. | 10-07-2010 |