Chen-Chih
Chen-Chih Fan, Zhubei City TW
Patent application number | Description | Published |
---|---|---|
20130119493 | MICROELECTRO MECHANICAL SYSTEM ENCAPSULATION SCHEME - A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device. | 05-16-2013 |
20130277771 | Capacitive Sensors and Methods for Forming the Same - A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane. | 10-24-2013 |
20130277777 | MEMS Device Structure and Methods of Forming Same - A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material. | 10-24-2013 |
20140213008 | Capacitive Sensors and Methods for Forming the Same - A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane. | 07-31-2014 |
Chen-Chih Ho, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20140079536 | FAN MODULE - A fan module includes a module housing, a first set of stationary blades, a second set of stationary blades, a motor, and a dynamic blade combination. The module housing has a channel having an inlet. The first and second sets of stationary blades are disposed at the inner wall of the module housing. The motor is disposed in the channel and includes a rotor. The dynamic blade combination includes a hub fixed to a periphery of the rotor, and a first set of dynamic blades and a second set of dynamic blades that surround and are disposed to a periphery of the hub. The first set of dynamic blades is located between the inlet and the first set of stationary blades. The second set of dynamic blades is located between the first and second set of stationary blades. | 03-20-2014 |
Chen-Chih Hsieh, Tongxiao Township TW
Patent application number | Description | Published |
---|---|---|
20150035139 | Copper Post Structure for Wafer Level Chip Scale Package - In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening passing through the first polymer insulating layer is formed to expose a portion of the metal pad. A copper-containing material is deposited in the opening and over the first polymer insulating layer, thereby forming a copper-containing layer having a first thickness and a first width over the first polymer insulating layer. A conductive bump having a second width is formed over the copper-containing layer, in which the second width is smaller than the first width. An exposed portion of the copper-containing layer is etched using the conductive bump as a mask until the exposed portion is reduced to a second thickness, thereby forming a monolithic copper-containing structure. | 02-05-2015 |
Chen-Chih Huang, Hsin-Chu Hsien TW
Patent application number | Description | Published |
---|---|---|
20090175157 | ECHO CANCELLATION DEVICE FOR FULL DUPLEX COMMUNICATION SYSTEMS - An apparatus for echo cancellation in a transceiver of a full duplex communication system, where the transceiver includes a transmitter for transmitting a transmit signal and a receiver for receiving a receive signal, includes: an echo cancellation signal generator, coupled to the transmitter, for receiving the transmit signal and for generating an echo cancellation signal according to the transmit signal, wherein the echo cancellation signal reflects an effect of an impedance of a channel and a parasitic capacitor of the transceiver; and a calculation module coupled to the transmitter, the receiver, and the echo cancellation signal generator for receiving the receive signal and for canceling the echo of the receive signal according to the echo cancellation signal to generate an echo-cancelled signal, wherein the effect of the impedance of the channel and the parasitic capacitor of the transceiver in the echo-cancelled signal is reduced. | 07-09-2009 |
Chen-Chih Huang, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20120062316 | SIGNAL GENERATING APPARATUS AND METHOD THEREOF - A signal generating apparatus comprises an amplifier, which comprises differential input terminals for receiving a first input signal, a common mode output signal adjusting terminal for receiving a second input signal, and an output terminal. The signal generating apparatus may provide two or more differential output signals according to the first input signal, and provide two or more common mode output signals according to the second input signal. The amplifier provides an output signal comprising one of the differential output signals and one of the common mode output signals at the output terminal. | 03-15-2012 |
Chen-Chih Huang, Hsin Chu County TW
Patent application number | Description | Published |
---|---|---|
20090010192 | SINK DEVICE - The invention discloses a sink device and a signal receiving method thereof, applicable to wireless local area network. The sink device receives a plurality of beacon signals, synchronizes the beacon output signal generated by itself with the operating clock of the source device according to the above-mentioned timing synchronization data. And the sink device receives the plurality of beacon signals according to this calibrated synchronization clock. | 01-08-2009 |
20090284320 | CLOCK GENERATOR - This invention discloses a clock generator capable of automatically adjusting output clock when process, voltage, or temperature variation occurred. The clock generator comprises a current generator, for generating a first current and a second current according to a control voltage; a oscillator, coupled to the current generator, for generating a clock signal according to the first current; and a voltage adjuster, coupled to the current generator and the oscillator, for adjusting the control voltage according to the clock signal and the second current; wherein, when the signal frequency of the clock signal changed, the voltage adjuster correspondingly adjusts the control voltage so as to adjust the first current. | 11-19-2009 |
20110227611 | OSCILLATOR AND CONTROL METHOD THEREOF - An oscillator and the control method thereof. The oscillator includes an oscillation unit to receive a first current and to generate an oscillating signal according to the first current, a frequency-to-voltage converter to receive the oscillating signal and to generate a converted voltage according to a frequency of the oscillating signal, and a voltage-to-current converter to receive the converted voltage and to generate the first current according to the converted voltage, wherein the first current is modulated from a first value to a second value after the initiation of the oscillation unit. | 09-22-2011 |
Chen-Chih Huang, Hsinchu TW
Patent application number | Description | Published |
---|---|---|
20100219865 | FREQUENCY DETECTION APPARATUS AND METHOD - A frequency detection apparatus and method are provided. The frequency detection apparatus includes a frequency conversion circuit and an analog conversion circuit. The frequency conversion circuit receives an input clock, and generates an analog signal corresponding to a frequency of the input clock based on the frequency of the input clock. The analog conversion circuit is coupled to the frequency conversion circuit, receives the analog signal, and generates a discriminating signal corresponding to the frequency of the input clock based on the analog signal, where the discriminating signal represents a frequency interval of the input clock. | 09-02-2010 |
20110148371 | SWITCHED-MODE POWER SUPPLY - A switched-mode power supply (SMPS) uses an equivalent inductor of bonding wire(s) and lead frame(s) to replace a traditional external inductor. A current-controlled pulse width modulation (PWM) modulator and a current-controlled pulse frequency modulation (PFM) modulator are optionally employed for high frequency switching, so as to mate a low inductance value of the bonding wire(s) and lead frame(s) and achieve reduced cost, low power consumption and low complexity. | 06-23-2011 |
Chen-Chih Hung, Keelung City TW
Patent application number | Description | Published |
---|---|---|
20080211085 | Semiconductor package having insulating substrate - A semiconductor package having an insulating substrate includes a dielectric layer, a set of metal layers, a set of supporting elements, and an electronic component. The set of metal layers includes a first metal layer and a second metal layer respectively located on the upper surface and the lower surface of the dielectric layer. The set of supporting elements includes a first supporting element and a second supporting element respectively located on the first metal layer and the second metal layer. The electronic component is electrically connected with the first supporting element. The dielectric layer and the set of metal layers form an insulating substrate. Furthermore, a package resin is disposed on the second supporting element to package the dielectric layer, the set of metal layers, the first supporting element, and the electronic component into one piece and fasten it on to the second supporting element. | 09-04-2008 |
Chen-Chih Lin, Hsinchu County TW
Patent application number | Description | Published |
---|---|---|
20140139057 | STATOR MODULE AND MAGNETIC FIELD GENERATED STRUCTURE THEREOF - The disclosure provides a stator module and a magnetic field generated structure which includes a magnetizer and an electrically conducting pipe. The electrically conducting pipe is wound around the magnetizer and has a passage inside. The passage has an outlet and an inlet opposite to each other. The electrically conducting pipe has a current input portion and a current output portion. | 05-22-2014 |
Chen-Chih Wu, Hsin-Chu TW
Patent application number | Description | Published |
---|---|---|
20130001704 | Resistors Formed Based on Metal-Oxide-Semiconductor Structures - A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs. | 01-03-2013 |
Chen-Chih Wu, Hsinchu City TW
Patent application number | Description | Published |
---|---|---|
20150021713 | GUARD RING STRUCTURE OF SEMICONDUCTOR ARRANGEMENT - Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring. | 01-22-2015 |
Chen-Chih Yen, Chiayi TW
Patent application number | Description | Published |
---|---|---|
20090282952 | Cold forged stainless tool and method for making the same - A method for cold forging a stainless steel tool includes a preparation step, a cold forging step, a trimming step and a hardening step. At the preparation step, there is provided a billet of stainless steel. At the cold forging step, the billet is cold forged into a forged billet in a plurality of rounds. A gap between a round and a previous round is shorter than the time required for the time needed for the forged billet to return to the temperature in the beginning of the previous round. At the trimming step, the forged billet is lathed and grounded. At the hardening step, thermal treatment is conducted on the lathed, grounded, forged billet. A stainless steel tool is formed after cooling. | 11-19-2009 |
Chen-Chih Yu, Chu-Pei City TW
Patent application number | Description | Published |
---|---|---|
20140015561 | HIGH FREQUENCY PROBE CARD - A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. | 01-16-2014 |
20140016123 | PROBE HOLDING STRUCTURE AND OPTICAL INSPECTION DEVICE EQUIPPED WITH THE SAME - A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips. | 01-16-2014 |
20140016124 | OPTICAL INSPECTION DEVICE - An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening. | 01-16-2014 |