Patent application number | Description | Published |
20090101497 | SPUTTERING SYSTEM CARRIER - A sputtering system carrier configured for supporting a workpiece comprises a main body and a supporting body. The main body includes four end to end frames, which are a first frame, a second frame, a third frame, and a fourth frame. The first frame and the third frame each have a sliding slot. The second frame and the fourth frame each has a coil wrapped around the frame. The supporting body includes four end to end frames, which are a fifth frame, a sixth frame, a seventh frame, and an eighth frame. The fifth frame and the seventh frame have a pivot protruding from outside surface. The pivots are movably held in the sliding slots. The pivots are positioned either near the sixth frame or the eighth frame. The sixth frame, the eighth frame, or both have a magnet. | 04-23-2009 |
20090163125 | GRINDING APPARATUS HAVING PRESSING PORTION AND GRINDING METHOD USING SAME - A grinding apparatus for grinding at least one workpiece includes a base, a first pressing portion, and a second pressing portion. The base is configured for receiving the workpiece. The first pressing portion and a second pressing portion are configured for applying a pressing force against the workpiece cooperatively, so as to hold the workpiece between the first pressing portion and the second pressing portion. The first pressing portion and the second pressing portion are moveable and rotatable relative to the base for removing the workpiece apart from the base and rotating the workpiece clockwise and counter-clockwise. A grinding method is also provided. | 06-25-2009 |
20090174099 | METHOD FOR MANUFACTURING MOLD USED IN IMPRESSION PROCESS - A method for manufacturing a mold used in impression process is provided. The method includes the following steps: forming a negative photoresist layer between a transparent substrate and a supporting substrate; exposing the negative photoresist layer via the transparent substrate by direct writing technology; removing the supporting substrate; and developing the negative photoresist layer to form the mold. | 07-09-2009 |
20090237929 | STREET ILLUMINATING DEVICE - A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board. | 09-24-2009 |
20090261487 | METHOD FOR MAKING OPTICAL ARTICLES - A method for making an optical article having a first optical surface and an opposite second optical surface, is provided. The method includes: providing a transparent substrate having a first surface and an opposite second surface; forming a first layer comprised of a first molding material on the first surface of the substrate; press-molding the first layer to form a first optical surface thereon; providing a supporting mold having a supporting surface conforming to the first optical surface; attaching the supporting mold to the first layer with the first optical surface in intimate contact with the supporting surface thereof; forming a second layer comprised of a second molding material on the second surface of the substrate; press-molding the second layer to form a second optical surface thereon; and removing the supporting mold to obtain an optical article including the substrate with the first and second layers at opposite sides thereof. | 10-22-2009 |
20090280417 | METHOD FOR FABRICATING MOLD CORE - An exemplary method for fabricating a mold core includes the following steps. First, a substrate is provided. Second, a photo resist layer is formed on the substrate, the photo resist layer has a top surface. Third, the photo resist layer is etched using a direct writing process to form the top surface thereof into a substantially aspherical stepped surface. Lastly, the photo resist layer is softened using a reflow process to transform the substantially aspherical stepped surface into a substantially aspherical smooth molding surface. Thereby, a mold core having the substantially aspherical smooth molding surface is obtained. | 11-12-2009 |
20090316142 | METHOD FOR MEASURING ILLUMINANCE OF LAMP - A method for measuring illuminance of a lamp utilizes at least one illuminance meter and a rotary apparatus. The lamp is installed on the rotary apparatus. The lamp emits light and projects onto an irradiation area. A measurement area is defined from within the irradiation area. The measurement area is evenly divided into n sub-measurement areas, wherein n is a natural number. The n sub-measurement areas are centrosymmetric. At least one illuminance meter measuring illuminance of the lamp is disposed on one of the n sub-measurement areas. The rotary apparatus drives the lamp to rotate 360/n° in turn. The single illuminance meter measures illuminance of the lamp in other (n-1) sub-measurement areas. | 12-24-2009 |
20090316400 | LIGHT EMITTING DIODE STREET LIGHT - An exemplary light emitting diode (LED) streetlight includes an LED light source and a heat dissipating module. The LED light source includes a circuit board and a plurality of LEDs. The circuit board has a first surface and a second surface. The LEDs are disposed on the first surface and electrically connected to the circuit board. The heat dissipating module includes a heat conducting plate, a plurality of heat pipes containing a working liquid and a plurality of fins. The heat conducting plate has a bonding surface and a heat dissipating surface opposite to the bonding surface. Each heat pipe has a heated section thermally connected to the heat dissipating surface and a condensing section spaced from the heat dissipating plate and penetrate into the plurality of fins. The circuit board is fixed on the bonding surface of the heat conducting plate. | 12-24-2009 |
20090323331 | ILLUMINATION DEVICE - An illumination device includes a lampshade, a heat dissipation module, a light module and a lamp cap. The lampshade includes a shell and an optical lens fixed on the shell. The heat dissipation module includes a plurality of heat sinks, a bottom plate coupled to the heat sinks, and a cavity defined in the center of the heat dissipation module. The light module is received in the cavity and toward the optical lens, including a substrate and a light source mounted on the substrate. The lamp cap is coupled to the heat dissipation module and away from the optical lens. | 12-31-2009 |
20100014165 | LENS, LENS ARRAY AND METHOD FOR MAKING LENS ARRAY - An exemplary lens includes a light pervious substrate, a first optically active part, and a light blocking film. The light pervious substrate has a first surface, an opposite second surface, and a recess defined in the first surface. The recess includes a bottom surface. The first optically active part is formed on the bottom surface. The light blocking film is formed on the bottom surface surrounding the first optically active part. | 01-21-2010 |
20100025868 | APPARATUS AND METHOD FOR MANUFACTURING OPTICAL ELEMENTS - An apparatus for manufacturing optical elements at wafer level includes a lower mold core, an upper mold core, an aligning plate and an image pick-up device. The lower mold core has a lower alignment mark. The upper mold core has an upper alignment mark. The aligning plate has a first middle alignment mark corresponding to the lower alignment mark and a second middle alignment mark corresponding to the upper alignment mark. The image pick-up device is configured for capturing and analyzing images of the alignment marks to align the lower mold core, the aligning plate and the upper mold core. | 02-04-2010 |
20100118410 | LENS ASSEMBLY, LENS ASSEMBLY ARRAY AND METHOD OF MAKING THE SAME - A first lens having a first bottom surface and a first top surface at opposite sides thereof; and a first supporter having a first supporting surface and a second supporting surface at opposite sides thereof, the first supporting surface being flat, the second supporting surface being in contact with the first bottom surface, the first supporter being made of transparent material, and a refraction index of the first supporter being different from a refraction index of the first lens. A lens assembly array and method of making the lens assembly array are also provided. | 05-13-2010 |
20100136154 | STAMPER AND METHOD FOR MAKING SOFT MOLD - An exemplary method for making a soft mold is provided. A transparent substrate is provided. A to-be-solidified film is formed on the transparent substrate. A stamper and a guiding plate are further provided. The guiding plate is positioned between the stamper and the to-be-solidified film. The stamper inserts one of the through holes of the guiding plate. The first alignment mark is aligned with one of the second alignment marks. The stamper is pressed into the to-be-solidified film. The pressed portion of the to-be-solidified film is solidified to obtain a second molding surface on the to-be-solidified film. The previous steps are repeated for the stamper and the rest of the through holes of the guiding plate to obtain a soft mold having a plurality of the second molding surfaces. | 06-03-2010 |
20100163708 | MOLD CORE AND METHOD FOR FABRICATING MOLD CORE - An exemplary method for fabricating a mold core includes the following steps. First, an ultraviolet (UV) transmitting glass substrate is provided. Second, a photo resist layer is formed on the substrate. Third, the photo resist layer is exposed under a UV light and developed to form a plurality of spaced through holes therein. Fourth, the areas of the surface of the substrate under the through holes are etched to form a plurality of cavities. Fifth, each cavity is filled with a light-curable material, and the photo resist layer is removed. Sixth, the light-curable material is solidified to form a light-cured material block in each cavity. Lastly, the light-cured material block in each cavity is machined using an ultra-precision machine to form a molding surface of the light-cured material block. Thereby, the mold core with a plurality of the molding surfaces is obtained. | 07-01-2010 |
20100248161 | METHOD FOR MAKING ALIGNMENT MARK ON SUBSTRATE - An exemplary method for making an alignment mark on a substrate includes the following steps. First, a substrate with a recess is provided. Second, a photoresist layer is formed on a surface of the substrate including in the recess. Third, the photoresist layer is exposed and developed to leave a body of remaining photoresist in the recess, with the body of remaining photoresist protruding above the surface of the substrate. Fourth, a metal layer is formed in an unfilled area of the recess and on the surface of the substrate, with the metal layer substantially surrounding the remaining photoresist. Finally, the remaining photoresist is removed to form an alignment mark in the metal layer on the substrate. | 09-30-2010 |
20100276825 | METHOD FOR MANUFACTURING LENS MOLD - In a method for manufacturing a lens mold, a raw mold is provided. The raw mold defines a cavity therein. The cavity defines a raw molding surface. The raw molding surface includes a molding surface portion. The molding surface portion includes a center. Photoresist material is filled in the cavity, covering the molding surface portion. A photo mask is provided. The photo mask defines a through hole. The size through hole is the same as the molding surface portion of the lens mold. The photo mask is placed above the photoresist material with the through hole aligned with the center. The photoresist material is exposed and developed to form a photoresist portion. A rigid molding material is filled in the cavity. The resist portion is removed to expose the molding surface. | 11-04-2010 |
20100295195 | METHOD OF MOLDING LENS ARRAY - An exemplary method for making a lens array having many lenses includes the follow steps. A light pervious substrate including a supporting surface is firstly provided. Secondly, a molten molding material is applied on the supporting surface. Thirdly, a pressing mold including many molding parts is provided, each molding part including a molding cavity for molding the lens. Fourthly, the pressing mold is pressed on the molten molding material. Fifthly, the molten molding material is half-cured, thereby forming a half-cured molding material. Sixthly, the half-cured molding material is pressed by the pressing mold. Seventhly, the half-cured molding material is fully cured to form each lens in each molding cavity. Finally, the pressing mold is removed from the light pervious substrate to form the lens array. | 11-25-2010 |
20100297396 | WORKPIECE WITH POSITIONAL MARKER AND METHOD FOR MACHINING THE POSITIONAL MARKER - A workpiece includes a positional marker and defines a number of round recesses. The positional marker includes first positional projection, at least one second positional projection, and at least one third positional projection. The first positional projection defines a first diagonal and a second diagonal. The second positional projection is arranged along the first diagonal, and has a diagonal on the first diagonal. The third positional projection is arranged along the second diagonal, and has a diagonal on the second diagonal. Each of the first positional projection, the at least one second positional projection, and the at least one third positional projection is surrounded by four round recesses of the number of round recesses. | 11-25-2010 |
20100301500 | METHOD FOR PRESS MOLDING LENS ARRAY - A method for press molding a lens array is provided. First, a mold core is provided. The mold core has a first surface having a first alignment formed thereon using a lithography method, and a lens molding surface array and a second alignment formed thereon using an ultra-precision machining method. Then, a substrate is provided. The substrate has a second surface having a third alignment mark formed thereon using the lithography method. The substrate is first aligned with the mold core by aligning the third alignment mark with the first alignment mark, then is further aligned by offsetting the substrate the spacing between the first and second alignment marks to align the center of the substrate with the center of the lens molding surface array. Finally, a molding material is applied on the substrate, then the mold core is applied on the molding material to press mold the lens array. | 12-02-2010 |
20100327423 | SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device. | 12-30-2010 |
20110049536 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips. | 03-03-2011 |
20110074056 | METHOD FOR MANUFACTURING SPHERICAL FRESNEL LENS - Manufacturing spherical Fresnel lens includes providing a first optical element with a regular hexagonal first Fresnel micro-lens in the center of the first optical element and six regular hexagonal second Fresnel micro-lens arrayed around the first Fresnel micro-lens. One edge of the second Fresnel micro-lens is connected to one edge of the first Fresnel micro-lens. The first optical element is stressed to yield a spherical cap configuration of the first optical element, and a second optical element is provided matched to the first optical element, and including a plurality of Fresnel micro-lens. The second optical element is bent into a curve shaped configuration having a curvature as the bent first optical element, and a number of bent second optical elements are assembled around the bent first optical element in sequence to form a hemispherical-shaped configuration. | 03-31-2011 |
20110128623 | POLARIZER AND FABRICATION METHOD THEREOF - A method for manufacturing a polarizer utilizes a support, which is coated with a photoresist. A carbon nanotube film is located over the photoresist, and one portion of the carbon nanotube film is submerged in the photoresist. Metal or semi-metallic particles are deposited over the carbon nanotube film and the photoresist, which is removed. The carbon nanotube film with the metal particles or semi-metallic particles is adhered to a substrate to obtain the polarizer. | 06-02-2011 |
20110132430 | SOLAR ENERGY CONVERSION DEVICE AND MODULE - An exemplary solar energy conversion device includes a substrate, a solar energy conversion chip, and a carbon nanotube layer. The substrate defines a through hole. The solar energy conversion chip is positioned on the substrate and covers the through hole. The solar energy conversion chip includes a light incident surface facing away from the substrate and a heat dissipating surface at an opposite side thereof to the light incident surface. The carbon nanotube layer is formed on the heat dissipating surface. | 06-09-2011 |
20110135256 | OPTICAL FIBER CONNECTOR - An optical fiber connector includes a housing, a plurality of lenses fixed to the housing, a plurality of optical fibers, and a glue. The housing defines a plurality of blind holes and receiving cavities. Each blind hole includes a first receiving hole portion. Each receiving cavity is in communication with the corresponding first receiving hole portion. Each optical fiber is received in the corresponding blind hole and includes a core portion. The glue is applied in each receiving cavity and fixes the optical fibers in the housing. Along a lengthwise direction of each blind hole, a projection of each receiving cavity on a plane perpendicular to the lengthwise direction covers that of the core portion. The glue surrounds the core portion, and a distal end of the core portion contacts an inner surface of the housing in the corresponding receiving cavity facing the respective blind hole. | 06-09-2011 |
20110305041 | LIGHT GUIDE PLATE STRUCTURE AND BACKLIGHT MODULE USING SAME - A guide light plate structure includes a light guide plate and a fluorescent layer. The light guide plate includes a light incident surface, a bottom surface, and a light emitting surface opposite to the bottom surface. The fluorescent layer is formed on the bottom surface. The fluorescent layer is conFIGUREd for being excited by the incident light to emit white light toward the light emitting surface. | 12-15-2011 |
20120040036 | FILM PRODUCING SYSTEM - A film producing system for producing optical film includes a glue dispenser, a conveyor including a flexible base, a compression molding device, and a light curing device. The glue dispenser is configured for receiving glue therein and dispensing the glue onto the flexible base. The flexible base is configured for carrying the glue dispensed thereon from the glue dispenser to the compression molding device. The compression molding apparatus configured for press molding the glue dispensed on the flexible base to a predetermined shape. The flexible base is configured for carrying the shaped glue from the compression molding device to the light curing device. The light curing device is configured for curing the glue shaped by the compression molding device. The compression molding device includes a rotating pressing roller and a fixed pressing blocking configured for shaping the glue on the flexible base to the predetermined shape. | 02-16-2012 |
20120083057 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing a light emitting diode package, includes: providing a light emitting chip structure comprising a substrate and a light emitting layer; treating the light emitting layer to form at least two spaced light emitting chips on the substrate, the light emitting chips each comprising a first surface away from the substrate and a second surface; forming a first carbon nanotube layer covering the first surfaces of the at least two spaced light emitting chips; removing the substrate; forming a second carbon nanotube layer on the second surfaces of the light emitting chips, thus obtaining a first carbon nanotube layer and a second carbon nanotube layer on opposite sides of the at least two spaced light emitting chips; and packaging the light emitting chip structure to obtain the light emitting diode package. | 04-05-2012 |
20120140329 | LIGHT GUIDE BODY WITH INTEGRAL STRUCTURE AND METHOD FOR MAKING SAME - A light guide body includes a first solidified colloid layer, a second solidified colloid layer and a third solidified colloid layer. The first solidified colloid layer has a number of light-scattering microstructures at an upper portion thereof. The second solidified colloid layer is formed on and coming into contact with the upper portion of the first colloid layer, and the second colloid layer covers the microstructures. The third solidified colloid layer is formed on the second colloid layer, and the third colloid layer has a plurality of light condensing prisms at an opposite side thereof to the second colloid layer. The light guide body has an integral structure with a number of optical functions. A method for making the light guide body is also provided. | 06-07-2012 |
20120218642 | LENS ASSEMBLY AND LENS ASSEMBLY ARRAY - A first lens having a first bottom surface and a first top surface at opposite sides thereof; and a first supporter having a first supporting surface and a second supporting surface at opposite sides thereof, the first supporting surface being flat, the second supporting surface being in contact with the first bottom surface, the first supporter being made of transparent material, and a refraction index of the first supporter being different from a refraction index of the first lens. A lens assembly array and method of making the lens assembly array are also provided. | 08-30-2012 |
20120231585 | METHOD FOR PACKAGING A SEMICONDUCTOR STRUCTURE - The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device. | 09-13-2012 |
20130100657 | PLANAR ILLUMINATING DEVICE - A planar illuminating device includes a number of light sources and an optical sheet positioned at a side of the light sources. The optical sheet includes an incident surface facing the light sources and an emergent surface opposite to the incident surface. The incident surface includes a number of protruding prism structures. The emergent surface includes a number of concave diffusing micro-structures. | 04-25-2013 |