Patent application number | Description | Published |
20090040741 | METHOD FOR TRANSMITTING MOVING IMAGE DATA AND COMMUNICATION APPARATUS - A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit. | 02-12-2009 |
20100032195 | PRINTED WIRING BOARD - Provided is a multilayer printed wiring board in which multiple via holes that connect a first power supply wiring with a second power supply wiring are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being concentrated on the via hole connected to a farthest end of the power supply wiring among the via holes, a narrow portion between the via hole and the via hole is narrowed to increase a resistance. A narrow portion that is narrowed is disposed similarly at a farthest end of the power supply wiring of the second conductor layer. | 02-11-2010 |
20100039784 | PRINTED CIRCUIT BOARD - A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas. | 02-18-2010 |
20100128451 | MULTILAYERED PRINTED CIRCUIT BOARD - A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit. | 05-27-2010 |
20120147580 | PRINTED CIRCUIT BOARD - A power source terminal and a ground terminal for a semiconductor integrated circuit are connected to a conductor pattern through a capacitor. The conductor pattern is connected, through a filter, to a plane conductor connected to neither a ground plane nor a power source plane. Thus, a common mode noise arising from between the power source and the ground is caused to flow into the plane conductor. This reduces the common mode noise flowing in the ground and the power source of the printed wiring board, which relatively act as antennas. | 06-14-2012 |
20130161084 | NOISE FILTER AND TRANSMISSION APPARATUS - In a printed wiring board including a first wiring layer and a second wiring layer provided via an insulator layer, at least three guard ground wirings extending along a pair of signal wirings provided in the first wiring layer and supplied with a ground potential are provided between the pair of signal wirings. Thus, crosstalk noise can be reduced without widening a wiring area between the pair of signal wirings. | 06-27-2013 |
20130279134 | PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD - First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings. | 10-24-2013 |
20140305688 | PRINTED WIRING BOARD AND PRINTED CIRCUIT BOARD - A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor. | 10-16-2014 |
Patent application number | Description | Published |
20090171563 | Navigation devices, methods and programs - Navigation devices, methods, and programs acquire a reference position, find an on-street parking zone that is in the vicinity of the reference position, and find a route to a road having the on-street parking zone. The navigation devices, methods, and programs find a route from the reference position to the road having the on-street parking zone. | 07-02-2009 |
20090171566 | Navigation devices, methods and programs - Navigation devices, methods, and programs set a destination, find an on-street parking zone that is in the vicinity of the destination, and find a route, by modifying a search cost for a road, that will arrive at the destination by way of a road having the on-street parking zone. The devices, methods, and programs acquire parking information that pertains to the on-street parking zone and find the route by modifying the search cost based on the parking information. The devices, methods, and programs find the route when the vehicle has reached a specified distance from the destination. | 07-02-2009 |
20090171567 | Navigation devices, methods and programs - Navigation devices, methods, and programs set a destination, find an on-street parking zone that is in the vicinity of the destination, and acquire parking information that pertains to the on-street parking zone. The devices, methods, and programs set a guidance route, based on the parking information, that leads to the destination by way of a road having the on-street parking zone and provide guidance, based on the parking information, to the on-street parking zone that is located on the guidance route. | 07-02-2009 |
Patent application number | Description | Published |
20110260503 | POLYGONAL CROSS-SECTIONAL FRAME, AND REAR VEHICLE BODY STRUCTURE - A polygonal cross-sectional frame has an L closed cross-sectional shape such that the frame has an inwardly recessed section. A rear vehicle body structure includes a depressing member provided, along the lower surface of a rear frame extending rearward from a floor of a passenger compartment, in opposed relation to a predetermined vehicle-body-mounted component part disposed beneath the depressing member. As a rear section of the rear frame deforms due to a load input to the rear end of the rear frame, the depressing member deforms downward to depress and displace the predetermined vehicle-body-mounted component part. | 10-27-2011 |
20120187719 | VEHICLE FRONT PORTION STRUCTURE - Left and right front side frames are disposed on left and right side of vehicle front portion, respectively, and extend in a front-and-rear direction of the vehicle body. The left and right front side frames each include a lower branching frame having an inclined part inclined downward from a front part of a motor room toward a vehicle floor, and an upper branching frame branching from the lower branching frame, disposed above the inclined part of the lower branching frame, and including a bent part. The upper branching frame is supported by a plurality of support columns connected to frames disposed around the motor room. | 07-26-2012 |
20140070567 | POLYGONAL CROSS-SECTIONAL FRAME, AND REAR VEHICLE BODY STRUCTURE - A polygonal cross-sectional frame has an L closed cross-sectional shape such that the frame has an inwardly recessed section. A rear vehicle body structure includes a depressing member provided, along the lower surface of a rear frame extending rearward from a floor of a passenger compartment, in opposed relation to a predetermined vehicle-body-mounted component part disposed beneath the depressing member. As a rear section of the rear frame deforms due to a load input to the rear end of the rear frame, the depressing member deforms downward to depress and displace the predetermined vehicle-body-mounted component part. | 03-13-2014 |