Patent application number | Description | Published |
20100119300 | OUTER JOINT MEMBER FOR CONSTANT VELOCITY UNIVERSAL JOINT - Provided is an outer joint member for a constant velocity universal joint, which can be manufactured at low cost. The outer joint member includes a cup member ( | 05-13-2010 |
20100130294 | METHOD OF FIXING BOOT - A method for fixing a boot includes mounting a tubular anchoring areas ( | 05-27-2010 |
20100295256 | INSTALLATION STRUCTURE FOR BOOT FOR CONSTANT VELOCITY UNIVERSAL JOINT AND METHOD OF MANUFACTURING CONSTANT VELOCITY UNIVERSAL JOINT - Provided is a mounting structure for a boot for a constant velocity universal joint, which is capable of ensuring a stable sealing performance at low cost. The resin boot ( | 11-25-2010 |
20140291301 | WELDING METHOD FOR OUTER JOINT MEMBER OF CONSTANT VELOCITY UNIVERSAL JOINT, AND OUTER JOINT MEMBER - A welding method for an outer joint member of a constant velocity universal joint includes constructing a cup section having track grooves, which engage with torque transmitting elements, formed along an inner periphery thereof and a shaft section that is formed on a bottom portion of the cup section by two or more separate members, joining a cup member forming the cup section and a shaft member forming the shaft section, and melt-welding end portions of the cup member and the shaft member. The cup member and the shaft member are shaped so that a sealed hollow cavity portion is formed when the end portions of the cup member and the shaft member are brought into abutment against each other, the melt-welding of the end portions being performed when the sealed hollow cavity portion is under atmospheric pressure or lower. | 10-02-2014 |
Patent application number | Description | Published |
20100149816 | LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT - In a light emitting module, an electrode receiving the supply of current for light emission is provided on the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like material mounted on the light emitting surface and emits light after converting a wavelength of the light emitted by the light emitting element. The light wavelength conversion member has a notch such that at least a part of the electrode communicates with the external space in a manner perpendicular to the light emitting surface of the semiconductor device when the light wavelength conversion member is mounted on the light emitting surface. | 06-17-2010 |
20100177527 | LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT - In a light emitting module board, an electrode receiving the supply of current for light emission is provided in the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like member mounted on the light emitting surface, and emits light after converting the wavelength of the light emitted by the semiconductor light emitting device. A relay electrode is provided in the surface of the light wavelength conversion member. The relay electrode extends from a position in contact with the electrode to an exposed position in the external space in a state where the light wavelength conversion member is mounted on the light emitting surface. The relay electrode is provided so that the upper part of the relay electrode, which is the exposed position, extends to a position located opposite to the lower part of the relay electrode which is the contacted position. | 07-15-2010 |
20110080092 | VEHICLE HEADLAMP - A vehicle headlamp includes: a light-emitting module; a control circuit section for controlling a lighting of the light-emitting module; and a reflector including a reflecting face configured to reflect and collect light emitted from the light-emitting module. The control circuit section includes an opposing portion that is opposed to the reflecting face. The opposing portion is disposed at a position away from an optical path of light to be collected by the reflector. | 04-07-2011 |
20120155101 | LIGHT-EMITTING APPARATUS AND AUTOMOTIVE HEADLAMPS - A light-emitting apparatus is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a heat-radiating substrate configured to support the light-emitting module and the control circuit unit in such a manner as to recover the heat produced by the light-emitting module and the control circuit unit; and a connection support unit mounted on the heat-radiating substrate in such a state as to support an electrically conductive member by which to electrically connect the light-emitting module and the control circuit unit. | 06-21-2012 |
20120163008 | AUTOMOTIVE HEADLAMPS - An automotive headlamp is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a support substrate configured to support both the light-emitting module and the control circuit unit; and a reflector configured to reflect, through an inner surface of the reflector, light emitted by the light-emitting module and collect the reflected light. The support substrate is arranged in a manner such that the control circuit unit is positioned in a region outside the reflector. | 06-28-2012 |
20120294026 | VEHICLE HEADLAMP - A vehicle headlamp includes: a light-emitting module; a control circuit section for controlling a lighting of the light-emitting module; and a reflector including a reflecting face configured to reflect and collect light emitted from the light-emitting module. The control circuit section includes an opposing portion that is opposed to the reflecting face. The opposing portion is disposed at a position away from an optical path of light to be collected by the reflector. | 11-22-2012 |
20130099261 | LIGHT EMITTING MODULE - In a light emitting module, a semiconductor light emitting element is mounted on a mounting board. A plated layer is provided on the surface of the mounting board so as to be electrically connected to the semiconductor light emitting element mounted on the mounting board. The plated layer has a power feeding portion and an element connection portion. The power feeding portion extends, of the surfaces of the mounting board, from the upper surface on which the semiconductor light emitting element is to be mounted to a stepped surface located below the upper surface, so that power can be fed, on the stepped surface, to the semiconductor light emitting element. The element connection portions are provided on the upper surface such that a plurality of the semiconductor light emitting elements mounted on the upper surface are connected together in series. | 04-25-2013 |
20130201706 | CIRCUIT MODULE, LIGHT EMITTING MODULE, AND AUTOMOTIVE LAMP - A circuit module includes: a lighting control circuit that controls lighting of a semiconductor light emitting element; a first heat radiating member on which the lighting control circuit is mounted; a second heat radiating member that is separated from the first heat radiating member and has a surface on which the semiconductor light emitting element is mounted; and a connecting mechanism having both a housing that connects the first heat radiating member and the second heat radiating member together and a conductive portion that transmits a signal from the lighting control circuit to the semiconductor light emitting element. The housing is formed of a material having a coefficient of thermal conductivity lower than those of the first heat radiating member and the second heat radiating member. | 08-08-2013 |
20130201707 | CIRCUIT MODULE, LIGHT EMITTING MODULE, AND AUTOMOTIVE LAMP - In a circuit module, a supporting member has both an element mounting surface on which a package can be mounted and a circuit mounting surface on which a lighting control circuit that controls lighting of a semiconductor light emitting element can be mounted. The lighting control circuit is mounted on the circuit mounting surface. The circuit mounting surface is formed so as to be orthogonalized or inclined with respect to the element mounting surface. Thereby, the length in the longitudinal direction of the circuit module can be made smaller in comparison with that of a circuit module in which a circuit mounting surface and an element mounting surface are formed on the same plane. | 08-08-2013 |