Shuo-Hung
Shuo-Hung Chang, Taipei TW
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20090169464 | Method for producing carbon nanocoils - The present invention discloses a method for producing carbon nanocoils, which comprises: providing a metal substrate; depositing a tin precursor on the substrate; heating the substrate with the precursor to a predetermined temperature to form a catalyst on the substrate; placing the substrate in a quartz tube furnace; and introducing carbon source gas and protective gas into the quartz tube furnace to allow carbon nanocoils to grow on the surface of the catalyst. Another method for producing carbon nanocoils is also disclosed, which includes: depositing a mixed solution of iron acetate and tin acetate on a substrate; heating the substrate with the mixing solution to a predetermined temperature to form a catalyst on the substrate; placing the substrate in a quartz tube furnace; and introducing carbon source gas and protective gas into the quartz tube furnace to allow carbon nanocoils to grow on the surface of the catalyst. | 07-02-2009 |
20110064873 | METHOD FOR PRODUCING CARBON NANOCOILS - The present invention discloses a method for producing carbon nanocoils, which comprises: providing a metal substrate; depositing a tin precursor on the substrate; heating the substrate with the precursor to a predetermined temperature to form a catalyst on the substrate; placing the substrate in a quartz tube furnace; and introducing carbon source gas and protective gas into the quartz tube furnace to allow carbon nanocoils to grow on the surface of the catalyst. Another method for producing carbon nanocoils is also disclosed, which includes: depositing a mixed solution of iron acetate and tin acetate on a substrate; heating the substrate with the mixing solution to a predetermined temperature to form a catalyst on the substrate; placing the substrate in a quartz tube furnace; and introducing carbon source gas and protective gas into the quartz tube furnace to allow carbon nanocoils to grow on the surface of the catalyst. | 03-17-2011 |
20110068283 | ELECTROMAGNETIC WAVE ABSORPTION COMPONENT AND DEVICE - The invention provides electromagnetic wave absorption components and device. The electromagnetic wave absorption component includes an electromagnetic shield constituted by at least one material selected from the group consisting of a carbon nanocoil and a carbon fiber, and a solidified layer formed of a mixture of a solidifiable material and the electromagnetic shield after solidification. Another embodiment of the electromagnetic wave absorption component includes an electromagnetic shield constituted by at least one material selected from the group consisting of a carbon nanocoil and a carbon fiber, and a solidified layer, formed by solidifying a solidifiable material, applicable to encapsulating the electromagnetic shield. Further, the electromagnetic wave absorption device is formed by stacking at least two of the above-mentioned electromagnetic wave absorption components. | 03-24-2011 |
Shuo-Hung Chang, Taipei City TW
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20130075386 | NANOTUBE HEATING DEVICE COMPRISING CARBON NANOTUBE AND MANUFACTURING METHOD THEREOF - An embodiment of the present disclosure relates to a heating device comprising a carbon nanotube, which comprises a carbon nanotube layer containing aligned carbon nanotube carpet, a first electrode and a second electrode having a predetermined distance between each other and electrically connected to the carbon nanotube layer respectively, wherein a current produced by applying a voltage to the first electrode passes laterally via the diameter direction of the aligned carbon nanotubes from the first electrode to the second electrode. The present disclosure also includes methods for manufacturing the aligned carbon nanotube carpet. | 03-28-2013 |
Shuo-Hung Chang, Taichung City TW
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20130168214 | THIN PROFILE KEYBOARD - A thin profile keyboard is provided with a monoblock having a plurality of rectangular openings arranged in rows, and a plurality of bottom grooves; a plurality of keys each including a rectangular frame movably disposed in the opening of the monoblock, and two lever arms extending from both ends of a forward edge of frame, each lever arm filled in the bottom groove; a printed circuit board (PCB) disposed below the keys and the monoblock; and a base disposed below the PCB. The base, the monoblock, and the PCB are assembled. | 07-04-2013 |
Shuo-Hung Chen, Taipei 11492 TW
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20140340353 | LIGHT-EMITTING TOUCH-SWITCH DEVICE AND LIGHT-EMITTING TOUCH-SWITCH MODULE - A light-emitting touch-switch device includes a first circuit board, a cap unit and a light-emitting element. The first circuit board is electrically coupled to a sensing chip. The cap unit is disposed on the first circuit board and that is at least partially made of an electrically conductive plastic material having a resistance of equal to or smaller than 1×10 | 11-20-2014 |
Shuo-Hung Chen, Taipei TW
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20150306799 | HOUSING OF AN LED DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a housing of an LED display device includes the steps of: (a) filling a first material into a first mold assembly at a first place to form a cover with a plurality of first display holes, followed by moving the cover to a second place, filling a second material into a second mold assembly and the cover to seal one of the plurality of the first display holes via a plurality of first transparent members; and (b) disposing an ink layer on a display side of the cover in such a manner that the ink layer covers the display side of the cover and that the first transparent member in each of the first display holes is exposed from the ink layer. | 10-29-2015 |
Shuo-Hung Hsu, Hsinchu City TW
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20110241789 | INTEGRATED CIRCUIT CAPABLE OF REPEATEDLY USING CURRENT - The invention relates to an integrated circuit capable of repeatedly using current, the integrated circuit comprises: a first differential input, a first cross couple pair, a second differential input, a second cross couple pair, and a voltage-controlled oscillator, wherein a divider consists of the first differential input, the first cross couple pair, the second differential input, and the second cross couple pair, moreover, through the connection of the first differential input, the first cross couple pair, the second differential input, and the second cross couple pair, the divider and the voltage-controlled oscillator may be drove by only one single current, so that the circuit area, the power consumption, and the phase noise of the integrated circuit are simultaneously reduced. | 10-06-2011 |
20110309371 | SCHOTTKY DIODE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A Schottky diode structure and a method for fabricating the same, which are based on the principle of charge compensation, wherein a P-type gallium nitride layer is added to a Schottky diode structure, and wherein the PN junction of the P-type gallium nitride layer and the N-type gallium nitride layer decreases the non-uniformity of the surface electric field distribution, whereby the breakdown voltage of the element is raised. | 12-22-2011 |
20150099363 | Method of Fabricating III-Nitride Based Semiconductor on Partial Isolated Silicon Substrate - A semiconductor is fabricated on a silicon (Si) substrate. The semiconductor is III-nitride based. The Si substrate is partially isolated. Etching is directly processed from top on a chip for solving wire-width problem. The Si substrate does not need to be made thin. The chip can be large scaled and be prevented from bowing. Thus, the present invention simplifies producing procedure and reduces production cost. Besides, for a large-scaled chip, the breakdown voltage is enhanced; and, without making the Si substrate thin, the on-state current is remained the same and the heat problem is weakened. | 04-09-2015 |