Swaringen
Jess Ethan Swaringen, Oak Bluffs, MA US
Patent application number | Description | Published |
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20140259799 | ORTHOTIC DEVICE - An orthotic device is disclosed having a frame system, a first actuator, and a second actuator. The frame system may include a lightweight supportive material, and may be configured to receive a user's foot. The first actuator may be coupled to the frame system, and may be configured to activate and develop push of the forefoot of the user's foot during a walking step. The second actuator may be coupled to the frame system, and may be configured to activate and raise a user's toes. | 09-18-2014 |
Roy Swaringen, Durham, NC US
Patent application number | Description | Published |
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20100179337 | PREPARATION OF BILE ACIDS AND INTERMEDIATES THEREOF - Synthetic methods for preparing deoxycholic acid and intermediates thereof are provided. | 07-15-2010 |
20110313191 | Preparation of Pharmaceutical Salts of 3-0-(3',3'-Dimethylsuccinyl) Betulinic Acid - This invention relates to a novel process for making 3-O-(3′,3′-dimethylsuccinyl)betulinic acid (“DSB”). This invention also relates to methods of treating HIV and related diseases using pharmaceutical compositions comprising salt forms of DSB prepared according to the process of the present invention. The invention further relates to dosage forms of pharmaceutical compositions comprising salts of DSB made using the process of this invention. | 12-22-2011 |
Stephen N. Swaringen, Rockwall, TX US
Patent application number | Description | Published |
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20090011614 | RECONFIGURABLE SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS - Methods and systems selectively irradiate structures on or within a semiconductor wafer using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links. The structures are arranged in rows and may be processed in either an on-axis mode or a cross-axis mode. In the on-axis mode, the beam spots fall on structures in the same row as they move along the row. In the cross-axis mode, the beam spots fall on structures in different rows as they move along the rows. | 01-08-2009 |
20110186555 | SYSTEM FOR SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS - Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row. | 08-04-2011 |
Stephen Neal Swaringen, Rockwall, TX US
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20080221817 | METHOD FOR DETECTING PARTICULATE CONTAMINATION UNDER A WORKPIECE - A method for detecting particulate contamination under a workpiece fixtured by a calibrated material handling system includes performing 3D measurements of a workpiece at multiple of positions to construct a 3D map of the workpiece, calibrating the 3D map by comparing a pre-computed calibration map to the 3D measurements, and detecting particulate contamination by processing the calibrated map. | 09-11-2008 |
Steve Swaringen, Rockwall, TX US
Patent application number | Description | Published |
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20090242531 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece. | 10-01-2009 |
20090245302 | METHODS AND SYSTEMS FOR DYNAMICALLY GENERATING TAILORED LASER PULSES - Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison. | 10-01-2009 |
20110272388 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece. | 11-10-2011 |