Aanegola
Srinath Aanegola, Broadview Heights, OH US
Patent application number | Description | Published |
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20090167151 | Lighting device having illumination, backlighting and display applications - Provided are a lighting device, a backlighting device, and a display device that comprise a radiation source such as LED and wavelength converting members comprising phosphors. In one embodiment, self-absorption within the devices is suppressed or reduced by placing a selective reflector between two wavelength converting members, and the wavelength converting member emitting light with longer peak wavelength is substantially isolated from the irradiation of another wavelength converting member emitting light with shorter peak wavelength. In other embodiments, the wavelength converting members are arranged in strip configuration; or in adjacent hexagons configuration. | 07-02-2009 |
20100177513 | HYBRID ILLUMINATION SYSTEM WITH IMPROVED COLOR QUALITY - A white light hybrid illumination system including an amber LED, a red LED, and a phosphor converted LED such as a blue LED chip and a green phosphor, wherein a peak emission difference between the amber and red LED is at least 25 nm. This system provides higher color quality than prior devices due to its high luminous efficacy, high CRI over a wide CCT range, and better color control. | 07-15-2010 |
Srinath K. Aanegola, Parma Heights, OH US
Patent application number | Description | Published |
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20110001422 | LIGHT EMITTING DIODE COMPONENT - In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board. | 01-06-2011 |
20110018014 | LIGHT EMITTING DIODE COMPONENT - In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board. | 01-27-2011 |
20140328046 | LIGHT EMITTING DIODE COMPONENT - In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board. | 11-06-2014 |
Srinath K. Aanegola, Broadview Heights, OH US
Patent application number | Description | Published |
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20080266858 | ILLUMINATED SIGNAGE EMPLOYING LIGHT-EMITTING DIODES - An illuminated sign ( | 10-30-2008 |
20080296607 | ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME - An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly. | 12-04-2008 |
20090147513 | BACKLIGHTING LED POWER DEVICES - A generally planar illumination, display, or backlighting device is disclosed, including a generally planar arrangement of side emitting light emitting diode (LED) devices generating side emitted illumination, and a generally planar arrangement of wavelength conversion elements arranged coplanar with the generally planar arrangement of side emitting light emitting diode (LED) devices. The wavelength conversion elements are interspersed amongst the side emitting LED devices and configured to wavelength convert the side emitted illumination generated by the side emitting LED devices. A display device using such a generally planar illumination device is also disclosed, in which a liquid crystal display (LCD) panel is backlit by the generally planar illumination device. | 06-11-2009 |
20120176770 | LED-BASED LIGHT BULB - A light source ( | 07-12-2012 |
20120176804 | LED-BASED LIGHT BULB - A light source ( | 07-12-2012 |
20120230012 | LED-BASED LIGHT BULB - A light source ( | 09-13-2012 |
20140049965 | LIGHT EMITTING DIODE COMPONENT - In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board. | 02-20-2014 |