Patent application number | Description | Published |
20090161905 | SPEAKER AND MAGNETIC CIRCUIT - A high performance speaker is provided and includes a simple structure magnetic circuit achieved without the need of a complicated manufacturing process, and a high performance speaker is provided and includes a simple structure diaphragm achieved without the need of a difficult process for forming a U shape of a narrow width in the diaphragm. A speaker | 06-25-2009 |
20110051988 | SPEAKER DEVICE - A speaker device includes a pair of diaphragms disposed opposite each other, a frame configured to vibratably support an outer periphery of the diaphragms in the vibration direction, and a plurality of driving parts configured to support a rear surface of each of the diaphragms and vibrate the diaphragms in response to an audio signal. The driving parts include a pair of magnetic circuits in which a magnetic gap is formed in a direction different from the vibration direction of the diaphragms, a pair of voice coils vibratably arranged in the magnetic gap in one axis direction, vibrating so as to move toward or away from each other in response to the audio signal, and a rigid vibration direction converter part configured to convert the direction of the vibration of the voice coils and transmit the vibration to the diaphragms. | 03-03-2011 |
20110232990 | VIBRATING BODY FOR SPEAKER AND SPEAKER DEVICE - A speaker vibrating body vibrated by a driving part includes a plurality of diaphragms vibratably supported by a static part supporting said driving part and a diaphragm connecting part, provided between a first diaphragm and a second diaphragm among said plurality of diaphragms, coupling said first diaphragm and said second diaphragm and synchronously moving said first diaphragm and said second diaphragm toward or away from each other. | 09-29-2011 |
Patent application number | Description | Published |
20100154707 | PROCESS CHAMBER CLEANING METHOD IN SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD - In a substrate processing apparatus configured to perform a predetermined process on a target substrate accommodated in a process chamber, the process chamber is cleaned by alternately performing an operation of generating plasma of a gas containing oxygen within the process chamber, and an operation of generating plasma of a gas containing nitrogen within the process chamber. | 06-24-2010 |
20100168889 | SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT METHOD AND STORAGE MEDIUM - A substrate treatment apparatus eliminates breakage of a wafer W due to having the wafer supported by a supporting member when heat treatment is performed on the wafer W a plurality of times by a heat treatment module. The substrate processing apparatus includes a recipe setting unit for setting process conditions for a process recipe for the semiconductor wafer W and a direction of the semiconductor wafer W, by associating the conditions and the direction with each other. Through the recipe setting unit, the direction of the semiconductor wafer W can be set, and the semiconductor wafer W can be arranged in a direction set by an alignment module. Thus, portions R to be supported by the supporting members | 07-01-2010 |
20100180918 | CLEANING METHOD - In a process chamber of a substrate processing apparatus, such as an RTP apparatus, a carrier is placed and configured to carry out a contaminant that has been attached to it. In this state, a cleaning gas containing N | 07-22-2010 |
Patent application number | Description | Published |
20090046211 | IMAGE DISPLAY DEVICE AND CONTROL METHOD THEREOF - An object of the invention is to provide an image display device and a control method thereof which can reduce an image retrieving time and suppress an amount of data to be transmitted for retrieval. | 02-19-2009 |
20140099767 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - An insulating film and another insulating film are formed over a semiconductor substrate in that order to cover first, second, and third gate electrodes. The another insulating film is etched back to form sidewall spacers over side surfaces of the insulating film. Then, the sidewall spacers over the side surfaces of the insulating films corresponding to the sidewalls of the first and second gate electrodes are removed to leave the sidewall spacers over the side surfaces of the insulating film corresponding to the sidewalls of the third gate electrode. Then, the sidewall spacers and the insulating films are etched back, so that the sidewall spacers are formed of the insulating film over the sidewalls of the first, second, and third gate electrodes. | 04-10-2014 |
20150087128 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE THAT INCLUDES A MISFET - An insulating film and another insulating film are formed over a semiconductor substrate in that order to cover first, second, and third gate electrodes. The another insulating film is etched back to form sidewall spacers over side surfaces of the insulating film. Then, the sidewall spacers over the side surfaces of the insulating films corresponding to the sidewalls of the first and second gate electrodes are removed to leave the sidewall spacers over the side surfaces of the insulating film corresponding to the sidewalls of the third gate electrode. Then, the sidewall spacers and the insulating films are etched back, so that the sidewall spacers are formed of the insulating film over the sidewalls of the first, second, and third gate electrodes. | 03-26-2015 |
20150194460 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing procedure of a semiconductor device is simplified. In a manufacturing method of a semiconductor device, in each of regions AR with pixels for detecting different colored lights, a liner film LF | 07-09-2015 |